中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
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浏览/检索结果: 共25条,第1-10条 帮助

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Supergravity-enhanced liquation crystallization for metal recovery from waste printed circuit boards 期刊论文  OAI收割
Chemical Engineering and Processing - Process Intensification, 2022, 卷号: 173
作者:  
Feng, Peng;  Wang, Zhe;  Meng, Long;  Guo, Zhancheng
  |  收藏  |  浏览/下载:0/0  |  提交时间:2023/06/26
Degradation of the oxide film formed on Alloy 690TT in a high-temperature chloride solution 期刊论文  OAI收割
APPLIED SURFACE SCIENCE, 2019, 卷号: 467, 页码: 1104-1112
作者:  
Hou Qiang;  Liu Zhiyong;  Li Chengtao;  Li Xiaogang;  Shao Jiamin
  |  收藏  |  浏览/下载:43/0  |  提交时间:2019/12/18
Giant electrostrain under low driving field in Bi1;2Na1;2TiO3-SrTiO3 ceramics for actuator applications 期刊论文  OAI收割
Ceramics International, 2016, 卷号: 42, 期号: 14, 页码: 16153-16159
作者:  
Tong, Xing-Ye;  Li, Hai-Long;  Zhou, Jia-Jun;  Liu, Hong;  Fang, Jing-Zhong
  |  收藏  |  浏览/下载:59/0  |  提交时间:2018/06/14
M23C6 precipitates induced inhomogeneous distribution of silicon in the oxide formed on a high-silicon ferritic/martensitic steel 期刊论文  OAI收割
Scripta Materialia, 2015, 卷号: 97, 页码: 45-48
Z. F.; Wang Ye, P.; Li, D. Z.; Li, Y. Y.
收藏  |  浏览/下载:21/0  |  提交时间:2015/05/08
Growth behavior of Cu6Sn5 in Sn-6.5 Cu solders under DC considering trace Al: In situ observation 期刊论文  OAI收割
INTERMETALLICS, 2015, 卷号: 58, 页码: 84—90
作者:  
Wang, TM;  Zhou, P;  Cao, F;  Kang, HJ;  Chen, ZN
收藏  |  浏览/下载:22/0  |  提交时间:2015/12/09
Corrosion behavior of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition 期刊论文  OAI收割
Journal of Materials Science-Materials in Electronics, 2014, 卷号: 25, 期号: 3, 页码: 1228-1236
M. N. Wang; J. Q. Wang; W. Ke
收藏  |  浏览/下载:24/0  |  提交时间:2014/04/18
Corrosion of Ga-doped Sn-0.7Cu Solder in Simulated Marine Atmosphere 期刊论文  OAI收割
Metallurgical and Materials Transactions a-Physical Metallurgy and Materials Science, 2013, 卷号: 44A, 期号: 3, 页码: 1462-1474
Z. Yan; A. P. Xian
收藏  |  浏览/下载:26/0  |  提交时间:2013/12/24
In-situ observation of fracture behavior of Sn-3.0Ag-0.5Cu lead-free solder during three-point bending tests in ESEM 期刊论文  OAI收割
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2012, 卷号: 558, 页码: 649-655
M. N. Wang; J. Q. Wang; H. Feng; W. Ke
收藏  |  浏览/下载:39/0  |  提交时间:2013/02/05
Effect of Ag3Sn intermetallic compounds on corrosion of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition 期刊论文  OAI收割
Corrosion Science, 2012, 卷号: 63, 页码: 20-28
M. N. Wang; J. Q. Wang; H. Feng; W. Ke
收藏  |  浏览/下载:28/0  |  提交时间:2013/02/05
Liquid phase separation in immiscible Ag-Ni-Nb alloy and formation of crystalline/amorphous composite 期刊论文  OAI收割
Journal of Non-Crystalline Solids, 2011, 卷号: 357, 期号: 21, 页码: 3561-3564
J. He; H. X. Jiang; S. Chen; J. Z. Zhao; L. Zhao
收藏  |  浏览/下载:95/0  |  提交时间:2012/04/13