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浏览/检索结果: 共42条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择题名升序题名降序提交时间升序提交时间降序作者升序作者降序发表日期升序发表日期降序 Magnetic photocatalytic nano-semiconductors prepared from carbon quantum dots compounded with copper ferrate and their application in dye wastewater treatment 期刊论文  OAI收割 JOURNAL OF ENVIRONMENTAL CHEMICAL ENGINEERING, 2024, 卷号: 12, 期号: 1, 页码: 9 作者:  Shi, Keren;  Qian, Guangyan;  Yi, Wende;  Tang, Wufei;  Liu, Fang   |  收藏  |  浏览/下载：16/0  |  提交时间：2024/09/10 Photocatalyst  Azo dyes  Magnetic recyclable  Electromigration  CQDs/CuFe2O4   Interface engineering of solution-grown silver nanofiber networks designed as flexible transparent electrodes 期刊论文  OAI收割 Journal of Materials Chemistry C, 2019, 卷号: 7, 期号: 13, 页码: 3924-3933 作者:  P.Li;  X.Wang;  J.G.Ma;  T.F.Wang;  W.Zhang   |  收藏  |  浏览/下载：22/0  |  提交时间：2020/08/24 high-performance,nanowire,film,heaters,oxide,ag,electromigration,long,cu,Materials Science,Physics   Mechanism of improved electromigration reliability using Fe-Ni UBM in wafer level package 期刊论文  OAI收割 JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2018, 卷号: 34, 期号: 8, 页码: 1305-1314 作者:  Gao, LY;  Zhang, H;  Li, CF;  Guo, JD;  Liu, ZQ   |  收藏  |  浏览/下载：42/0  |  提交时间：2018/12/25 Fe-Ni under bump metallization (UBM)  Intermetallic compounds (IMCs)  Electromigration (EM)  Diffusion  Vacancy formation   Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current 期刊论文  OAI收割 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 6, 页码: 5025-5033 作者:  Zhu, QS;  Gao, F;  Ma, HC;  Liu, ZQ;  Guo, JD   |  收藏  |  浏览/下载：24/0  |  提交时间：2018/06/05 Stress-relaxation  Void Formation  Electromigration  Reliability  Sn  Interconnections  Thermomigration  Metallization  Mechanisms  Diffusion   Electromigration anisotropy introduced by tin orientation in solder joints 期刊论文  OAI收割 JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 卷号: 703, 页码: 264-271 Chen, Jian-Qiang; Liu, Kai-Lang; Guo, Jing-Dong; Ma, Hui-Cai; Wei, Song; Shang, Jian-Ku 收藏  |  浏览/下载：37/0  |  提交时间：2017/08/17 Electromigration  Single crystal tin  Cu6Sn5  Intermetallic compounds  Orientation  Diffusion   Cu6Sn5 intermetallic compound anisotropy introduced by single crystal Sn under current stress 期刊论文  OAI收割 JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 卷号: 695, 页码: 3290-3298 Chen, Jian-Qiang; Guo, Jing-Dong; Ma, Hui-Cai; Wei, Song; Shang, Jian-Ku 收藏  |  浏览/下载：27/0  |  提交时间：2017/08/17 Cu6Sn5  Tin  Orientation  Solid state reaction  Electromigration   Extreme anisotropy of electromigration: Nickel in single-crystal tin 期刊论文  OAI收割 JOURNAL OF ALLOYS AND COMPOUNDS, 2016, 卷号: 687, 页码: 999-1003 Wei, S; Ma, HC; Chen, JQ; Guo, JD 收藏  |  浏览/下载：80/0  |  提交时间：2016/12/28 Electromigration  Single crystal  Solder  Intermetallics  Anisotropy   Fast and Huge Anisotropic Diffusion of Cu (Ag) and Its Resistance on the Sn Self-diffusivity in Solid beta-Sn 期刊论文  OAI收割 JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2016, 卷号: 32, 期号: 2, 页码: 121-128 Liu, Peitao; Wang, Shoulong; Li, Dianzhong; Li, Yiyi; Chen, Xing-Qiu 收藏  |  浏览/下载：28/0  |  提交时间：2016/04/21 Diffusion  Electromigration  beta-Sn  First-principles   Fast and Huge Anisotropic Diffusion of Cu (Ag) and Its Resistance on the Sn Self-diffusivity in Solid β-Sn 期刊论文  OAI收割 Journal of Materials Science & Technology, 2016, 卷号: 32, 期号: 2, 页码: 121-128 作者:  Liu Peitao;  Wang Shoulong;  Li Dianzhong;  Li Yiyi;  Chen Xingqiu   |  收藏  |  浏览/下载：10/0  |  提交时间：2021/02/02 Diffusion  Electromigration  β-Sn  First-principles   Frequency-dependent failure mechanisms of nanocrystalline gold interconnect lines under general alternating current 期刊论文  OAI收割 Journal of Applied Physics, 2014, 卷号: 116, 期号: 10 X. M. Luo; B. Zhang; G. P. Zhang 收藏  |  浏览/下载：24/0  |  提交时间：2015/01/14 molecular-dynamics simulation  fine-grained materials  thermal fatigue  damage  deformation-behavior  cu interconnects  current stress  electromigration  films  technology  diffusion