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• 半导体研究所 [9]
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• OAI收割 [24]

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• 会议论文 [24]

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• 光电子学 [4]
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浏览/检索结果: 共24条，第1-10条 帮助 限定条件 内容类型：会议论文     条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择提交时间升序提交时间降序发表日期升序发表日期降序题名升序题名降序作者升序作者降序 Multi-Section Waveguide Method for Facet Temperature Reduction and Improved Reliability of High-Power Laser Diodes 会议论文  OAI收割 Virtual, Online, 2022-05-09 作者:  Ebadi, Kaveh;  Liu, Yuxian;  Sünnetçiolu, Ali Kaan;  Gündodu, Sinan;  Sengül, Serdar   |  收藏  |  浏览/下载：22/0  |  提交时间：2022/07/28 Optimization of the epitaxial structure of low-loss 885nm high-power laser diodes 会议论文  OAI收割 Shanghai, China, 2021-06-03 作者:  Wu, Shun-Hua;  Li, Te;  Wang, Dan;  Yu, Xue-Cheng;  Wang, Zhen-Fu   |  收藏  |  浏览/下载：19/0  |  提交时间：2022/01/21 885nm  low loss  asymmetric waveguide  high power  high power conversion efficiency   Experimental and theoretical analysis of the effect of packaging induced thermal stress on high-power laser diode arrays 会议论文  OAI收割 San Francisco, CA, United states, 2019-02-03 作者:  Zhang, Hongyou;  Zah, Chung-En;  Liu, Xingsheng   |  收藏  |  浏览/下载：37/0  |  提交时间：2019/07/08 Thermal stress  laser diode array  SMILE effect  spectrum   Study on the near-field non-linearity (SMILE) of high power diode laser arrays 会议论文  OAI收割 San Francisco, CA, United states, 2018-01-30 作者:  Zhang, Hongyou;  Jia, Yangtao;  Li, Changxuan;  Zah, Chung-En;  Liu, Xingsheng   |  收藏  |  浏览/下载：54/0  |  提交时间：2018/04/25 Quasi-CW performance and reliability of dual laser bars on a micro-channel cooler 会议论文  OAI收割 Beijing, China, 2018-10-11 作者:  Zhang, Hongyou;  Chen, Li;  Zhao, Sen;  Wang, Boxue;  Zah, Chung-En   |  收藏  |  浏览/下载：18/0  |  提交时间：2019/03/12 Optimization of micro channel heat sinks for high-power 9xx-nm laser diodes 会议论文  OAI收割 physics and simulation of optoelectronic devices xxv, san francisco, ca, united states, 2017-01-30 作者:  Zhang, Hongyou;  Liang, Xuejie;  Cai, Wanshao;  Zah, Chungen;  Liu, Xingsheng 收藏  |  浏览/下载：78/0  |  提交时间：2017/05/27 Thermally accelerated ageing test of 808nm high power diode laser arrays in CW mode 会议论文  OAI收割 17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16 作者:  Nie, Zhiqiang;  Wu, Di;  Lu, Yao;  Wu, Dhai;  Wang, Shuna 收藏  |  浏览/下载：84/0  |  提交时间：2016/11/22 Chip scale packages  Defects  Degradation  Electronics packaging  High power lasers  Laser beam welding  Power semiconductor diodes  Reliability  Reliability analysis  Semiconductor diodes   Thermal behavior of microchannel cooled high power diode laser arrays 会议论文  OAI收割 17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16 作者:  Wu, Dihai;  Zhang, Pu;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei 收藏  |  浏览/下载：30/0  |  提交时间：2016/11/22 Computational fluid dynamics  Copper  Crosstalk  Diodes  Electronics packaging  Finite element method  Flow of water  Heat resistance  Heat sinks  Hydraulics  Laser beam welding  Microchannels  Numerical methods  Optical properties  Power semiconductor diodes  Reliability  Thermodynamic properties   Numerical simulation of thermo-mechanical behavior in high power diode laser arrays 会议论文  OAI收割 17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16 作者:  Lu, Yao;  Nie, Zhiqiang;  Zhang, Pu;  Wang, Zhenfu;  Xiong, Lingling 收藏  |  浏览/下载：39/0  |  提交时间：2016/11/22 Computer simulation  Electronics packaging  High power lasers  Numerical models  Occupational risks  Optical properties  Packaging  Power semiconductor diodes  Shear stress  Thermal stress   Fiber coupling design of high power cm-bar laser diodes based on Zemax 会议论文  OAI收割 Applied Optics and Photonics, AOPC 2015 作者:  Wang, Kai-Ming;  Qu, Yi;  Zhu, Hong-Bo;  Li, Hui;  Zhang, Jian-Jia 收藏  |  浏览/下载：6/0  |  提交时间：2016/07/18