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	The interfacial reaction between In-48Sn solder and polycrystalline Cu substrate during solid state aging 期刊论文 OAI收割 JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 740, 页码: 500-509 作者: Tian, FF; Li, CF; Zhou, M; Liu, ZQ; Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China. \| 收藏 \| 浏览/下载：24/0 \| 提交时间：2018/06/05 Heterogeneous Binary-systems Chemical-compound Layers 2 Elementary Substances Eutectic Snin Solder Intermetallic Compounds Phase Identification Reaction-diffusion Growth-kinetics Joint Transformations
	Phase identification on the intermetallic compound formed between eutectic SnIn solder and single crystalline Cu substrate 期刊论文 OAI收割 Journal of Alloys and Compounds, 2014, 卷号: 591, 页码: 351-355 F. F. Tian; Z. Q. Liu; P. J. Shang; J. D. Guo 收藏 \| 浏览/下载：29/0 \| 提交时间：2014/04/18 Phase identification Interface IMC Eutectic SnIn solder Single crystalline Cu gamma-angular correlations lead-free solders joint reliability growth-kinetics system equilibria mechanisms interfaces diffusion layer
	Precise Cr-marker investigation on the reactive interface in the eutectic SnIn solder joint 期刊论文 OAI收割 Materials Letters, 2014, 卷号: 121, 页码: 185-187 F. F. Tian; P. J. Shang; Z. Q. Liu 收藏 \| 浏览/下载：19/0 \| 提交时间：2014/07/03 Interfaces Intermetallic alloys and compounds Diffusion Kirkendall void SnIn solder cu substrate growth-kinetics snagcu solder diffusion compound identification ni
	Intermetallic compound identification and Kirkendall void formation in eutectic SnIn/Cu solder joint during solid-state aging 期刊论文 OAI收割 Philosophical Magazine Letters, 2011, 卷号: 91, 期号: 6, 页码: 410-417 P. J. Shang; Z. Q. Liu; D. X. Li; J. K. Shang 收藏 \| 浏览/下载：23/0 \| 提交时间：2012/04/13 diffusion intermetallic compounds SnIn solder interfaces Kirkendall void cu-sn interface reliability diffusion systems growth