中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
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CAS IR Grid
机构
长春光学精密机械与物... [3]
地理科学与资源研究所 [1]
数学与系统科学研究院 [1]
心理研究所 [1]
昆明植物研究所 [1]
沈阳自动化研究所 [1]
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OAI收割 [8]
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会议论文 [4]
期刊论文 [4]
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2024 [1]
2023 [1]
2015 [2]
2011 [1]
2010 [1]
2005 [2]
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学科主题
Plant Scie... [1]
工业与组织心理学 [1]
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When green transportation backfires: High-speed rail's impact on transport-sector carbon emissions from 315 Chinese cities
期刊论文
OAI收割
SUSTAINABLE CITIES AND SOCIETY, 2024, 卷号: 114, 页码: 105770
作者:
Ou, Yifu
;
Zheng, Ji
;
Liang, Yuan
;
Bao, Zhikang
  |  
收藏
  |  
浏览/下载:21/0
  |  
提交时间:2024/10/21
High-speed rail
Network accessibility
Carbon emissions
2SLS
Transport substitution
Induced-demand effect
The legacy effects of rubber defoliation period on the refoliation phenology, leaf disease, and latex yield
期刊论文
OAI收割
PLANT DIVERSITY, 2023, 卷号: 45, 期号: 1, 页码: 98-103
作者:
Zhai,De-Li
;
Xu,Jian-Chu
  |  
收藏
  |  
浏览/下载:18/0
  |  
提交时间:2024/05/09
Carbohydrate
Defoliation
Legacy effect
Phenology
Rubber trees
TROPICAL FORESTS
CLIMATE-CHANGE
XISHUANGBANNA
TREES
BIODIVERSITY
EXPANSION
IMPACTS
DEMAND
YUNNAN
Evolving competition between Hong Kong and Shenzhen ports
期刊论文
OAI收割
MARITIME POLICY & MANAGEMENT, 2015, 卷号: 42, 期号: 8, 页码: 729-745
作者:
  |  
收藏
  |  
浏览/下载:21/0
  |  
提交时间:2018/07/30
competition
container throughput
econometric model
Granger causality
competition coefficient
demand effect
通信行业工作特征对员工生活满意度的溢出效应:基于工作要求-资源模型的探索
期刊论文
OAI收割
人类工效学, 2015, 卷号: 21, 期号: 5, 页码: 007-011
作者:
李颖
;
王广曦
;
李丹
;
李永娟
收藏
  |  
浏览/下载:46/0
  |  
提交时间:2016/09/19
工作要求-资源模型
溢出效应
生活满意度
通信
人力资源
组织行为学
job demand-resource model
spillover effect
life satisfaction
communication
human resources
organizational behavior
Design of stable image platform on airborne camera (EI CONFERENCE)
会议论文
OAI收割
2011 International Conference on Advanced Design and Manufacturing Engineering, ADME 2011, September 16, 2011 - September 18, 2011, Guangzhou, China
作者:
Yang L.
;
Yang L.
收藏
  |  
浏览/下载:21/0
  |  
提交时间:2013/03/25
Modulation transfer function resulting from random vibration was analyzed. To conclude that the effect of angular displacement was the major factor. Allowable MTF degradation was represented
and 34dB reduction was achieved at frequency of 100HZ. With the help of MSC.ADAMS simulation software
and convert allowable MTF degradation into stable system design parameters
simulated curve proves correct for isolator
which can guide perfect design for stabilization system. Based on the spatial mechanism and translational principle of parallelogram
and the irrotational displacement mechanism was tested by optical method
an irrotational displacement isolator was developed. It can meet the requirements of irrotational displacement and damp. An instance was given
coupled angle is less than 8?
it can satisfy the demand of aerial imaging. (2011) Trans Tech Publications.
Congestion control for industrial wireless communication gateway
会议论文
OAI收割
2010 International Conference on Intelligent Computation Technology and Automation, ICICTA 2010, Changsha, China, May 11-12, 2010
作者:
Tang Z(唐忠)
;
Mei, Zhan
;
Wang H(王宏)
收藏
  |  
浏览/下载:28/0
  |  
提交时间:2016/06/06
industrial wireless communication
IEEE802.15.4
Funneling effect
gateway
on-demand TDMA extension
priority-based communication scheduling
Mechanical interleaving assembly of TDICCD focal plane for space camera (EI CONFERENCE)
会议论文
OAI收割
ICO20: Optical Devices and Instruments, August 21, 2005 - August 26, 2005, Changchun, China
作者:
Ren J.-Y.
;
Zhang X.-X.
收藏
  |  
浏览/下载:32/0
  |  
提交时间:2013/03/25
TDICCD assembly is a major method of acquiring wide field for space camera. For the demand of space camera's wide view field and high resolution
the technique of mechanical interleaving assembly is discussed. Its principle
method of adjusting and testing as well as the structure of focal plane are described. Using mechanical tangent-screws adjusting method
the assembly with TDI CCDs for wide field space camera focal plane is finished on the facility which is composed of a long work-distance microscope and a negative pressure and adsorption guide apparatus. The assembly length of TDICCD focal plane for wide field space camera reaches 560mm
and the measuring error is not more than 3.2 m
the mechanical interleaving assembly method has effect of zero clearance and can achieve good image quality.
Study on LD-pumped Nd:YAG laser cutter (EI CONFERENCE)
会议论文
OAI收割
ICO20: Lasers and Laser Technologies, August 21, 2005 - August 26, 2005, Changchun, China
作者:
Zhang G.
;
Zhang G.
;
Zhang G.
;
Zhang J.
;
Zhang J.
收藏
  |  
浏览/下载:28/0
  |  
提交时间:2013/03/25
The theory of laser cutter and the technology neck is analyzed. We can conclude that it is almost impossible to deal with the waste thick silicon wafers which are yielded in producing silicon wafers by conventional eroding or diamond cutting
when the cutting velocity equals 100mm/min
while it is also unperfected with ecumenical laser cutter without good beam quality or precise laseroptics system. It is represented that high average power and high repetition rate laser with good beam quality and precise laseroptics system are pivotal to obtain excellent cutting effect such as thick groove depth
double-layer 0.75mm thick silicon wafer can be penetrated.. The cross section is fine and the groove is narrow
rapid cutting speed
the cutting quality meets the expecting demand.
fine kerf section without considering the effect of technique. Considering laser medium thermal lens effect and thermal focal length changing with pumping power
using plano-convex high reflectivity mirror as the back cavity mirror to compensate the heat lens influence
a /4 waveplate to compensate heat -induced birefraction
utilize the Nd:YAG self- aperture effect
more than 50 W average power 1.064 um IR output is obtained with beam quality factor (M2) equals 3.19. Through the LD-Pumped Nd:YAG laser cutter we developed with short focus length negative spherical aberration focusing lens
double axis linear step motor positioning system
suitable beam expander multiplying factor
appropriate diameter of exit beam aperture
proper repetition rate
when the cutting velocity equals 400mm/min
0.75mm thick silicon wafer can be penetrated