中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
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浏览/检索结果: 共9条,第1-9条 帮助

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Modelling drying pathways of an evaporating soft matter droplet 期刊论文  OAI收割
COMMUNICATIONS IN THEORETICAL PHYSICS, 2022, 卷号: 74, 期号: 9, 页码: 95605
作者:  
Du, Guangle;  Ye, Fangfu;  Luo, Hao;  Jing, Guangyin;  Doi, Masao
  |  收藏  |  浏览/下载:10/0  |  提交时间:2023/01/16
Effect of initial particle size on microstructure and dielectric properties of Cr/Al2O3 coatings deposited by plasma spraying 期刊论文  OAI收割
Journal of Materials Science: Materials in Electronics, 2017, 卷号: 28, 期号: 1, 页码: 167-173
作者:  
Zhou, Liang;  Chen, Meng;  Dong, Yanli;  Hua, Dongpeng;  Wang, Yuxin
收藏  |  浏览/下载:21/0  |  提交时间:2017/03/06
Study on Optimization of Drug Pharmaceutical Properties by Ultrasonic Spray Drying 期刊论文  OAI收割
Chinese Journal of Modern Applied Pharmacy, 2017, 卷号: 34, 期号: 8, 页码: 1089-1093
作者:  
Zhang Sha;  Gu Wangwen;  Wang Siling
  |  收藏  |  浏览/下载:14/0  |  提交时间:2019/01/08
Spray drying of fenofibrate loaded nanostructured lipid carriers 期刊论文  OAI收割
ASIAN JOURNAL OF PHARMACEUTICAL SCIENCES, 2016, 卷号: 11, 期号: 4, 页码: 507-515
作者:  
Xia, Dengning;  Shrestha, Neha;  van de Streek, Jacco;  Mu, Huiling;  Yang, Mingshi
  |  收藏  |  浏览/下载:16/0  |  提交时间:2019/01/08
Preparation of Silicon Nitride Hollow Quasi-Spheres by RF Thermal Plasma 期刊论文  OAI收割
INTERNATIONAL JOURNAL OF APPLIED CERAMIC TECHNOLOGY, 2015, 卷号: 12, 期号: 5, 页码: 939-948
作者:  
Lu, Chen;  Fan, Junmei;  Zhang, Yanchang;  Yuan, Fangli;  Yao, Mingshui
收藏  |  浏览/下载:31/0  |  提交时间:2015/10/26
Preparation of hollow silica spheres by DC thermal plasma 期刊论文  OAI收割
POWDER TECHNOLOGY, 2014, 卷号: 266, 期号: NOV., 页码: 210-217
作者:  
Lu, Chen;  Fan, Junmei;  Zhao, Peichen;  Yuan, Fangli
收藏  |  浏览/下载:19/0  |  提交时间:2014/09/30
Synthesis and characterization of Yb and Er based monosilicate powders and durability of plasma sprayed Yb2SiO5 coatings on C/C-SiC composites 期刊论文  OAI收割
materials science and engineering b-advanced functional solid-state materials, 2012, 卷号: 177, 期号: 2, 页码: 184-189
Khan ZS; Zou BL; Huang WZ; Fan XZ; Gu LJ; Chen XL; Zeng SB; Wang CJ; Cao XQ
收藏  |  浏览/下载:18/0  |  提交时间:2013/06/08
Heat-dissipating package for microcircuit devices and process for manufacture 专利  OAI收割
专利号: US5972737, 申请日期: 1999-10-26, 公开日期: 1999-10-26
作者:  
POLESE, FRANK J.;  OCHERETYANSKY, VLADIMIR
  |  收藏  |  浏览/下载:11/0  |  提交时间:2019/12/24
Heat-dissipating package for microcircuit devices 专利  OAI收割
专利号: US5886407, 申请日期: 1999-03-23, 公开日期: 1999-03-23
作者:  
POLESE, FRANK J.;  OCHERETYANSKY, VLADIMIR
  |  收藏  |  浏览/下载:11/0  |  提交时间:2019/12/24