中国科学院机构知识库网格系统: 检索

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	Toward Developing High-Performance RISC-V Processors Using Agile Methodology 期刊论文 OAI收割 IEEE MICRO, 2023, 卷号: 43, 期号: 4, 页码: 98-106 作者: Xu, Yinan; Yu, Zihao; Tang, Dan; Cai, Ye; Huan, Dandan \| 收藏 \| 浏览/下载：22/0 \| 提交时间：2023/12/04 Program processors Behavioral sciences Chip scale packaging Microarchitecture Hardware Analytical models Layout
	A Chip-Level Optical Interconnect for CPU 期刊论文 OAI收割 IEEE PHOTONICS TECHNOLOGY LETTERS, 2021, 卷号: 33, 期号: 16, 页码: 852-855 作者: Hao, Qinfen; Qin, Mengyuan; Qi, Nan; Xue, Haiyun; Han, Meng \| 收藏 \| 浏览/下载：60/0 \| 提交时间：2021/12/01 Integrated optics Optical interconnections Transceivers Adaptive optics Optical switches Optical sensors Power demand Optical interconnections digital integrated circuits very high speed integrated circuits chip scale packaging system integration
	Thermally accelerated ageing test of 808nm high power diode laser arrays in CW mode 会议论文 OAI收割 17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16 作者: Nie, Zhiqiang; Wu, Di; Lu, Yao; Wu, Dhai; Wang, Shuna 收藏 \| 浏览/下载：91/0 \| 提交时间：2016/11/22 Chip scale packages Defects Degradation Electronics packaging High power lasers Laser beam welding Power semiconductor diodes Reliability Reliability analysis Semiconductor diodes
	A compact QCW conduction-cooled high power semiconductor laser array 会议论文 OAI收割 17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16 作者: Zhu, Qiwen; Zhang, Pu; Wang, Shuna; Wu, Dihai; Nie, Zhiqiang 收藏 \| 浏览/下载：40/0 \| 提交时间：2016/11/22 Chip scale packages Electronics packaging Finite element method High power lasers High temperature applications Temperature