中国科学院机构知识库网格系统: 检索

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	Enhanced Light Extraction of Flip-Chip Mini-LEDs with Prism-Structured Sidewall 期刊论文 OAI收割 Nanomaterials, 2019, 卷号: 9, 期号: 3, 页码: 8 作者: B.Tang; J.Miao; Y.C.Liu; H.Wan; N.Li \| 收藏 \| 浏览/下载：18/0 \| 提交时间：2020/08/24 flip-chip mini-LED,prism-structured sidewall,waveguide photons,light,extraction,emitting-diodes,gan,efficiency,performance,improvement,surface,Science & Technology - Other Topics,Materials Science
	Effect of Dielectric Distributed Bragg Reflector on Electrical and Optical Properties of GaN-Based Flip-Chip Light-Emitting Diodes 期刊论文 OAI收割 Micromachines, 2018, 卷号: 9, 期号: 12, 页码: 9 作者: Zhou, S. J.; Xu, H. H.; Liu, M. L.; Liu, X. T.; Zhao, J. \| 收藏 \| 浏览/下载：21/0 \| 提交时间：2019/09/17 flip-chip light-emitting diodes distributed Bragg reflector light output power external quantum efficiency quantum-well p-type leds performance wavelength contacts ito/dbr laser power fabrication Science & Technology - Other Topics Instruments & Instrumentation
	Mechanical properties of arrayed Pb-free tin bump and its interfacial reaction with Ni-PUBM during reflow process 期刊论文 OAI收割 ICEPT: 2006 7th International Conference on Electronics Packaging Technology, Proceedings, 2006, 页码: 51-54 Zhu, DP; Le, L 收藏 \| 浏览/下载：17/0 \| 提交时间：2012/03/24 INTERMETALLIC COMPOUND FORMATION FLIP-CHIP TECHNOLOGY SN-3.5AG SOLDER AG SOLDER METALLIZATION RELIABILITY
	Intermetallic compounds evolution between lead-free solder and cu-based lead frame alloys during isothermal aging 期刊论文 OAI收割 JOURNAL OF MATERIALS SCIENCE, 2006, 卷号: 41, 期号: 8, 页码: 2359-2364 Xia, YH; Xie, XM; Xie, XM; Lu, CY 收藏 \| 浏览/下载：34/0 \| 提交时间：2012/03/24 FLIP-CHIP TECHNOLOGY INTERFACIAL MICROSTRUCTURE SNAGCU SOLDER TIN-LEAD GROWTH JOINTS COPPER