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浏览/检索结果: 共19条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择提交时间升序提交时间降序发表日期升序发表日期降序题名升序题名降序作者升序作者降序 The Genetic Control of the Compound Leaf Patterning in Medicago truncatula 期刊论文  OAI收割 FRONTIERS IN PLANT SCIENCE, 2022, 卷号: 12, 期号: _, 页码: - 作者:  Mo, Xiaoyu;  He, Liangliang;  Liu, Ye;  Wang, Dongfa;  Zhao, Baolin   |  收藏  |   Cracking the superheavy pyrite enigma: possible roles of volatile organosulfur compound emission 期刊论文  OAI收割 NATIONAL SCIENCE REVIEW, 2021, 卷号: 8, 期号: 10, 页码: 14 作者:  Lang, Xianguo;  Zhao, Zhouqiao;  Ma, Haoran;  Huang, Kangjun;  Li, Songzhuo   |  收藏  |   Effect of a hepatitis B virus inhibitor, NZ-4, on capsid formation 期刊论文  OAI收割 ANTIVIRAL RESEARCH, 2016, 卷号: 125, 页码: 25-33 作者:  Yang, Li;  Wang, Ya-Juan;  Chen, Hai Jun;  Shi, Li-Ping;  Tong, Xian-Kun   |  收藏  |   MICROSTRUCTURE EVOLUTION AND GROWTH BEHAVIORS OF FACETED PHASE IN DIRECTIONALLY SOLIDIFIED Al-Y ALLOYS II. Microstructure Evolution of Directionally Solidified Al-53%Y Peritectic Alloy 期刊论文  OAI收割 ACTA METALLURGICA SINICA, 2016, 卷号: 52, 期号: 7, 页码: 866-874 作者:  Liu Tong;  Luo Liangshun;  Zhang Yanning;  Su Yanqing;  Guo Jingjie   |  收藏  |   Effects of Zn addition on electromigration behavior of Sn-1Ag-0.5Cu solder interconnect 期刊论文  OAI收割 Journal of Materials Science-Materials in Electronics, 2013, 卷号: 24, 期号: 1, 页码: 211-216 H. Y. Liu; Q. S. Zhu; Z. G. Wang; J. D. Guo; J. K. Shang 收藏  |   Dependence of electromigration damage on Sn grain orientation in Sn-Ag-Cu solder joints 期刊论文  OAI收割 Journal of Applied Physics, 2013, 卷号: 114, 期号: 15 J. Q. Chen; J. D. Guo; K. L. Liu; J. K. Shang 收藏  |   Theoretical study on novel nitrogen-rich energetic compounds of bis(amino)-azobis(azoles) with tetrazene unit 期刊论文  OAI收割 JOURNAL OF MOLECULAR MODELING, 2012, 卷号: 18, 期号: 10, 页码: 4687-4698 作者:  Li ZM;  Ceng DD(曾丹丹);  Zhang JG;  Niu XQ;  Man TT 收藏  |   Influence of octupole deformation and orientation on the potential energy surface in the di-nuclear system model 期刊论文  OAI收割 CHINESE PHYSICS C, 2010, 卷号: 34, 期号: 10, 页码: 1615-1621 作者:  Scheid, W.;  Wang Nan;  Zhou Shan-Gui;  Zhao En-Guang;  Wang, N , Shenzhen Univ, Coll Phys, Shenzhen 518060, Peoples R China   |  收藏  |   Current-induced growth of P-rich phase at electroless nickel/Sn interface 期刊论文  OAI收割 Journal of Materials Research, 2009, 卷号: 24, 期号: 9, 页码: 2767-2774 Q. L. Yang; P. J. Shang; J. D. Guo; Z. Q. Liu; J. K. Shang 收藏  |   Effect of interfacial reactions on the reliability of lead-free assemblies after board level drop tests 期刊论文  OAI收割 JOURNAL OF ELECTRONIC MATERIALS, 2007, 卷号: 36, 期号: 9, 页码: 1129-1136 Xia, Y; Lu, C; Xle, X 收藏  |