机构

• 金属研究所 [15]

采集方式

• OAI收割 [15]

内容类型

• 期刊论文 [15]

发表日期

• 2020 [3]
• 2019 [2]
• 2018 [3]
• 2016 [2]
• 2015 [3]
• 2010 [1]
• 更多

学科主题

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浏览/检索结果: 共15条，第1-10条 帮助 限定条件 专题：金属研究所    第一署名单位    第一作者单位    通讯作者单位     条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择题名升序题名降序提交时间升序提交时间降序作者升序作者降序发表日期升序发表日期降序 The effect of finish layer on the interfacial cracking failure of Au-Si bonding 期刊论文  OAI收割 ENGINEERING FAILURE ANALYSIS, 2020, 卷号: 115, 页码: 8 作者:  Gao, Li-Yin;  Wen, Jian;  Li, Cai-Fu;  Chen, Chunhuan;  Liu, Zhi-Quan   |  收藏  |  浏览/下载：10/0  |  提交时间：2021/02/02 AuSi bonding  NiCo  Intermetallic compounds (IMCs)  Failure analysis  Crack   Mechanical properties and thermal stability of 7055 Al alloy by minor Sc addition 期刊论文  OAI收割 RARE METALS, 2020, 卷号: 39, 期号: 6, 页码: 725-732 作者:  Liu, Chong-Yu;  Teng, Guang-Biao;  Ma, Zong-Yi;  Wei, Li-Li;  Zhou, Wen-Biao   |  收藏  |  浏览/下载：38/0  |  提交时间：2021/02/02 Al alloy  Sc addition  Microstructure  Mechanical properties   Mechanical properties and thermal stability of 7055 Al alloy by minor Sc addition 期刊论文  OAI收割 RARE METALS, 2020, 卷号: 39, 期号: 6, 页码: 725-732 作者:  Liu, Chong-Yu;  Teng, Guang-Biao;  Ma, Zong-Yi;  Wei, Li-Li;  Zhou, Wen-Biao   |  收藏  |  浏览/下载：35/0  |  提交时间：2021/02/02 Al alloy  Sc addition  Microstructure  Mechanical properties   Effects of Pd addition on the interfacial reactions between Cu and Al during ultrasonic welding 期刊论文  OAI收割 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 14, 页码: 12840-12850 作者:  Du, Yahong;  Wen, Ming;  Ji, Hongjun;  Li, Mingyu;  Liu, Zhi-Quan   |  收藏  |  浏览/下载：7/0  |  提交时间：2021/02/02 Effects of Pd addition on the interfacial reactions between Cu and Al during ultrasonic welding 期刊论文  OAI收割 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 14, 页码: 12840-12850 作者:  Du, Yahong;  Wen, Ming;  Ji, Hongjun;  Li, Mingyu;  Liu, Zhi-Quan   |  收藏  |  浏览/下载：9/0  |  提交时间：2021/02/02 The mechanism of Pd distribution in the process of FAB formation during Pd-coated Cu wire bonding 期刊论文  OAI收割 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 16, 页码: 13774-13781 作者:  Du, Yahong;  Liu, Zhi-Quan;  Ji, Hongjun;  Li, Mingyu;  Wen, Ming   |  收藏  |  浏览/下载：8/0  |  提交时间：2021/02/02 The mechanism of Pd distribution in the process of FAB formation during Pd-coated Cu wire bonding 期刊论文  OAI收割 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 16, 页码: 13774-13781 作者:  Du, Yahong;  Liu, Zhi-Quan;  Ji, Hongjun;  Li, Mingyu;  Wen, Ming   |  收藏  |  浏览/下载：9/0  |  提交时间：2021/02/02 Materials, processing and reliability of low temperature bonding in 3D chip stacking 期刊论文  OAI收割 JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 750, 页码: 980-995 作者:  Zhang, Liang;  Liu, Zhi-quan;  Chen, Sinn-Wen;  Wang, Yao-dong;  Long, Wei-Min   |  收藏  |  浏览/下载：6/0  |  提交时间：2021/02/02 3D IC  Low temperature bonding  Bonding method  Reliability   Thermal fatigue behavior of K125L superalloy 期刊论文  OAI收割 RARE METALS, 2016, 卷号: 35, 期号: 2, 页码: 172-176 作者:  Ning, Li-Kui;  Zheng, Zhi;  An, Feng-Quan;  Tang, Song;  Tong, Jian   |  收藏  |  浏览/下载：2/0  |  提交时间：2021/02/02 K125L superalloy  Thermal fatigue  High-temperature oxidation  Carbides   Li4Ti5O12 on Graphene for High Rate Lithium Ion Batteries 期刊论文  OAI收割 JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2016, 卷号: 163, 期号: 14, 页码: A2951-A2955 作者:  Wen, Lei;  Liang, Ji;  Liu, Cheng-Ming;  Chen, Jing;  Huang, Quan-guo   |  收藏  |  浏览/下载：3/0  |  提交时间：2021/02/02