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	Grouping Method of Semiconductor Bonding Equipment Based on Clustering by Fast Search and Find of Density Peaks for Dynamic Matching According to Processing Tasks 期刊论文 OAI收割 PROCESSES, 2019, 卷号: 7, 期号: 9, 页码: 1-24 作者: Qiao, Feng; Gao ZJ(高治军); Si W(司雯); Han ZH(韩忠华); Peng, Jiayu \| 收藏 \| 浏览/下载：63/0 \| 提交时间：2019/11/13 semiconductor bonding equipment-grouping method graph theory association matrix CFSFDP algorithm
	High Power (27 W) Semiconductor Disk Laser Based on Pre-Metalized Diamond Heat-Spreader 期刊论文 OAI收割 IEEE Photonics Journal, 2019, 卷号: 11, 期号: 2 作者: G.-Y.Hou; S.-L.Shu; J.Feng; A.Popp; B.Schmidt \| 收藏 \| 浏览/下载：65/0 \| 提交时间：2020/08/24 Semiconductor lasers,Binary alloys,Copper alloys,Diamonds,Heat resistance,Heating equipment,Mergers and acquisitions,Metallizing
	Research of Material Transfer Software Platform in IC Equipment Controlling System 会议论文 OAI收割 2013 4th IEEE International Conference on Software Engineering and Service Science (ICSESS), Beijing, China, May 23-25, 2013 作者: Wang YN(王亚楠); Liu MZ(刘明哲); Liu YF(刘元峰) 收藏 \| 浏览/下载：29/0 \| 提交时间：2013/12/26 semiconductor equipment control system material transfer versatility rapid development
	Design of the real-time autofocusing system for collimator with long focus length and large aperture (EI CONFERENCE) 会议论文 OAI收割 2011 International Academic Conference on Numbers, Intelligence, Manufacturing Technology and Machinery Automation, MAMT 2011, December 24, 2011 - December 25, 2011, Wuhan, China 作者: Zhang X.; Zhang X.; Zhang X. 收藏 \| 浏览/下载：42/0 \| 提交时间：2013/03/25 Large aperture collimator which has been widely used for calibrating and testing various optical devices plays an essential role in correlative laboratories. As being the basic testing and calibration equipment the large aperture collimator's accuracy should be much higher than the device under testing in order to ensure the accuracy of the measurement. However the process of adjusting the collimator is extremely complicated due to the collimator's large aperture and long focal length. So it is difficult to ensure the measurement's quality and easy to cause the system being vulnerable to the surrounding environment. One of the most common problems is defocus. In order to solve the problem above this issue presents a new type of autocollimator autofocusing system which uses pentaprism instead of using large-aperture plane mirror semiconductor lasers as light source and CCD sensor as receiver. The system is smaller lighter and more convenient when using. The computer simulation shows that the autofocusing system's resolution could reach the accuracy of 40m. If we use the relevant algorithms to execute the sub-pixel scanning the resolution could reach the accuracy of 10m. It shows that the system could satisfy the required testing precision of testing large aperture optical device.
	Research and implementation of the interface a data collection management 会议论文 OAI收割 2012 2nd International Conference on Consumer Electronics, Communications and Networks, CECNet 2012, Yichang, China, April 21-23, 2012 作者: Ye JF(叶家发); Liu MZ(刘明哲); Wang YN(王亚楠) 收藏 \| 浏览/下载：32/0 \| 提交时间：2012/12/28 semiconductor equipment factory automation Interface A data collection
	The spectral feature analysis of semiconductor thin disk laser (EI CONFERENCE) 会议论文 OAI收割 Optoelectronic Materials and Devices II, November 2, 2007 - November 5, 2007, Wuhan, China 作者: Li J.; Wang L.-J.; Wang L.-J.; Ning Y.-Q.; Li J. 收藏 \| 浏览/下载：24/0 \| 提交时间：2013/03/25 The semiconductor thin disk laser is a new type of semiconductor laser. This work gives the basic operation function of semiconductor disk laser and analyses the heat effect by the experimentally measured photoluminescence spectrum of the laser chip at different pump power and different temperature. We can see that: with increasing pump power the thermal effects of the gain material becomes seriously and causes the saturation of carrier lifetime so the electron-hole pair created in the absorbtion layer have no enough time to rate to one of the wells and the non-radiative recombination happens in the barrier. When the thermal effects becomes stronger the chip will not lasing. This phenomenon is from the smaller energy offset between barrier and quantum well. We optimize the original structure design and experimental technology. A non-absorbing AlGaAs layer who is transparent to the pumping and laser wavelength is added to confine the carriers in the quantum wells. At the same time a DBR with double reflecting band is induced to improve the absorbing efficiency of the pumping light. The single QW is replaced by the three narrow QWs This three QWs structure can add the quantum state of QW increase the recombination probability of carriers in the QWs and reduce the heat effect. The chemical etch equipment is also improved to control the surface unevenness to be within 50 nm.