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浏览/检索结果: 共64条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择题名升序题名降序提交时间升序提交时间降序作者升序作者降序发表日期升序发表日期降序 Indium mineralization and genesis of the Bainiuchang Ag-Sn-polymetallic deposit in southeast Yunnan, China: Evidence from mineral chemistry and U-Pb geochronology 期刊论文  OAI收割 ORE GEOLOGY REVIEWS, 2023, 卷号: 158, 页码: 20 作者:  Liu, Jianping;  Yang, Jingnan;  Cao, Yonghua;  Ding, Tao;  Brzozowski, Matthew J.   |  收藏  |  浏览/下载：8/0  |  提交时间：2024/08/23 Cassiterite U -Pb dating  Zircon U -Pb dating  In mineralization  Ore genesis  Bainiuchang Ag -Sn -polymetallic deposit  Southeast Yunnan   Temperature Gradient Induced Orientation Change of Bi Grains in Sn-Bi57-Ag0.7 Solder Joint 期刊论文  OAI收割 ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2022, 页码: 11 作者:  Chen, Yinbo;  Gao, Zhaoqing;  Liu, Zhi-Quan   |  收藏  |  浏览/下载：38/0  |  提交时间：2022/07/01 Sn-Bi-Ag solder  Grain orientation  Temperature gradient  Aging  Ag3Sn   Low temperature engineering feasibility of high reflective Ag-Sn films from experimental and thermodynamic views 期刊论文  OAI收割 MATERIALS CHEMISTRY AND PHYSICS, 2020, 卷号: 254, 页码: 7 作者:  Gao, Zhaoqing;  Sun, Hao;  Cao, Jinwei;  Wang, Chen;  Hussain, Muhammad Muzammal   |  收藏  |  浏览/下载：58/0  |  提交时间：2021/02/02 Ag/sn reflective film  Nucleation thermodynamics  Ag4Sn  X-ray quantitative analysis  Synchrotron radiation   Low temperature engineering feasibility of high reflective Ag-Sn films from experimental and thermodynamic views 期刊论文  OAI收割 MATERIALS CHEMISTRY AND PHYSICS, 2020, 卷号: 254, 页码: 7 作者:  Gao, Zhaoqing;  Sun, Hao;  Cao, Jinwei;  Wang, Chen;  Hussain, Muhammad Muzammal   |  收藏  |  浏览/下载：49/0  |  提交时间：2021/02/02 Ag/sn reflective film  Nucleation thermodynamics  Ag4Sn  X-ray quantitative analysis  Synchrotron radiation   High Thermoelectric Performance of Co-Doped P-Type Polycrystalline SnSe via Optimizing Electrical Transport Properties 期刊论文  OAI收割 ACS APPLIED MATERIALS & INTERFACES, 2020, 卷号: 12, 期号: 7, 页码: 8446-8455 作者:  Li, Chengjun;  Wu, Hong;  Zhang, Bin;  Zhu, Huaxing;  Fan, Yijing   |  收藏  |  浏览/下载：27/0  |  提交时间：2020/08/24 SnSe  codoping  thermoelectric performance  Sn/Ag-rich particles  conversion afficiency   Mineralogical features of tourmaline in Baiyinchagan Sn-Ag-Pb-Zn deposit, southern Great Xing'an Range, and its implications for magmatic-hydrothermal evolution. 期刊论文  OAI收割 ACTA PETROLOGICA SINICA, 2020, 卷号: 36, 期号: 12, 页码: 3797-3812 作者:  Li ZhenZhen;  Qin KeZhang;  Pei Bin;  Zhao JunXing;  Shi RuiZhe   |  收藏  |  浏览/下载：33/0  |  提交时间：2021/10/08 Baiyinchagan  Sn-Ag-Zn-Pb deposit  Tourmaline  Growth zoning  Magmatic-hydrothermal evolution   Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder 期刊论文  OAI收割 ACTA METALLURGICA SINICA, 2019, 卷号: 55, 期号: 12, 页码: 1606-1614 作者:  Cao Lihua;  Chen Yinbo;  Shi Qiyuan;  Yuan Jie;  Liu Zhiquan   |  收藏  |  浏览/下载：145/0  |  提交时间：2021/02/02 alloy element  Sn-Ag-Cu solder  intermetallic compound  interfacial morphology  shear strength   Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文  OAI收割 MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18 作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua   |  收藏  |  浏览/下载：23/0  |  提交时间：2021/02/02 62Sn36Pb2Ag solder joint  Microstructural evolution  Failure analysis  Intermetallic compound (IMC)  Thermal cycling   Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文  OAI收割 MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18 作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua   |  收藏  |  浏览/下载：19/0  |  提交时间：2021/02/02 62Sn36Pb2Ag solder joint  Microstructural evolution  Failure analysis  Intermetallic compound (IMC)  Thermal cycling   The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage 期刊论文  OAI收割 JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 739, 页码: 632-642 作者:  Gao, LY;  Li, CF;  Wan, P;  Zhang, H;  Liu, ZQ   |  收藏  |  浏览/下载：37/0  |  提交时间：2018/06/05 Lead-free Solders  Interfacial Reactions  Sn-ag  Intermetallic Compounds  Rich Solders  Joints  Growth  Reliability  Substrate  Strength