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Chinese Academy of Sciences Institutional Repositories Grid
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CAS IR Grid
机构
高能物理研究所 [6]
深圳先进技术研究院 [5]
西安光学精密机械研究... [2]
宁波材料技术与工程研... [1]
上海药物研究所 [1]
沈阳自动化研究所 [1]
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OAI收割 [17]
内容类型
会议论文 [17]
发表日期
2016 [17]
学科主题
computer a... [2]
light/opti... [2]
semiconduc... [2]
Chemistry [1]
copper [1]
heat excha... [1]
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浏览/检索结果:
共17条,第1-10条
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发表日期:2016
内容类型:会议论文
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Thermal behavior of microchannel cooled high power diode laser arrays
会议论文
OAI收割
17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16
作者:
Wu, Dihai
;
Zhang, Pu
;
Nie, Zhiqiang
;
Xiong, Lingling
;
Song, Yunfei
收藏
  |  
浏览/下载:30/0
  |  
提交时间:2016/11/22
Computational fluid dynamics
Copper
Crosstalk
Diodes
Electronics packaging
Finite element method
Flow of water
Heat resistance
Heat sinks
Hydraulics
Laser beam welding
Microchannels
Numerical methods
Optical properties
Power semiconductor diodes
Reliability
Thermodynamic properties
Numerical simulation of thermo-mechanical behavior in high power diode laser arrays
会议论文
OAI收割
17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16
作者:
Lu, Yao
;
Nie, Zhiqiang
;
Zhang, Pu
;
Wang, Zhenfu
;
Xiong, Lingling
收藏
  |  
浏览/下载:40/0
  |  
提交时间:2016/11/22
Computer simulation
Electronics packaging
High power lasers
Numerical models
Occupational risks
Optical properties
Packaging
Power semiconductor diodes
Shear stress
Thermal stress
Copper chaperons as novel targets for therapy in triple-negative breast cancer (TNBC)
会议论文
OAI收割
作者:
Karginova, O.
;
Song, A.
;
Wang, J.
;
Luo, C.
;
Jiang, H.
  |  
收藏
  |  
浏览/下载:9/0
  |  
提交时间:2019/01/08
Fabrication and Characterization of Low Stress Si Interposer with Air-gapped Si Interconnection for Hermetical System-in-Package
会议论文
OAI收割
2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), Las Vegas, NV
作者:
Luo, Rongfeng
;
Ren, Kuili
;
Ma, Shenglin
;
Yan, Jun
;
Xia, Yanming
收藏
  |  
浏览/下载:42/0
  |  
提交时间:2017/01/15
Oxidation Resistant core-shell Cu@SiO2 Nanowires for Composites with High Dielectric Performance
会议论文
OAI收割
The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China
作者:
Yanbin Shen
;
Chengliang Li
;
Suibin Luo
;
Shuhui Yu
;
Rong Sun
收藏
  |  
浏览/下载:14/0
  |  
提交时间:2017/01/15
Fabrication of Flexible conductive composites based on copper nanowires
会议论文
OAI收割
China Semiconductor Technology International Conference 2016, CSTIC 2016, Shanghai, China
作者:
Yu Zhu
;
Yougen Hu
;
Pengli Zhu
;
Tao Zhao
;
Xianwen Liang
收藏
  |  
浏览/下载:19/0
  |  
提交时间:2017/01/15
Electroplating Fabrication and Characterization of Sn-Ag Eutectic Solder Films
会议论文
OAI收割
The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China
作者:
Jinqi Xie
;
Zhe Zhong
;
Kai Zhang
;
Matthew M.F. Yuen
;
S.W. Ricky Lee
收藏
  |  
浏览/下载:21/0
  |  
提交时间:2017/01/15
FORMATION OF COPPER@SILVER CORE-SHELL NANOPARTICLES WITH EXCELLENT ANTIOXIDATION FOR INK-JET PRINTING
会议论文
OAI收割
China Semiconductor Technology International Conference 2016, CSTIC 2016, Shanghai, China
作者:
Qionglin Ouyang
;
Gang Li
;
Yu Zhang
;
PengliZhu
;
Qian Guo
收藏
  |  
浏览/下载:14/0
  |  
提交时间:2017/01/15
Low Secondary Electron Yield of Laser Treated Surfaces of Copper, Aluminium and Stainless Steel
会议论文
OAI收割
Proceedings of the 7th International Particle Accelerator Conference, Korea, 2016
作者:
R.Valizadeh
;
P.Goudket
;
O.B.Malyshev
;
B.S.Sian
;
S.Wang
收藏
  |  
浏览/下载:14/0
  |  
提交时间:2016/07/13
Quality Factor in High Power Tests of Cryogenic Copper Accelerating Cavities
会议论文
OAI收割
USA, 2016
作者:
A.D.Cahill
;
J.B.Rosenzweig
  |  
收藏
  |  
浏览/下载:7/0
  |  
提交时间:2017/11/03