机构

• 西安光学精密机械研... [21]
• 昆明植物研究所 [1]
• 高能物理研究所 [1]
• 沈阳自动化研究所 [1]

采集方式

• OAI收割 [24]

内容类型

• 会议论文 [14]
• 期刊论文 [10]

发表日期

• 2018 [2]
• 2016 [6]
• 2015 [5]
• 2014 [1]
• 2013 [1]
• 2012 [6]
• 更多

学科主题

• semiconduc... [3]
• computer a... [2]
• lasers, ge... [2]
• light/opti... [2]
• numerical ... [2]
• physics, a... [2]
• 更多

筛选

浏览/检索结果: 共24条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择题名升序题名降序提交时间升序提交时间降序作者升序作者降序发表日期升序发表日期降序 Thermomechanical Behavior of Conduction-Cooled High-Power Diode Laser Arrays 期刊论文  OAI收割 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 期号: 5, 页码: 818-829 作者:  Nie, Zhiqiang;  Lu, Yao;  Chen, Tianqi;  Zhang, Pu;  Wu, Dihai   |  收藏  |  浏览/下载：91/0  |  提交时间：2018/05/31 Component Architectures  Semiconductor Device Packaging   Rabdocoestin B exhibits antitumor activity by inducing G2/M phase arrest and apoptosis in esophageal squamous cell carcinoma 期刊论文  OAI收割 CANCER CHEMOTHERAPY AND PHARMACOLOGY, 2018, 卷号: 81, 期号: 3, 页码: 469-481 作者:  Wang, Jingnan;  Zhang, Zhirong;  Che, Yun;  Yuan, Zuyang   |  收藏  |  浏览/下载：49/0  |  提交时间：2018/05/08 Rabdocoestin b  G2/m Phase Arrest  Apoptosis  Cytotoxicity  Esophageal Squamous Cell Carcinoma   Thermally accelerated ageing test of 808nm high power diode laser arrays in CW mode 会议论文  OAI收割 17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16 作者:  Nie, Zhiqiang;  Wu, Di;  Lu, Yao;  Wu, Dhai;  Wang, Shuna 收藏  |  浏览/下载：93/0  |  提交时间：2016/11/22 Chip scale packages  Defects  Degradation  Electronics packaging  High power lasers  Laser beam welding  Power semiconductor diodes  Reliability  Reliability analysis  Semiconductor diodes   A compact QCW conduction-cooled high power semiconductor laser array 会议论文  OAI收割 17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16 作者:  Zhu, Qiwen;  Zhang, Pu;  Wang, Shuna;  Wu, Dihai;  Nie, Zhiqiang 收藏  |  浏览/下载：41/0  |  提交时间：2016/11/22 Chip scale packages  Electronics packaging  Finite element method  High power lasers  High temperature applications  Temperature   Thermal behavior of microchannel cooled high power diode laser arrays 会议论文  OAI收割 17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16 作者:  Wu, Dihai;  Zhang, Pu;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei 收藏  |  浏览/下载：41/0  |  提交时间：2016/11/22 Computational fluid dynamics  Copper  Crosstalk  Diodes  Electronics packaging  Finite element method  Flow of water  Heat resistance  Heat sinks  Hydraulics  Laser beam welding  Microchannels  Numerical methods  Optical properties  Power semiconductor diodes  Reliability  Thermodynamic properties   Numerical simulation of thermo-mechanical behavior in high power diode laser arrays 会议论文  OAI收割 17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16 作者:  Lu, Yao;  Nie, Zhiqiang;  Zhang, Pu;  Wang, Zhenfu;  Xiong, Lingling 收藏  |  浏览/下载：53/0  |  提交时间：2016/11/22 Computer simulation  Electronics packaging  High power lasers  Numerical models  Occupational risks  Optical properties  Packaging  Power semiconductor diodes  Shear stress  Thermal stress   Influence of temperature on “Smile” in high power diode laser bars 期刊论文  OAI收割 Guangzi Xuebao/Acta Photonica Sinica, 2016, 卷号: 45, 期号: 5 作者:  Wang, Shu-Na;  Zhang, Pu;  Xiong, Ling-Ling;  Nie, Zhi-Qiang;  Wu, Di-Hai 收藏  |  浏览/下载：19/0  |  提交时间：2016/10/14 Diodes  Heat sinks  Lasers  Power semiconductor diodes  Semiconductor lasers  Temperature  Thermal stress   Slow axis collimation lens with variable curvature radius for semiconductor laser bars 期刊论文  OAI收割 optics and laser technology, 2016, 卷号: 77, 页码: 1-5 作者:  Xiong, Ling-Ling;  Cai, Lei;  Zheng, Yan-Fang;  Liu, Hui;  Zhang, Pu 收藏  |  浏览/下载：37/0  |  提交时间：2016/01/11 Semiconductor laser  Variable curvature radius  Slow axis collimation lens  Constant phase front  Transmission angle   Degradation of high power single emitter laser modules using nanosilver paste in continuous pulse conditions 期刊论文  OAI收割 microelectronics reliability, 2015, 卷号: 55, 期号: 12, 页码: 2532-2541 作者:  Yan, Haidong;  Mei, Yunhui;  Li, Xin;  Zhang, Pu;  Lu, Guo-Quan 收藏  |  浏览/下载：23/0  |  提交时间：2015/12/02 Nanosilver paste  Laser module  Die-attach interface  Pulse mode  Reliability   High Power Diode Laser Stack Development Using Gold-Tin Bonding Technology 会议论文  OAI收割 conference on components and packaging for laser systems, san francisco, ca, 2015-02-09 作者:  Hou, Dong;  Wang, Jingwei;  Zhang, Pu;  Cai, Lei;  Dai, Ye 收藏  |  浏览/下载：23/0  |  提交时间：2015/12/04