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CAS IR Grid
机构
长春光学精密机械与物... [3]
兰州化学物理研究所 [2]
西安光学精密机械研究... [1]
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会议论文 [3]
期刊论文 [2]
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2023 [1]
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材料科学与物理化学 [2]
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Modeling 3D sliding electrical contact considering fully coupled thermal-mechanical-electrical effects
期刊论文
OAI收割
TRIBOLOGY INTERNATIONAL, 2023, 卷号: 184
作者:
Sui, Yijin
;
Wang, Wenzhong
;
Zhang, Haibo
;
Xie, Youjin
  |  
收藏
  |  
浏览/下载:20/0
  |  
提交时间:2023/05/19
Sliding electrical contact
Thermal-mechanical-electrical coupling
Electrical constriction resistance
Electric potential equilibrium
Ti3SiC2-Ag复合材料的摩擦学性能
学位论文
OAI收割
工学博士: 中国科学院大学, 2014
曾俊菱
收藏
  |  
浏览/下载:52/0
  |  
提交时间:2014/11/25
Ti3SiC2-Ag复合材料
放电等离子烧结
摩擦磨损
电接触
离子液润滑
Ti3SiC2-Ag Composite
Spark Plasma Sintering
Friction and Wear
Electric contact
Ionic Liquid Lubrication
Modelling of the electric field assisted capillarity effect used for the fabrication of hollow polymer microstructures (EI CONFERENCE)
会议论文
OAI收割
2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012, April 16, 2012 - April 18, 2012, Cascais, Portugal
Tonry C.
;
Patel M.
;
Bailey C.
;
Desmuliez M. P. Y.
;
Cargill S.
;
Yu W.
收藏
  |  
浏览/下载:93/0
  |  
提交时间:2013/03/25
Electric Field Assisted Capillarity (EFAC) is a novel process which has the potential for the single step fabrication of hollow polymer microstructures. The process has been shown to work experimentally on a microscale level using Polydimethylsiloxane (PDMS). The process makes use of both the electrohydrodynamics of polymer at a microscale and the voltage enhanced capillary force exerted on the polymer. This paper discusses the results of a two-dimensional numerical simulation of this process. The results presented use a patterned master electrode producing encapsulated microchannels in the polymer. The simulations demonstrate how the differing contact angles between the polymer and the walls of the master electrode affect the thickness of the top surface of the formed microstructures. It also specifies the conditions necessary for the successful fabrication of such microstructures. 2012 IEEE.
A real-time two-dimensional correlation speed measurement based on image (EI CONFERENCE)
会议论文
OAI收割
2010 International Conference on Computer, Mechatronics, Control and Electronic Engineering, CMCE 2010, August 24, 2010 - August 26, 2010, Changchun, China
作者:
Yu L.
收藏
  |  
浏览/下载:21/0
  |  
提交时间:2013/03/25
In order to implement two-dimensional moving object's non-contact and real-time speed measurement
in this paper
wc proposed a new method which was based on the characteristic of FPGA and a real-time two-dimensional correlation speed measurement was proposed on image processing using high speed CMOS shown in figure 1. Experimental installation was shown in figure 2
a cardboard with images which was fixed in electric control movement device was moving to simulate moving object
the CMOS image sensor gathered image signals of the cardboard and the image signals was output to FPGA after a serials pretreatment such as binaryzation etc. Logical operation insteaded mathematical operation on FPGA to implement two frames image's cross-correlation operations as the formula (10) in this paper
and finally calculate the two-dimensional velocity. Through experiment result of table 1 we drawn an conclusion the accurarcy of the method in this paper was less than 1 pixel and the method can be used at a certain speed ranges of two-dimensional
real-time speed measurement. 2010 IEEE.
Study on the fabrication of orange micro-LED arrays for display (EI CONFERENCE)
会议论文
OAI收割
ICO20: Display Devices and Systems, August 21, 2005 - August 26, 2005, Changchun, China
作者:
Li J.
;
Wang W.
;
Wang W.
;
Zhao L.
;
Li J.
收藏
  |  
浏览/下载:31/0
  |  
提交时间:2013/03/25
Arrays of micro-sized LEDs which can be used as microdisplays have been demonstrated in recent years. In order to reduce the input and output connections to the arrays
we employ a matrix addressable architecture
in which all the pixels in each row are connected by a common metal line on the top of the window layer (top electrode) or at the base of substrate(bottom electrode). Decreasing the size of electrodes makes for minimizing the size of device. The optic and electric isolation and good ohmic contact are also helpful to obtain superior optical and electrical performance. We describe a procedure of fabrication of AlGalnP-based orange micro-LED by wet etching. The structure of devices is etched using both isotropic and anisotropic etchant. The pixel size is about 16um 20um
and there are 1000 818 pixels in the light emitting chip whose diagonal is 1-in.
铜基电接触复合材料的研究
期刊论文
OAI收割
摩擦学学报, 1995, 卷号: 15, 期号: 1, 页码: 19-28
郑冀
;
朱家佩
;
欧阳锦林
收藏
  |  
浏览/下载:33/0
  |  
提交时间:2015/07/09
铜基电接触材料
低压电器
电触头
电性能
抗熔焊
灭电弧
摩擦学特性
copper-base electric contact material
low voltage electrical equipment
electric contact
electric property
antiwelding
arc supperessing
tribological property