机构

• 长春光学精密机械与物... [1]
• 数学与系统科学研究院 [1]
• 上海微系统与信息技术... [1]
• 兰州化学物理研究所 [1]

采集方式

• OAI收割 [4]

内容类型

• 期刊论文 [3]
• 会议论文 [1]

发表日期

• 2018 [1]
• 2014 [1]
• 2012 [1]
• 2004 [1]

学科主题

• Engineerin... [1]
• 材料科学与物理化学 [1]

筛选

浏览/检索结果: 共4条，第1-4条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择题名升序题名降序提交时间升序提交时间降序作者升序作者降序发表日期升序发表日期降序 Development of a Novel CMUT-Based Concentric Dual-Element Ultrasonic Transducer: Design, Fabrication, and Characterization 期刊论文  OAI收割 JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2018, 卷号: 27, 期号: 3, 页码: 538-546 作者:  Zheng, Zhou;  Na, Shuai;  Chen, Albert I. -Hsiang;  Li, Zhenhao;  Wong, Lawrence L. P.   |  收藏  |  浏览/下载：45/0  |  提交时间：2018/07/30 Annular element  capacitive micromachined ultrasonic transducer (CMUT)  concentric  deep reactive-ion etching  dual-element  hybrid transducer   Rational construction of three dimensional hybrid Co(3)O4@NiMoO4 nanosheets array for energy storage application 期刊论文  OAI收割 Journal of Power Sources, 2014, 卷号: 270, 页码: 516-525 作者:  Hong W(洪伟);  Wang JQ(王金清);  Gong PW(公培伟);  Sun JF(孙金凤);  Niu LY(牛棱渊) 收藏  |  浏览/下载：18/0  |  提交时间：2014/12/13 Hybrid nanostructures  Alkali etching  Cobalt oxide  Nickel molybdate  Supercapacitors   High Q Single Crystal Silicon Micromechanical Resonators With Hybrid Etching Process 期刊论文  OAI收割 IEEE SENSORS JOURNAL, 2012, 卷号: 12, 期号: 7, 页码: 2414-2415 Wu, GQ; Xu, DH; Xiong, B; Wang, YL 收藏  |  浏览/下载：22/0  |  提交时间：2013/04/23 Dry release fabrication  hybrid etching  micromechanical resonators  pre-etched cavity   Study on optical parts of MOEMS optical switch with low insertion loss (EI CONFERENCE) 会议论文  OAI收割 MEMS/MOEMS Technologies and Applications II, November 10, 2004 - November 12, 2004, Beijing, China 作者:  Wang W.;  Wang L.;  Wang L.;  Wang L.;  Chen W. 收藏  |  浏览/下载：32/0  |  提交时间：2013/03/25 We study insertion losses of optical switch when the laser beam is propagating during the free space between two single mode fibers (SMFs) and the related assemblage challenges  Then a new packaging structure is developed for the hybrid-integration of free-space MOEMS (micro-opto-electro-mechanical systems) chip with a silicon micromachined submount to improve alignment accuracy. The submount is designed to accommodate various free-space MOEMS chips with minimal active optical alignment  thus reducing the packaging cost. The silicon submount has a central recess to place the MOEMS chip in  sixteen V-grooves for optical fibers  and micropits for micro ball lenses  all bulk micromachined at the same time by a single anisotropic wet etching step. A corner compensation technique is employed to prevent erosion of the convex corners  where different geometries meet. Through this assembling method  the fiber  micro ball lens can be aligned preciously thus reduced lateral and angular misalignment between them. Then total insertion losses can be decreased.