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浏览/检索结果: 共786条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择提交时间升序提交时间降序发表日期升序发表日期降序题名升序题名降序作者升序作者降序 Interface Contact Thermal Resistance of Die Attach in High-Power Laser Diode Packages 期刊论文  OAI收割 ELECTRONICS, 2024, 卷号: 13, 期号: 1 作者:  Deng, Liting;  Li, Te;  Wang, Zhenfu;  Zhang, Pu;  Wu, Shunhua   |  收藏  |  浏览/下载：5/0  |  提交时间：2024/02/23 die attach  interface contact thermal resistance  thermal management  transient thermal analysis  structure function  high-power laser diode   Investigations on the Thermal Conductivity of Micro-Scale Cu-Sn Intermetallic Compounds Using Femtosecond Laser Time-Domain Thermoreflectance System 期刊论文  OAI收割 ACTA METALLURGICA SINICA, 2022, 卷号: 58, 期号: 12, 页码: 1645-1654 作者:  Zhou Lijun;  Wei Song;  Guo Jingdong;  Sun Fangyuan;  Wang Xinwei   |  收藏  |  浏览/下载：5/0  |  提交时间：2023/05/09 femtosecond laser  time-domain thermoreflectance  intermetallic compounds  thermal conductivity   Improving thermal conductivity of polyvinylidene fluoride/low-melting-point alloy with segregated structure induced by incorporation of silver interface layer 期刊论文  OAI收割 JOURNAL OF POLYMER RESEARCH, 2022, 卷号: 29 作者:  Zhang, Ping;  Zhang, Xian;  Ding, Xin;  Wang, Yanyan;  Xiao, Chao   |  收藏  |  浏览/下载：30/0  |  提交时间：2022/12/23 Segregated structure  Intermetallic compound  Thermal conductivity  Sliver interface layer   Study on the Influence of Defects on Fracture Mechanical Behavior of Cu/SAC305/Cu Solder Joint 期刊论文  OAI收割 MATERIALS, 2022, 卷号: 15, 期号: 14, 页码: 20 作者:  Zhang, Sinan;  Wang, Zhen;  Wang, Jie;  Duan, Guihua;  Li, Haixia   |  收藏  |  浏览/下载：15/0  |  提交时间：2023/02/24 Cu/SAC305/Cu solder joints  in situ tensile test  fracture analysis  X-ray mu-CT  FE simulation   DFANet: Dense Feature Augmentation Network for Printed Circuit Board Segmentation 会议论文  OAI收割 Haikou, China, 2022-08 作者:  Jie, Qin;  Jiayu, Zou;  Donghui, Li;  Xingang, Wang   |  收藏  |  浏览/下载：5/0  |  提交时间：2023/04/26 Study on the Influence of Defects on Fracture Mechanical Behavior of Cu/SAC305/Cu Solder Joint 期刊论文  OAI收割 MATERIALS, 2022, 卷号: 15, 期号: 14, 页码: 20 作者:  Zhang, Sinan;  Wang, Zhen;  Wang, Jie;  Duan, Guihua;  Li, Haixia   |  收藏  |  浏览/下载：25/0  |  提交时间：2022/08/22 Cu/SAC305/Cu solder joints  in situ tensile test  fracture analysis  X-ray mu-CT  FE simulation   Fusion Bonding Possibility for Incompatible Polymers by the Novel Ultrasonic Welding Technology: Effect of Interfacial Compatibilization 期刊论文  OAI收割 ACS OMEGA, 2022, 卷号: 7, 期号: 17, 页码: 14797-14806 作者:  Fu, Xie;  Wu, Xueli;  Huang, Guigang;  Li, Wenquan;  Kang, Shuai   |  收藏  |  浏览/下载：34/0  |  提交时间：2022/08/22 Temperature Gradient Induced Orientation Change of Bi Grains in Sn-Bi57-Ag0.7 Solder Joint 期刊论文  OAI收割 ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2022, 页码: 11 作者:  Chen, Yinbo;  Gao, Zhaoqing;  Liu, Zhi-Quan   |  收藏  |  浏览/下载：25/0  |  提交时间：2022/07/01 Sn-Bi-Ag solder  Grain orientation  Temperature gradient  Aging  Ag3Sn   Microstructural evolution and failure analysis of Sn-Bi57-Ag0.7 solder joints during thermal cycling 期刊论文  OAI收割 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 11 作者:  Chen, Yinbo;  Wang, Changchang;  Gao, Yue;  Gao, Zhaoqing;  Liu, Zhi-Quan   |  收藏  |  浏览/下载：28/0  |  提交时间：2022/01/27 BV-Net: Bin-based Vector-predicted Network for tubular solder joint detection 期刊论文  OAI收割 MEASUREMENT, 2021, 卷号: 183, 页码: 8 作者:  Zhou, Chenlin   |  收藏  |  浏览/下载：43/0  |  提交时间：2021/11/04 Object detection  Defect detection  Quality inspection  Tubular solder joint detection  Deep learning