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福建物质结构研究所 [7]
金属研究所 [5]
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中国科学院大学 [1]
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期刊论文 [18]
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2011 [2]
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Development of Silver Paste With High Sintering Driving Force for Reliable Packaging of Power Electronics
期刊论文
OAI收割
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2024, 卷号: 14, 期号: 1, 页码: 10-17
作者:
Zhang, Bowen
;
Lu, Xinyan
;
Ma, Haoxiang
;
Wang, Di
;
Mei, Yun-Hui
  |  
收藏
  |  
浏览/下载:21/0
  |  
提交时间:2024/05/07
Silver
Sintering
Force
Substrates
Copper
Bonding
Thermal stability
Reliability packaging
silver paste
sintering driving force
Evolution of the interfacial microstructure during the plastic deformation bonding of copper
期刊论文
OAI收割
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 746, 页码: 1-10
作者:
Zhang, Jian Yang
;
Sun, Ming Yue
;
Xu, Bin
;
Hu, Xin
;
Liu, Sheng
  |  
收藏
  |  
浏览/下载:28/0
  |  
提交时间:2021/02/02
Copper bonding
Hot compression bonding
Dynamic recrystallization
Grain boundary
Dislocation wall
Hydrogen bonding in goldichite, KFe(SO4)(2)center dot 4H(2)O: structure refinement
期刊论文
OAI收割
MINERALOGY AND PETROLOGY, 2018, 卷号: 112, 期号: 1, 页码: 135-142
作者:
Yang, Zhuming
;
Giester, Gerald
  |  
收藏
  |  
浏览/下载:57/0
  |  
提交时间:2018/09/26
Goldichite
Hydrogen Bonding
Hydrated Sulfate
Crystal Structure
Oxidation Zone Of Copper Deposit
Hydrogen bonding in goldichite, KFe(SO4)(2)center dot 4H(2)O: structure refinement
期刊论文
OAI收割
MINERALOGY AND PETROLOGY, 2018, 卷号: 112, 期号: 1, 页码: 135-142
作者:
Yang, Zhuming
;
Giester, Gerald
  |  
收藏
  |  
浏览/下载:58/0
  |  
提交时间:2018/09/26
Goldichite
Hydrogen Bonding
Hydrated Sulfate
Crystal Structure
Oxidation Zone Of Copper Deposit
Numerical Simulation of Minimal Average Bonding Strength to Suppress Rebounding in Cold Spraying Cu/Cu: A Preliminary Study
期刊论文
OAI收割
Journal of Thermal Spray Technology, 2015, 卷号: 24, 期号: 42006, 页码: 75-85
K.
;
Kong Wang, L. Y.
;
Tao, Y. S.
;
Li, T. F.
;
Xiong, T. Y.
收藏
  |  
浏览/下载:24/0
  |  
提交时间:2015/05/08
adhesion energy
bonding mechanism
bonding strength
cold spraying
contact area
finite element method (FEM)
rebounding energy
powder particles
copper coatings
deposition
deformation
mechanism
friction
solids
metal
Strain rate dependent tensile plasticity of ultrafine-grained Cu/Ni laminated composites
期刊论文
OAI收割
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2014, 卷号: 609, 页码: 318-322
H. F. Tan
;
B. Zhang
;
X. M. Luo
;
X. D. Sun
;
G. P. Zhang
收藏
  |  
浏览/下载:124/0
  |  
提交时间:2015/01/14
Strain rate
Ultrafine grain
Laminated composite
Plasticity
Stress
gradient
high-pressure torsion
bonding arb process
mechanical-properties
nanoscale multilayers
sliding wear
cu
behavior
copper
ni
deformation
Hydrogen-bond-directed self-assembly of a novel 2D -> 3D polythreading with finite components based on rigid ligand
期刊论文
OAI收割
Journal of Molecular Structure, 2011, 卷号: 994, 期号: 1-3, 页码: 1-5
L. Y. Qiao
;
J. Zhang
;
Z. J. Li
;
Y. Y. Qin
;
P. X. Yin
;
J. K. Cheng
;
Y. G. Yao
收藏
  |  
浏览/下载:46/0
  |  
提交时间:2012/06/06
Copper
4-Amino-1
1
Hydrogen bonding
2
3
Polythreading
4-triazole
5-Benzenetricarboxylic acid
metal-organic frameworks
coordination polymers
crystal-structure
network
polycatenation
strategies
chemistry
interpenetration
architectures
polyrotaxane
Enhanced toughness and fatigue strength of cold roll bonded Cu/Cu laminated composites with mechanical contrast
期刊论文
OAI收割
Scripta Materialia, 2011, 卷号: 65, 期号: 10, 页码: 891-894
H. S. Liu
;
B. Zhang
;
G. P. Zhang
收藏
  |  
浏览/下载:60/0
  |  
提交时间:2012/04/13
Laminated composite
Cold roll bonding
Fatigue strength
Toughness
Cracking
grained copper
behavior
films
Weakening of the Cu/Cu(3)Sn(100) Interface by Bi Impurities
期刊论文
OAI收割
Journal of Electronic Materials, 2010, 卷号: 39, 期号: 8, 页码: 1277-1282
X. Y. Pang
;
P. J. Shang
;
S. Q. Wang
;
Z. Q. Liu
;
J. K. Shang
收藏
  |  
浏览/下载:38/0
  |  
提交时间:2012/04/13
DFT
bismuth
impurity
interface
bonding
solder interconnect
molecular-dynamics
bismuth solder
embrittlement
joints
copper
cu3sn
pseudopotentials
segregation
fracture
Supramolecular networks with 1-substituted benzotriazole ligands and transition metals
期刊论文
OAI收割
Journal of Coordination Chemistry, 2009, 卷号: 62, 期号: 20, 页码: 3296-3305
F. Wang, X. Y. Wu, R. M. Yu, Z. G. Zhao and C. Z. Lu
收藏
  |  
浏览/下载:22/0
  |  
提交时间:2012/11/06
Benzotriazole
Hydrogen bonding
- Interactions
Supramolecular networks
coordination polymers
hydrogen-bonds
complexes
derivatives
molecules
chains
copper
route