机构

• 金属研究所 [5]
• 物理研究所 [1]
• 过程工程研究所 [1]
• 生态环境研究中心 [1]

采集方式

• OAI收割 [8]

内容类型

• 期刊论文 [8]

发表日期

• 2023 [1]
• 2019 [2]
• 2018 [1]
• 2016 [1]
• 2013 [1]
• 2011 [1]
• 更多

学科主题

筛选

浏览/检索结果: 共8条，第1-8条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择题名升序题名降序提交时间升序提交时间降序作者升序作者降序发表日期升序发表日期降序 Characterization and constitutive analysis-based crystal plasticity of warm flow and fracture behaviours of 2060 Al-Cu-Li alloy 期刊论文  OAI收割 JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, 2023, 卷号: 26, 页码: 1624-1648 作者:  Abd El-Aty, Ali;  Ha, Sangyul   |  收藏  |  浏览/下载：18/0  |  提交时间：2024/01/08 2060 Al-Cu-Li alloy  Constitutive analysis  Fracture mechanisms  Crystal plasticity modelling  Storage and recovery processes  Friedel-escaig model   Hot Deformation Behavior and Processing Map of a Cu-Bearing 2205 Duplex Stainless Steel 期刊论文  OAI收割 ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2019, 卷号: 32, 期号: 12, 页码: 1537-1548 作者:  Xi, Tong;  Yin, Lu;  Yang, Chun-Guang;  Yang, Ke   |  收藏  |  浏览/下载：94/0  |  提交时间：2021/02/02 Cu-bearing duplex stainless steel  Hot deformation  Processing map  Dynamic recrystallization  Dynamic recovery   Hot Deformation Behavior and Processing Map of a Cu-Bearing 2205 Duplex Stainless Steel 期刊论文  OAI收割 ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2019, 卷号: 32, 期号: 12, 页码: 1537-1548 作者:  Xi, Tong;  Yin, Lu;  Yang, Chun-Guang;  Yang, Ke   |  收藏  |  浏览/下载：101/0  |  提交时间：2021/02/02 Cu-bearing duplex stainless steel  Hot deformation  Processing map  Dynamic recrystallization  Dynamic recovery   Sustainable electrochemical recovery of high-purity Cu powders from multi-metal acid solution by a centrifuge electrode 期刊论文  OAI收割 JOURNAL OF CLEANER PRODUCTION, 2018, 卷号: 204, 页码: 41-49 作者:  Wang, Mingyong;  Gong, Xuzhong;  Wang, Zhi   |  收藏  |  浏览/下载：37/0  |  提交时间：2018/12/04 High-purity Cu Powder  Centrifuge Electrode  Electrochemical Recovery  Multi-metal Solution  Electroplating Sludge   Photo-assisted electrolytic decomplexation of Cu-EDTA and Cu recovery enhanced by H2O2 and electro-generated active chlorine 期刊论文  OAI收割 CHEMICAL ENGINEERING JOURNAL, 2016, 卷号: 301, 期号: 0, 页码: 371-379 作者:  Zeng, Huabin;  Tian, Shichao;  Liu, Huifang;  Chai, Buyu;  Zhao, Xu 收藏  |  浏览/下载：113/0  |  提交时间：2017/03/29 Photo-assisted electrolysis  UV/H2O2  Electrochlorination  Decomplexation  Cu recovery   Thermal fatigue behaviors of Sn-4Ag/Cu solder joints at low strain amplitude 期刊论文  OAI收割 Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2013, 卷号: 580, 页码: 374-384 Q. K. Zhang; Z. F. Zhang 收藏  |  浏览/下载：19/0  |  提交时间：2013/12/24 Sn-Ag/Cu solder joints  Thermal fatigue  Strain localization  Grain  rotation  Dynamic recovery  stress-relaxation behavior  eutectic sn-3.5ag solder  lead-free solders  pb-free solders  sn-ag  tensile properties  shear-strength  fracture-behavior  deformation  creep   Effects of stacking fault energy, strain rate and temperature on microstructure and strength of nano structured Cu-Al alloys subjected to plastic deformation 期刊论文  OAI收割 Acta Materialia, 2011, 卷号: 59, 期号: 15, 页码: 6048-6058 Y. Zhang; N. R. Tao; K. Lu 收藏  |  浏览/下载：26/0  |  提交时间：2012/04/13 Cu-Al alloys  Stacking fault energy  Plastic deformation  Nanostructures  Mechanical properties  high-pressure torsion  mechanical attrition treatment  ultrafine-grained  metals  nanostructured metals  nanocrystalline cu  tensile properties  dynamic recovery  surface-layer  scale twins  copper   Making metallic glasses plastic by control of residual stress 期刊论文  OAI收割 NATURE MATERIALS, 2006, 卷号: 5, 期号: 11, 页码: 857 Zhang, Y; Wang, WH; Greer, AL 收藏  |  浏览/下载：67/0  |  提交时间：2013/09/18 BULK AMORPHOUS ALLOY  NI-CU-BE  SHARP INDENTATION  FRACTURE  DEFORMATION  RECOVERY  FLOW