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Chinese Academy of Sciences Institutional Repositories Grid
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金属研究所 [17]
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期刊论文 [28]
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Realization and Characterization of a Bulk-Type All-Silicon High Pressure Sensor
期刊论文
OAI收割
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2018, 卷号: 27, 期号: 2, 页码: 231-238
作者:
Chan, Elena
;
Lin, Dequan
;
Lu, Lei
;
Zhang, Deqiang
;
Guo, Shichao
  |  
收藏
  |  
浏览/下载:74/0
  |  
提交时间:2018/09/26
Pressure sensor
piezoresistive
MEMS
silicon
bulk
eutectic bonding
Realization and Characterization of a Bulk-Type All-Silicon High Pressure Sensor
期刊论文
OAI收割
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2018, 卷号: 27, 期号: 2, 页码: 231-238
作者:
Chan, Elena
;
Lin, Dequan
;
Lu, Lei
;
Zhang, Deqiang
;
Guo, Shichao
  |  
收藏
  |  
浏览/下载:59/0
  |  
提交时间:2018/09/26
Pressure sensor
piezoresistive
MEMS
silicon
bulk
eutectic bonding
Molecular dynamics simulation overcoming the finite size effects of thermal conductivity of bulk silicon and silicon nanowires
期刊论文
OAI收割
MODELLING AND SIMULATION IN MATERIALS SCIENCE AND ENGINEERING, 2016, 卷号: 24, 期号: 4, 页码: 45005
作者:
Hou, Chaofeng
;
Xu, Ji
;
Ge, Wei
;
Li, Jinghai
收藏
  |  
浏览/下载:50/0
  |  
提交时间:2016/07/15
molecular dynamics simulation
size effect
thermal conductivity
silicon nanowires
bulk silicon
Total energy equation leading to exchange-correlation functional
期刊论文
OAI收割
Science China-Physics Mechanics & Astronomy, 2015, 卷号: 58, 期号: 5, 页码: 54601
作者:
Liu F(刘峰)
;
Wang ZQ(王自强)
收藏
  |  
浏览/下载:102/0
  |  
提交时间:2015/06/11
Density-functional theory
exchange-correlation functional
bulk modulus
band structure
aluminum
silicon
Wafer-Level Vacuum Packaging for MEMS Resonators Using Glass Frit Bonding
期刊论文
OAI收割
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2012, 卷号: 21, 期号: 6, 页码: 1484-1491
Wu, GQ
;
Xu, DH
;
Xiong, B
;
Wang, YC
;
Wang, YL
;
Ma, YL
收藏
  |  
浏览/下载:131/0
  |  
提交时间:2013/04/23
Bulk mode
glass frit bonding
microelectromechanical systems (MEMS)
redistribution
resonators
silicon bumps
vacuum package
wafer-level package
Thermocapillary Actuation of Droplets on a Microfluidic Chip
期刊论文
OAI收割
JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 2012, 卷号: 26, 期号: 41625, 页码: 2165-2176
Gao, AR
;
Liu, X
;
Li, T
;
Gao, XL
;
Wang, YL
收藏
  |  
浏览/下载:100/0
  |  
提交时间:2013/04/23
Droplets
thermal gradient
silicon bulk process
contact angle hysteresis
Surface strengthening of Ti(3)SiC(2) through magnetron sputtering of Mo and Zr and subsequent annealing
期刊论文
OAI收割
Journal of the European Ceramic Society, 2010, 卷号: 30, 期号: 10, 页码: 2123-2130
H. P. Guo
;
A. J. Li
;
J. Zhang
;
L. F. He
;
Y. C. Zhou
收藏
  |  
浏览/下载:46/0
  |  
提交时间:2012/04/13
Ti(3)SiC(2)
Surface strengthening
Magnetron sputtering
Microhardness
titanium-silicon carbide
mechanical-properties
oxidation behavior
damage tolerance
bulk ceramics
microstructure
temperature
diffusion
composites
kinetics
The mechanism of peo process on al-si alloys with the bulk primary silicon
期刊论文
iSwitch采集
Applied surface science, 2009, 卷号: 255, 期号: 23, 页码: 9531-9538
作者:
Xu, Fangtao
;
Xia, Yuan
;
Li, Guang
收藏
  |  
浏览/下载:103/0
  |  
提交时间:2019/05/10
Peo
Al-si alloys
Bulk primary silicon
Dentrite silicon
Mechanical and Thermophysical Properties of Zr-Al-Si-C Ceramics
期刊论文
OAI收割
Journal of the American Ceramic Society, 2009, 卷号: 92, 期号: 2, 页码: 445-451
L. F. He
;
Y. W. Bao
;
J. Y. Wang
;
M. S. Li
;
Y. C. Zhou
收藏
  |  
浏览/下载:46/0
  |  
提交时间:2012/04/13
thermal-conductivity
crystal-structure
high-temperature
thermoelectric properties
silicon-carbide
grain-boundary
bulk
zr2al3c4
oxidation
zr3al3c5
microstructure
Microstructure and mechanical and thermal properties of ternary carbides in Hf-Al-C system
期刊论文
OAI收割
Acta Materialia, 2009, 卷号: 57, 期号: 9, 页码: 2765-2774
L. F. He
;
Y. W. Bao
;
J. Y. Wang
;
M. S. Li
;
Y. C. Zhou
收藏
  |  
浏览/下载:31/0
  |  
提交时间:2012/04/13
Carbides
TEM
High temperature
Mechanical property
Thermal property
high-temperature
elastic properties
crystal-structure
thermoelectric
properties
internal-friction
silicon carbides
grain-boundary
bulk
zr2al3c4
ceramics
oxidation