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Chinese Academy of Sciences Institutional Repositories Grid
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CAS IR Grid
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合肥物质科学研究院 [3]
寒区旱区环境与工程研... [2]
上海微系统与信息技术... [2]
地理科学与资源研究所 [1]
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期刊论文 [9]
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2022 [2]
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2011 [2]
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Strain effects on the behavior of intrinsic point defects within the GaN/AlN interface
期刊论文
OAI收割
INTERNATIONAL JOURNAL OF MODERN PHYSICS C, 2022
作者:
Yang, Yuming
;
Zhang, Xuemei
;
Liu, Jun
;
Zhang, Chuanguo
;
Li, Yonggang
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Model Estimates of China's Terrestrial Water Storage Variation Due To Reservoir Operation
期刊论文
OAI收割
WATER RESOURCES RESEARCH, 2022, 卷号: 58, 期号: 6, 页码: 23
作者:
Dong, Ningpeng
;
Wei, Jianhui
;
Yang, Mingxiang
;
Yan, Denghua
;
Yang, Chuanguo
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Three-dimensional distribution of permafrost and responses to increasing air temperatures in the head waters of the Yellow River in High Asia
期刊论文
iSwitch采集
SCIENCE OF THE TOTAL ENVIRONMENT, 2019, 卷号: 666, 页码: 321-336
作者:
Sun, Aili
;
Zhou, Jian
;
Yu, Zhongbo
;
Jin, Huijun
;
Sheng, Yu
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The stability of graphene-based Mobius strip with vacancy and at high-temperature
期刊论文
OAI收割
INTERNATIONAL JOURNAL OF MODERN PHYSICS B, 2018, 卷号: 32, 期号: 31, 页码: 9
作者:
Yang, Kaishuai
;
Zhang, Chuanguo
;
Zheng, Xiaohong
;
Wang, Xianlong
;
Zeng, Zhi
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Trends in evapotranspiration and their responses to climate change and vegetation greening over the upper reaches of the Yellow River Basin
期刊论文
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AGRICULTURAL AND FOREST METEOROLOGY, 2018, 卷号: 263, 页码: 118-129
作者:
Xu, Shiqin
;
Yu, Zhongbo
;
Yang, Chuanguo
;
Ji, Xibin
;
Zhang, Ke
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Schottky defects induced effects on the behaviors of high velocity shock compression of MgO
期刊论文
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RSC ADVANCES, 2017, 卷号: 7, 期号: 72, 页码: 45304-45310
作者:
Zhang, Chuanguo
;
Wang, Xianlong
;
Zhang, Jie
;
Yang, Kaishuai
;
Cheng, Ya
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Effects of Calcination Temperature on Properties of 0.5%Al-3%In-TiO2 Photocatalyst Prepared using Sol-gel Method
期刊论文
OAI收割
JOURNAL OF ADVANCED OXIDATION TECHNOLOGIES, 2016, 卷号: 19, 期号: 1, 页码: 119-124
作者:
He, Hongbo
;
Zhang, Wenjie
;
Li, Chuanguo
;
Ma, Zheng
;
Yang, Lili
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Design, fabrication of through silicon vias based on suspended photoresist thin film and its application in silicon interposer
期刊论文
OAI收割
ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging.ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging, 2011, 期号: 0, 页码: 400-403
Wu, Ziyang
;
Dou, Chuanguo
;
Wu, Yanhong
;
Yang, H
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Application of silicon stress sensor in flip chip packaging system
期刊论文
OAI收割
ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging.ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging, 2011, 期号: 0, 页码: 932-936
Jiang, Chengjie
;
Xiao, Fei
;
Yang, H
;
Dou, Chuanguo
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