机构

• 近代物理研究所 [2]
• 金属研究所 [1]
• 长春光学精密机械与物... [1]

采集方式

• OAI收割 [4]

内容类型

• 期刊论文 [3]
• 会议论文 [1]

发表日期

• 2024 [1]
• 2004 [3]

学科主题

筛选

浏览/检索结果: 共4条，第1-4条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择作者升序作者降序发表日期升序发表日期降序题名升序题名降序提交时间升序提交时间降序 Bulk ytterbium aluminosilicate glass with excellent mechanical properties and plasma etching resistance 期刊论文  OAI收割 JOURNAL OF NON-CRYSTALLINE SOLIDS, 2024, 卷号: 642, 页码: 7 作者:  Zhang, Yongheng;  Chen, Jixin;  Zhang, Hao;  Lei, Yiming   |  收藏  |  浏览/下载：1/0  |  提交时间：2025/04/27 Ytterbium aluminosilicate glass  Bulk materials  Embedding method  Mechanical properties  Plasma etching resistance   Bulk and track etching of PET studied by spectrophotometer 期刊论文  OAI收割 RADIATION MEASUREMENTS, 2004, 卷号: 38, 期号: 4, 页码: 255-261 作者:  Zhu, ZY;  Duan, JL;  Maekawa, Y;  Koshikawa, H;  Yoshida, M   |  收藏  |  浏览/下载：51/0  |  提交时间：2010/10/29 polyethyleneterephthalate  bulk and track etching  UV light illumination  spectrophotometer   Role of UV light illumination and DMF soaking in production of PET ion track membranes 期刊论文  OAI收割 NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS, 2004, 卷号: 217, 页码: 449-456 作者:  Zhu, Z;  Maekawa, Y;  Koshikawa, H;  Suzuki, Y;  Yonezawa, N   |  收藏  |  浏览/下载：29/0  |  提交时间：2018/05/31 polyethyleneterephthalate  bulk etching  track etching  UV light illumination  track membrane   Study on optical parts of MOEMS optical switch with low insertion loss (EI CONFERENCE) 会议论文  OAI收割 MEMS/MOEMS Technologies and Applications II, November 10, 2004 - November 12, 2004, Beijing, China 作者:  Wang W.;  Wang L.;  Wang L.;  Wang L.;  Chen W. 收藏  |  浏览/下载：54/0  |  提交时间：2013/03/25 We study insertion losses of optical switch when the laser beam is propagating during the free space between two single mode fibers (SMFs) and the related assemblage challenges  Then a new packaging structure is developed for the hybrid-integration of free-space MOEMS (micro-opto-electro-mechanical systems) chip with a silicon micromachined submount to improve alignment accuracy. The submount is designed to accommodate various free-space MOEMS chips with minimal active optical alignment  thus reducing the packaging cost. The silicon submount has a central recess to place the MOEMS chip in  sixteen V-grooves for optical fibers  and micropits for micro ball lenses  all bulk micromachined at the same time by a single anisotropic wet etching step. A corner compensation technique is employed to prevent erosion of the convex corners  where different geometries meet. Through this assembling method  the fiber  micro ball lens can be aligned preciously thus reduced lateral and angular misalignment between them. Then total insertion losses can be decreased.