中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
机构
采集方式
内容类型
发表日期
学科主题
筛选

浏览/检索结果: 共5条,第1-5条 帮助

条数/页: 排序方式:
Characteristics analysis of supporting and locking mechanism based on the non-circular gear compound transmission 期刊论文  OAI收割
JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY, 2020, 页码: 11
作者:  
Lin, Chao;  Hu, Yanan;  We, Yanqun;  Cai, Zhiqin
  |  收藏  |  浏览/下载:21/0  |  提交时间:2022/01/18
Effect of compaction pressure on the densification, microstructure, and mechanical properties of Ti-1Al-8V-5Fe alloy based on TiH2 and HDH-Ti powders 期刊论文  OAI收割
MICRO & NANO LETTERS, 2019, 卷号: 14, 期号: 8, 页码: 906-910
作者:  
Zhang, Yanan;  Guo, Xing;  Chen, Yungui;  Li, Qiangguo
  |  收藏  |  浏览/下载:238/0  |  提交时间:2021/02/02
Effect of compaction pressure on the densification, microstructure, and mechanical properties of Ti-1Al-8V-5Fe alloy based on TiH2 and HDH-Ti powders 期刊论文  OAI收割
MICRO & NANO LETTERS, 2019, 卷号: 14, 期号: 8, 页码: 906-910
作者:  
Zhang, Yanan;  Guo, Xing;  Chen, Yungui;  Li, Qiangguo
  |  收藏  |  浏览/下载:110/0  |  提交时间:2021/02/02
Micro-electro-mechanical systems capacitive ultrasonic transducer with a higher electromechanical coupling coefficient 期刊论文  OAI收割
Micro & Nano Letters, 2015, 卷号: 10, 期号: 10, 页码: 4
作者:  
Miao, J(苗静);  Shen, WJ(沈文江);  He, CD;  Xue, CY;  Xiong, JJ
收藏  |  浏览/下载:84/0  |  提交时间:2015/12/31
silicon  elemental semiconductors  silicon-on-insulator  wafer bonding  electromechanical effects  ultrasonic transducers  capacitive transducers  micromechanical devices  micromachining  vibrations  membranes  finite element analysis  reliability  capacitance  electromechanical coupling coefficient  capacitive micromachined ultrasonic transducer  impedance matching  propagation medium  microelectromechanical system capacitive ultrasonic transducer  silicon on insulator  wafer bonding  optimum geometric dimensions  membrane mechanical vibration  electrical characteristics  finite-element analysis  operation mode  device safety  device reliability  equivalent stress  operation-collapse voltage  bottom electrodes  glass substrate surface  parallel parasitic capacitance  Si  SiO2  
Dome design and coupled thermal-mechanical analysis of supersonic missile (EI CONFERENCE) 会议论文  OAI收割
2009 International Conference on Optical Instruments and Technology, OIT 2009, October 19, 2009 - October 22, 2009, Shanghai, China
Xing-qiao A.; Qun W.; Hong-guang J.
收藏  |  浏览/下载:55/0  |  提交时间:2013/03/25
A review of high-speed flow pressure and aerodynamic heating effect on Supersonic missile's dome is given. The dome should have excellent properties in optical  mechanical and chemical characteristics. A design of dome on supersonic mode is described according to tactical guide line of a missile. The dome made of quartz which is about 8mm thick and 141mm in window diameter. To check up the reliability of the dome  a reasonable finite element model (FEM) of dome is established  and a thermal-mechanical Analysis to the dome by finite element software NASTRAN has carried on  through these can obtained the distribution of temperature field and stress field when the speed is 2.3Ma. The results indicated that the stress was concentrated in the joint of the dome end and the Missile Section  and the maximum stress was 16.4Mpa. The stress of other nodes was smaller than the allowable stress of quartz glass. Reference to the results of the analysis  a lightweight revision to the dome structural dimension and a new method of dome fixing have put forward  which can reduce the stress concentration. 2009 SPIE.