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浏览/检索结果: 共91条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择提交时间升序提交时间降序发表日期升序发表日期降序题名升序题名降序作者升序作者降序 Study on the Influence of Defects on Fracture Mechanical Behavior of Cu/SAC305/Cu Solder Joint 期刊论文  OAI收割 MATERIALS, 2022, 卷号: 15, 期号: 14, 页码: 20 作者:  Zhang, Sinan;  Wang, Zhen;  Wang, Jie;  Duan, Guihua;  Li, Haixia   |  收藏  |  浏览/下载：15/0  |  提交时间：2023/02/24 Cu/SAC305/Cu solder joints  in situ tensile test  fracture analysis  X-ray mu-CT  FE simulation   Study on the Influence of Defects on Fracture Mechanical Behavior of Cu/SAC305/Cu Solder Joint 期刊论文  OAI收割 MATERIALS, 2022, 卷号: 15, 期号: 14, 页码: 20 作者:  Zhang, Sinan;  Wang, Zhen;  Wang, Jie;  Duan, Guihua;  Li, Haixia   |  收藏  |  浏览/下载：25/0  |  提交时间：2022/08/22 Cu/SAC305/Cu solder joints  in situ tensile test  fracture analysis  X-ray mu-CT  FE simulation   Temperature Gradient Induced Orientation Change of Bi Grains in Sn-Bi57-Ag0.7 Solder Joint 期刊论文  OAI收割 ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2022, 页码: 11 作者:  Chen, Yinbo;  Gao, Zhaoqing;  Liu, Zhi-Quan   |  收藏  |  浏览/下载：24/0  |  提交时间：2022/07/01 Sn-Bi-Ag solder  Grain orientation  Temperature gradient  Aging  Ag3Sn   Microstructural evolution and failure analysis of Sn-Bi57-Ag0.7 solder joints during thermal cycling 期刊论文  OAI收割 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 11 作者:  Chen, Yinbo;  Wang, Changchang;  Gao, Yue;  Gao, Zhaoqing;  Liu, Zhi-Quan   |  收藏  |  浏览/下载：28/0  |  提交时间：2022/01/27 BV-Net: Bin-based Vector-predicted Network for tubular solder joint detection 期刊论文  OAI收割 MEASUREMENT, 2021, 卷号: 183, 页码: 8 作者:  Zhou, Chenlin;  Shen, Xiaofei;  Wang, Peng;  Wei, Wei;  Sun, Jia   |  收藏  |  浏览/下载：43/0  |  提交时间：2021/11/04 Object detection  Defect detection  Quality inspection  Tubular solder joint detection  Deep learning   High-temperature aging time-induced composition and thickness evolution in the native oxides film on Sn solder substrate 期刊论文  OAI收割 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 20 作者:  Qiao, Chuang;  Sun, Xu;  Wang, Youzhi;  Hao, Long;  Liu, Xiahe   |  收藏  |  浏览/下载：18/0  |  提交时间：2021/11/22 Theoretical and experimental investigations on mechanical properties of (Fe,Ni)Sn2 intermetallic compounds formed in SnAgCu/Fe-Ni solder joints 期刊论文  OAI收割 MATERIALS CHARACTERIZATION, 2021, 卷号: 178, 页码: 8 作者:  Gao, Li-Yin;  Luo, Yi-Xiu;  Wan, Peng;  Liu, Zhi-Quan   |  收藏  |  浏览/下载：186/0  |  提交时间：2021/10/15 Solder joint  Intermetallic compound  Mechanical property  Nano-indentation  First principle calculation   Interfacial Structure and Mechanical Properties of Lead-Free Bi-Containing Solder/Cu Microelectronic Interconnects 期刊论文  OAI收割 JOURNAL OF ELECTRONIC MATERIALS, 2021, 卷号: 50, 期号: 1, 页码: 258-262 作者:  Liu, C. Z.;  Wang, J. J.;  Zhu, M. W.;  Liu, X. M.;  Lu, T. N.   |  收藏  |  浏览/下载：10/0  |  提交时间：2021/02/03 ACR-Net: Attention Integrated and Cross-Spatial Feature Fused Rotation Network for Tubular Solder Joint Detection 期刊论文  OAI收割 IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, 2021, 卷号: 70, 页码: 12 作者:  Zhou, Chenlin;  Li, Daheng;  Wang, Peng;  Sun, Jia;  Huang, Yikun   |  收藏  |  浏览/下载：16/0  |  提交时间：2021/11/03 Deep learning  defect detection  object detection  tubular solder joint detection   Interfacial Structure and Mechanical Properties of Lead-Free Bi-Containing Solder/Cu Microelectronic Interconnects 期刊论文  OAI收割 JOURNAL OF ELECTRONIC MATERIALS, 2021, 卷号: 50, 期号: 1, 页码: 258-262 作者:  Liu, C. Z.;  Wang, J. J.;  Zhu, M. W.;  Liu, X. M.;  Lu, T. N.   |  收藏  |  浏览/下载：15/0  |  提交时间：2021/01/11