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Chinese Academy of Sciences Institutional Repositories Grid
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金属研究所 [8]
上海微系统与信息技术... [1]
青岛生物能源与过程研... [1]
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OAI收割 [11]
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期刊论文 [10]
学位论文 [1]
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2017 [2]
2016 [1]
2014 [1]
2013 [1]
2012 [1]
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Metallurgy... [2]
Materials ... [1]
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Effects of Substrate Pulse Bias Duty Cycle on the Microstructure and Mechanical Properties of Ti-Cu-N Films Deposited by Magnetic Field-Enhanced Arc Ion Plating
期刊论文
OAI收割
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2017, 卷号: 30, 期号: 2, 页码: 176-184
Zhao, Sheng-Sheng
;
Zhao, Yan-Hui
;
Cheng, Lv-Sha
;
Denisov, Vladimir Viktorovich
;
Koval, Nikolay Nikolaevich
;
Yu, Bao-Hai
;
Mei, Hai-Juan
收藏
  |  
浏览/下载:33/0
  |  
提交时间:2017/08/17
Magnetic field
Arc ion plating
Ti-Cu-N film
Residual stress
Hardness
TiAlN/Cu Nanocomposite Coatings Deposited by Filtered Cathodic Arc Ion Plating
期刊论文
OAI收割
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2017, 卷号: 33, 期号: 1, 页码: 111-116
Chen, Lei
;
Pei, Zhiliang
;
Xiao, Jinquan
;
Gong, Jun
;
Sun, Chao
收藏
  |  
浏览/下载:29/0
  |  
提交时间:2017/08/17
TiAlN
TiAlN/Cu
Nanocomposite coating
Filtered cathodic arc ion plating
Co-deposition
Fabrication of W/Cu Graded Heat-sink Materials by Electroless Plating and Powder Metallurgy
期刊论文
OAI收割
RARE METAL MATERIALS AND ENGINEERING, 2016, 卷号: 45, 期号: 8, 页码: 1983-1987
作者:
Luo Laima
;
Tan Xiaoyue
;
Ding Xiaoyu
;
Lu Zelong
;
Luo Guangnan
收藏
  |  
浏览/下载:33/0
  |  
提交时间:2017/07/21
Electroless Plating
Powder Metallurgy
W/cu Graded Heat-sink Materials
Erosion-Corrosion Behavior of Electroless Ni-P Coating on Copper-Nickel Alloy in 3.5 wt.% Sodium Chloride Solution
期刊论文
OAI收割
Journal of Materials Engineering and Performance, 2014, 卷号: 23, 期号: 1, 页码: 230-237
B. Jiang
;
S. L. Jiang
;
A. L. Ma
;
Y. G. Zheng
收藏
  |  
浏览/下载:21/0
  |  
提交时间:2014/03/14
copper-nickel alloy
electroless
erosion-corrosion resistance
heat
treatment
passivity
plating
electrochemical-behavior
composite coatings
nacl solutions
seawater
resistance
velocity
cu
Effect of Heat Treatment on Erosion-Corrosion Behavior of Electroless Ni-P Coatings in Saline Water
期刊论文
OAI收割
Materials and Manufacturing Processes, 2013, 卷号: 29, 期号: 1, 页码: 74-82
B. Jiang
;
S. L. Jiang
;
A. L. Ma
;
Y. G. Zheng
收藏
  |  
浏览/下载:22/0
  |  
提交时间:2014/03/14
Amorphous
Coatings
Corrosion
CuNi 90/10
Erosion
Heat treatment
Microstructure
Ni-P plating
electrochemical-behavior
magnesium alloy
nacl solutions
copper-alloys
seawater
resistance
microstructure
phosphorus
surface
cu
Study on nanocomposite Ti-Al-Si-Cu-N films with various Si contents deposited by cathodic vacuum arc ion plating
期刊论文
OAI收割
Applied Surface Science, 2012, 卷号: 258, 期号: 24, 页码: 9642-9649
J. Shi
;
C. M. Muders
;
A. Kumar
;
X. Jiang
;
Z. L. Pei
;
J. Gong
;
C. Sun
收藏
  |  
浏览/下载:28/0
  |  
提交时间:2013/02/05
Ti-Al-Si-Cu-N films
Cathode arc ion plating
Nanocomposite
tribological properties
mechanical-properties
coatings
microstructure
nitride
bias
Ti-Cu-N hard nanocomposite films prepared by pulse biased arc ion plating
期刊论文
OAI收割
Applied Surface Science, 2011, 卷号: 258, 期号: 1, 页码: 370-376
Y. H. Zhao
;
X. Q. Wang
;
J. Q. Xiao
;
B. H. Yu
;
F. Q. Li
收藏
  |  
浏览/下载:38/0
  |  
提交时间:2012/04/13
Pulse biased arc ion plating
Nanocomposite films
Ti-Cu-N
Hardness
mechanical-properties
superhard materials
coatings
deposition
dc
microstructure
bombardment
morphology
titanium
design
Deposition, structure and hardness of Ti-Cu-N hard films prepared by pulse biased arc ion plating
期刊论文
OAI收割
Vacuum, 2011, 卷号: 86, 期号: 4, 页码: 415-421
X. Q. Wang
;
Y. H. Zhao
;
B. H. Yu
;
J. Q. Xiao
;
F. Q. Li
收藏
  |  
浏览/下载:18/0
  |  
提交时间:2012/04/13
Ti-Cu-N hard composite films
Pulse biased arc ion plating
Composition
Structure
superhard nanocomposite coatings
mechanical-properties
zr
bombardment
design
energy
ptsi
dc
Photocatalytic Reduction of CO2 Using Cu/S-TiO2 Prepared by Electroless Plating Method
期刊论文
OAI收割
Advanced Materials Research, 2011, 期号: 233, 页码: 589-595
Wang, Z., Li
;
F. F.
;
Yang, C.
;
Zhang, W. Y.
;
Wu, J. H.
收藏
  |  
浏览/下载:14/0
  |  
提交时间:2012/11/07
CO2
Cu/S-TiO2
Electroless Plating
Photocatalytic Reduction
Solderability of electrodeposited Fe-Ni alloys with eutectic SnAgCu solder
期刊论文
OAI收割
Journal of Materials Science & Technology, 2007, 卷号: 23, 期号: 6, 页码: 811-816
J. J. Guo
;
L. Zhang
;
A. P. Xian
;
J. K. Shang
收藏
  |  
浏览/下载:24/0
  |  
提交时间:2012/04/13
solderability
FeNi alloys
lead-free solders
wetting
electroless-nickel/solder interface
enig plating layer
thermal-stability
sn-0.4cu solder
cu substrate
plated kovar
sn
reflow
copper
part