机构

• 金属研究所 [19]
• 合肥物质科学研究院 [3]
• 上海应用物理研究所 [1]

采集方式

• OAI收割 [23]

内容类型

• 期刊论文 [23]

发表日期

• 2023 [1]
• 2020 [5]
• 2019 [2]
• 2018 [3]
• 2016 [1]
• 2015 [1]
• 更多

学科主题

筛选

浏览/检索结果: 共23条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择题名升序题名降序提交时间升序提交时间降序作者升序作者降序发表日期升序发表日期降序 Strong Connection of Single-Wall Carbon Nanotube Fibers with a Copper Substrate Using an Intermediate Nickel Layer 期刊论文  OAI收割 ACS NANO, 2023, 卷号: 17, 期号: 18, 页码: 18290-18298 作者:  Gao, Zhaoqing;  Xu, Lele;  Jiao, Xinyu;  Li, Xin;  He, Chengjian   |  收藏  |  浏览/下载：17/0  |  提交时间：2024/01/08 single-wall carbon nanotube fiber  heterogeneous interconnection  interfacial bonding  electrical conductivity  soldering  intermediate Ni layer   The interfacial reaction and microstructure of Co/In/Cu sputtering target assembly after soldering 期刊论文  OAI收割 MICROELECTRONICS RELIABILITY, 2020, 卷号: 113, 页码: 6 作者:  Liu, Zhi-Quan;  Meng, Zhi-Chao;  Wu, Di;  Shang, Zhengang   |  收藏  |  浏览/下载：43/0  |  提交时间：2021/02/02 Co sputtering target  Soldering assembly  Interface  IMC  Growth mechanism   Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文  OAI收割 JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9 作者:  Gao, Li-Yin;  Cui, Xian-Wei;  Tian, Fei-Fei;  Liu, Zhi-Quan   |  收藏  |  浏览/下载：21/0  |  提交时间：2021/02/02 Mixed soldering  ball grid array  solidification  crack  shrinkage  failure mechanism   Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文  OAI收割 JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9 作者:  Gao, Li-Yin;  Cui, Xian-Wei;  Tian, Fei-Fei;  Liu, Zhi-Quan   |  收藏  |  浏览/下载：17/0  |  提交时间：2021/02/02 Mixed soldering  ball grid array  solidification  crack  shrinkage  failure mechanism   Development and Test Results of a Full-Size Joint Sample for the CFETR Central Solenoid Model Coil 期刊论文  OAI收割 IEEE TRANSACTIONS ON PLASMA SCIENCE, 2020, 卷号: 48 作者:  Ma, Guanghui;  Wu, Yu;  Qin, Jinggang;  Liu, Huajun;  Hao, Qiangwang   |  收藏  |  浏览/下载：56/0  |  提交时间：2020/10/26 Conductors  Welding  Cable shielding  Resistance  Steel  Soldering  Silver  Cable-in-conduit conductor (CICC)  central solenoid model coil (CSMC)  Chinese Fusion Engineering Testing Reactor (CFETR)  dc resistance  joint   Fabrication and Test of Diameter 35 mm Iron-Based Superconductor Coils 期刊论文  OAI收割 IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, 2020, 卷号: 30 作者:  Zhang, Zhan;  Wang, Dongliang;  Liu, Fang;  Jiange, Donghui;  Wei, Shaoqing   |  收藏  |  浏览/下载：66/0  |  提交时间：2020/11/26 Coils  Heat treatment  Soldering  Critical current density (superconductivity)  Yttrium barium copper oxide  Copper  Critical current  High field  Iron-based superconductor  IBS application   A new quantizing insulator soldering technology scheme for microwave module 期刊论文  OAI收割 MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, 2019, 卷号: 61, 期号: 4, 页码: 979-984 作者:  Tian, Fei-Fei;  Zhou, Ming;  Zhang, Jun Zhi   |  收藏  |  浏览/下载：17/0  |  提交时间：2021/02/02 microwave module  quatization  soldering  solid solder ring   A new quantizing insulator soldering technology scheme for microwave module 期刊论文  OAI收割 MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, 2019, 卷号: 61, 期号: 4, 页码: 979-984 作者:  Tian, Fei-Fei;  Zhou, Ming;  Zhang, Jun Zhi   |  收藏  |  浏览/下载：14/0  |  提交时间：2021/02/02 microwave module  quatization  soldering  solid solder ring   Nanosecond-Laser-Based Charge Transfer Plasmon Engineering of Solution-Assembled Nanodimers 期刊论文  OAI收割 NANO LETTERS, 2018, 卷号: 18, 期号: 11, 页码: 7014-7020 作者:  Fang, Lingling;  Liu, Dilong;  Wang, Yueliang;  Li, Yanjuan;  Song, Lei   |  收藏  |  浏览/下载：76/0  |  提交时间：2019/12/25 Nanoparticles  Ag ion soldering  nanosecond laser  charge tranfser plasmon  self-assembly  DNA   Oxidation Behavior at the Frontier of Ultrasonic-induced Solder Spreading on the Aluminum Alloy Surface 期刊论文  OAI收割 RARE METAL MATERIALS AND ENGINEERING, 2018, 卷号: 47, 期号: 11, 页码: 3426-3432 作者:  Xu Zhiwu;  Li Zhengwei;  Luo Xiaoyu;  Ji Shude;  Yan Jiuchun   |  收藏  |  浏览/下载：15/0  |  提交时间：2021/02/02 ultrasonic soldering  spreading frontier  oxide film  finite element simulation  elimination measure