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	Monolithic integration of tandem-FAIMS based on overlapping ion peak separation and weak ion peak discovery for gas detection 期刊论文 OAI收割 SENSORS AND ACTUATORS B-CHEMICAL, 2022, 卷号: 362 作者: Liu, Shaomin; Li, Shan; Liu, Youjiang; Jin, Jiao; Ma, He \| 收藏 \| 浏览/下载：22/0 \| 提交时间：2022/12/23 Ion mobility spectrometry Tandem-FAIMS Micro electro mechanical systems Separation of ion peak
	Design of a high precision digital interface circuit for capacitive MEMS accelerometers with floating point 期刊论文 OAI收割 INTEGRATION-THE VLSI JOURNAL, 2017, 卷号: 59, 页码: 247-254 作者: Li, Zongwei; Xiong, Xingyin; Liu, Xiong; Han, Kedu; Cong, Ning \| 收藏 \| 浏览/下载：30/0 \| 提交时间：2017/11/24 Micro-electro-mechanical systems (MEMS) Interface circuit Sigma-delta Analog-to-digital converter (ADC)
	Design of MEMS-based micro-filter integrating grating and tunable Fabry-Perot cavity 期刊论文 OAI收割 INTERNATIONAL JOURNAL OF NANOTECHNOLOGY, 2015, 卷号: 12, 期号: 10-12, 页码: 829-837 作者: Shi, Zhendong; Fang, Liang; Zhou, Chongxi 收藏 \| 浏览/下载：22/0 \| 提交时间：2016/02/03 integrated optics devices micro-electro-mechanical-systems filters gratings
	Patent Analysis and Technology Foresight on Micro/Nano Power Generation 会议论文 OAI收割 the 2nd global techmining conference, montreal, canada, 2012-09-05 作者: Zhang X(张娴); Zhang X(张娴); Zhang X(张娴); Zhang X(张娴) 收藏 \| 浏览/下载：28/0 \| 提交时间：2012/10/30 micro/nano power generation micro electro mechanical systems MEMS nano-electromechanical system NEMS thermoelectricity patent intellectual property
	Proposal and investigation for a planar MOEMS 18 wavelength-selective switch (EI CONFERENCE) 会议论文 OAI收割 MEMS/MOEMS Technologies and Applications III, November 12, 2007 - November 14, 2007, Beijing, China 作者: Li W.; Li W. 收藏 \| 浏览/下载：100/0 \| 提交时间：2013/03/25 This paper presents a new wavelength-selective switch by combining silicon micromaching and microassembly techniques. The 18 wavelength-selective switch (WSS) based on micro electro mechanical systems (MEMS) technology is proposed and fabricated with micro electromagnetic actuators 8 WXC prototype node is implemented by using 18 WSSs as building elements. The working principle and the configuration of the micro electromagnetic actuator are illuminated. By analysis reflecting prisms and narrow-band thin films filters. And a 8 the property suits for the application when the inputs are 2V and the best fiber-to-fiber insertion loss 5dB is gotten.
	The packaging technology of optical switch arrays (EI CONFERENCE) 会议论文 OAI收割 ICO20: MEMS, MOEMS, and NEMS, August 21, 2005 - August 26, 2005, Changchun, China 作者: Chen W.; Wang W.; Zhao L.; Wang W.; Wang L. 收藏 \| 浏览/下载：21/0 \| 提交时间：2013/03/25 Optical switch is one of key supporting technologies in all-optical-network (AON). And electrostatic MOEMS (Micro-Optical-Electro-Mechanical Systems) switch plays a very important role in all the researched switches because of their excellent features including low insertion low crosstalk and scalability. But the packaging technology has been limiting the development of optical switch. In this paper the authors study the laser beam propagating during the free space and select collimator design the pedestal to packaging and address aspects of the insertion loss that are most important loss mechanisms for the 2D cross-connect switch.
	Study on optical parts of MOEMS optical switch with low insertion loss (EI CONFERENCE) 会议论文 OAI收割 MEMS/MOEMS Technologies and Applications II, November 10, 2004 - November 12, 2004, Beijing, China 作者: Wang W.; Wang L.; Wang L.; Wang L.; Chen W. 收藏 \| 浏览/下载：31/0 \| 提交时间：2013/03/25 We study insertion losses of optical switch when the laser beam is propagating during the free space between two single mode fibers (SMFs) and the related assemblage challenges Then a new packaging structure is developed for the hybrid-integration of free-space MOEMS (micro-opto-electro-mechanical systems) chip with a silicon micromachined submount to improve alignment accuracy. The submount is designed to accommodate various free-space MOEMS chips with minimal active optical alignment thus reducing the packaging cost. The silicon submount has a central recess to place the MOEMS chip in sixteen V-grooves for optical fibers and micropits for micro ball lenses all bulk micromachined at the same time by a single anisotropic wet etching step. A corner compensation technique is employed to prevent erosion of the convex corners where different geometries meet. Through this assembling method the fiber micro ball lens can be aligned preciously thus reduced lateral and angular misalignment between them. Then total insertion losses can be decreased.