中国科学院机构知识库网格系统: 检索

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	Terahertz Metamaterial Absorber Based on Ni-Mn-Sn Ferromagnetic Shape Memory Alloy Films 期刊论文 OAI收割 METALS, 2023, 卷号: 13, 期号: 7, 页码: 14 作者: Liu, Rui; Wang, Xiaochuan; Zhu, Jiachen; Tian, Xiaohua; Zhao, Wenbin \| 收藏 \| 浏览/下载：11/0 \| 提交时间：2024/01/08 metamaterials shape memory alloy films Ni-Mn-Sn alloy films terahertz absorber dynamic tuning
	重力对Sn-20% Ni合金的初生相形态和包晶反应的影响期刊论文 OAI收割材料研究学报, 2023, 卷号: 37, 期号: 2, 页码: 111-119 作者: 张佳俊; 罗兴宏; 孔亚非; 张桂圆; 李洋 \| 收藏 \| 浏览/下载：10/0 \| 提交时间：2024/01/08 metallic materials Sn-Ni alloy peritectic reaction drop tube microgravity solidification 金属材料 Sn-Ni合金包晶反应落管微重力凝固
	Evolution of solder wettability with growth of interfacial compounds on tinned FeNi plating 期刊论文 OAI收割 Journal of Materials Science-Materials in Electronics, 2011, 卷号: 22, 期号: 9, 页码: 1234-1238 C. Chen; L. Zhang; Q. Q. Lai; C. F. Li; J. K. Shang 收藏 \| 浏览/下载：22/0 \| 提交时间：2012/04/13 thin-films sn-ag alloy cu systems fe-42ni copper ni intermetallics solderability
	Interfacial Reactions Between In-Sn Solder and Ni-Fe Platings 期刊论文 OAI收割 Journal of Electronic Materials, 2009, 卷号: 38, 期号: 12, 页码: 2506-2515 J. P. Daghfal; P. J. Shang; Z. Q. Liu; J. K. Shang 收藏 \| 浏览/下载：16/0 \| 提交时间：2012/04/13 In-Sn solder Ni-Fe metallization interface FeSn(2) Ni(3)Sn(4) faceting in-48sn solder in-49sn solder reflow process microstructure substrate packages kinetics alloy joint ag
	Effect of Zn addition on interfacial reactions between Sn-4Ag solder and Ag substrates 期刊论文 OAI收割 Journal of Electronic Materials, 2008, 卷号: 37, 期号: 8, 页码: 1119-1129 H. F. Zou; Z. F. Zhang 收藏 \| 浏览/下载：27/0 \| 提交时间：2012/04/13 Sn-Ag-Zn lead-free solder gravity interfaces intermetallic compounds lead-free solders cu substrate bump metallization tensile properties phase-equilibria eutectic alloy ni behavior bi microstructure
	Synthesis and properties of bulk metallic glasses in the ternary Ni-Nb-Zr alloy system 期刊论文 OAI收割 Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2008, 卷号: 492, 期号: 1-2, 页码: 221-229 Z. W. Zhu; H. F. Zhang; B. Z. Ding; Z. Q. Hu 收藏 \| 浏览/下载：34/0 \| 提交时间：2012/04/13 bulk metallic glass Ni-based alloy thermal property mechanical property corrosion resistance high corrosion-resistance amorphous-alloys mechanical-properties enhanced plasticity high-strength compressive plasticity forming ability sn mm microstructure
	Strong composition-dependence on glass-forming ability in Ni-(Ti,Zr)-Si pseudo-ternary alloys 期刊论文 OAI收割 Journal of Alloys and Compounds, 2006, 卷号: 422, 期号: 1-2, 页码: 86-91 H. Yang; J. Q. Wang; Y. Li 收藏 \| 浏览/下载：30/0 \| 提交时间：2012/04/14 metallic glasses Ni-based alloy casting thermal analysis bulk amorphous-alloys metallic-glass supercooled liquid system sn zr41.2ti13.8cu12.5ni10.0be22.5 science mm
	Interfacial reaction between eutectic Sn-58Bi lead-free solder and electroless Ni-P plating 期刊论文 OAI收割 ACTA METALLURGICA SINICA, 2004, 卷号: 40, 期号: 8, 页码: 815-821 作者: Li, F; Liu, CZ; Xian, AP; Shang, JK \| 收藏 \| 浏览/下载：11/0 \| 提交时间：2021/02/02 Sn-Bi alloy lead-free solder interfacial reaction intermetallic compound electroless Ni-P plating
	Nanostructured Ti-based multi-component alloys with potential for biomedical applications 期刊论文 OAI收割 Biomaterials, 2003, 卷号: 24, 期号: 28, 页码: 5115-5120 G. He; J. Eckert; Q. L. Dai; M. L. Sui; W. Loser; M. Hagiwara; E. Ma 收藏 \| 浏览/下载：24/0 \| 提交时间：2012/04/14 Ti-Cu-Ni-Sn-Nb(Ta Mo) alloy biomedical materials nanostructure composite mechanical property yield strength elastic modulus bulk metallic-glass enhanced plasticity microstructure stability composite behavior copper ta