机构

• 金属研究所 [5]
• 力学研究所 [2]
• 过程工程研究所 [1]

采集方式

• OAI收割 [8]

内容类型

• 期刊论文 [8]

发表日期

• 2022 [2]
• 2019 [1]
• 2018 [1]
• 2017 [2]
• 2012 [2]

学科主题

• Engineerin... [2]
• Physics, A... [2]
• Materials ... [1]
• Nanoscienc... [1]
• Physics, C... [1]

筛选

浏览/检索结果: 共8条，第1-8条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择提交时间升序提交时间降序发表日期升序发表日期降序题名升序题名降序作者升序作者降序 Study on the Influence of Defects on Fracture Mechanical Behavior of Cu/SAC305/Cu Solder Joint 期刊论文  OAI收割 MATERIALS, 2022, 卷号: 15, 期号: 14, 页码: 20 作者:  Zhang, Sinan;  Wang, Zhen;  Wang, Jie;  Duan, Guihua;  Li, Haixia   |  收藏  |  浏览/下载：15/0  |  提交时间：2023/02/24 Cu/SAC305/Cu solder joints  in situ tensile test  fracture analysis  X-ray mu-CT  FE simulation   Study on the Influence of Defects on Fracture Mechanical Behavior of Cu/SAC305/Cu Solder Joint 期刊论文  OAI收割 MATERIALS, 2022, 卷号: 15, 期号: 14, 页码: 20 作者:  Zhang, Sinan;  Wang, Zhen;  Wang, Jie;  Duan, Guihua;  Li, Haixia   |  收藏  |  浏览/下载：25/0  |  提交时间：2022/08/22 Cu/SAC305/Cu solder joints  in situ tensile test  fracture analysis  X-ray mu-CT  FE simulation   Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder 期刊论文  OAI收割 ACTA METALLURGICA SINICA, 2019, 卷号: 55, 期号: 12, 页码: 1606-1614 作者:  Cao Lihua;  Chen Yinbo;  Shi Qiyuan;  Yuan Jie;  Liu Zhiquan   |  收藏  |  浏览/下载：117/0  |  提交时间：2021/02/02 alloy element  Sn-Ag-Cu solder  intermetallic compound  interfacial morphology  shear strength   Fabrication of Ni-P coating film on diamond/Al composite and its soldering reliability 期刊论文  OAI收割 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 10, 页码: 8371-8379 作者:  Shi, QY;  Liu, ZQ;  Wu, D;  Zhang, H;  Ni, DR   |  收藏  |  浏览/下载：30/0  |  提交时间：2018/06/05 Al/diamond Composites  Thermal-conductivity  Coated Diamond  Heat Sinks  Densification  Microstructure  Mechanisms  Strength  Surface  Growth   Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints 期刊论文  OAI收割 MICROELECTRONICS RELIABILITY, 2017, 卷号: 73, 页码: 69-75 Wang, Mingna; Wang, Jianqiu; Ke, Wei 收藏  |  浏览/下载：32/0  |  提交时间：2017/08/17 Lead-free solder joint  Corrosion  Microstructure  Solidification cracks   Cooling and Annealing Effect on Indentation Response of Lead-Free Solder 期刊论文  OAI收割 INTERNATIONAL JOURNAL OF APPLIED MECHANICS, 2017, 卷号: 9, 期号: 4, 页码: 10.1142/S1758825117500570 作者:  Long X;  Feng YH(冯义辉);  Yao Y;  Long, X (reprint author), Northwestern Polytech Univ, Sch Mech Civil Engn & Architecture, Xian 710072, Peoples R China. 收藏  |  浏览/下载：13/0  |  提交时间：2017/10/27 Lead-free Solder  Cooling Condition  Annealing  Mechanical Property  Residual Stress   Effects of microstructure and temperature on corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder 期刊论文  OAI收割 Journal of Materials Science-Materials in Electronics, 2012, 卷号: 23, 期号: 1, 页码: 148-155 M. N. Wang; J. Q. Wang; H. Feng; W. Ke 收藏  |  浏览/下载：16/0  |  提交时间：2013/02/05 ag-cu alloys  electrochemical corrosion  buffer solutions  nacl  solution  tin  snagcu  joints   In-situ observation of fracture behavior of Sn-3.0Ag-0.5Cu lead-free solder during three-point bending tests in ESEM 期刊论文  OAI收割 Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2012, 卷号: 558, 页码: 649-655 M. N. Wang; J. Q. Wang; H. Feng; W. Ke 收藏  |  浏览/下载：29/0  |  提交时间：2013/02/05 Lead-free solder  Microstructure  Corrosion  Three-point bending  Fracture  electrochemical corrosion behavior  3.5-percent nacl solution  ga  solder  alloys  sn  joints