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Chinese Academy of Sciences Institutional Repositories Grid
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CAS IR Grid
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金属研究所 [7]
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期刊论文 [11]
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Metallurg... [11]
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学科主题:Metallurgy & Metallurgical Engineering
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Effect of Dy, Ho, and Er substitution on the magnetocaloric properties of Gd-Co-Al-Y high entropy bulk metallic glasses
期刊论文
OAI收割
JOURNAL OF ALLOYS AND COMPOUNDS, 2020, 卷号: 827
作者:
Pang, C. M.
;
Chen, L.
;
Xu, H.
;
Guo, W.
;
Lv, Z. W.
  |  
收藏
  |  
浏览/下载:112/0
  |  
提交时间:2020/12/16
THERMAL-STABILITY
INTERMETALLIC COMPOUNDS
MECHANICAL-PROPERTIES
TRANSITION
HYBRIDIZATION
TB
FE
BEHAVIOR
RE
Mechanism of improved electromigration reliability using Fe-Ni UBM in wafer level package
期刊论文
OAI收割
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2018, 卷号: 34, 期号: 8, 页码: 1305-1314
作者:
Gao, LY
;
Zhang, H
;
Li, CF
;
Guo, JD
;
Liu, ZQ
  |  
收藏
  |  
浏览/下载:29/0
  |  
提交时间:2018/12/25
Fe-Ni under bump metallization (UBM)
Intermetallic compounds (IMCs)
Electromigration (EM)
Diffusion
Vacancy formation
The interfacial reaction between In-48Sn solder and polycrystalline Cu substrate during solid state aging
期刊论文
OAI收割
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 740, 页码: 500-509
作者:
Tian, FF
;
Li, CF
;
Zhou, M
;
Liu, ZQ
;
Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.
  |  
收藏
  |  
浏览/下载:17/0
  |  
提交时间:2018/06/05
Heterogeneous Binary-systems
Chemical-compound Layers
2 Elementary Substances
Eutectic Snin Solder
Intermetallic Compounds
Phase Identification
Reaction-diffusion
Growth-kinetics
Joint
Transformations
Glass formation adjacent to the intermetallic compounds in Cu-Zr binary system
期刊论文
OAI收割
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2018, 卷号: 34, 期号: 4, 页码: 605-612
作者:
Wang, YX
;
Yao, JH
;
Li, Y
;
Li, Y (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Liaoning, Peoples R China.
  |  
收藏
  |  
浏览/下载:29/0
  |  
提交时间:2018/06/05
Bulk Metallic-glass
Amorphous-alloys
Forming Ability
Thermodynamics
Kinetics
Liquid
Transition
Rates
The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage
期刊论文
OAI收割
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 739, 页码: 632-642
作者:
Gao, LY
;
Li, CF
;
Wan, P
;
Zhang, H
;
Liu, ZQ
  |  
收藏
  |  
浏览/下载:24/0
  |  
提交时间:2018/06/05
Lead-free Solders
Interfacial Reactions
Sn-ag
Intermetallic Compounds
Rich Solders
Joints
Growth
Reliability
Substrate
Strength
Electromigration anisotropy introduced by tin orientation in solder joints
期刊论文
OAI收割
JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 卷号: 703, 页码: 264-271
Chen, Jian-Qiang
;
Liu, Kai-Lang
;
Guo, Jing-Dong
;
Ma, Hui-Cai
;
Wei, Song
;
Shang, Jian-Ku
收藏
  |  
浏览/下载:22/0
  |  
提交时间:2017/08/17
Electromigration
Single crystal tin
Cu6Sn5
Intermetallic compounds
Orientation
Diffusion
Cu6Sn5 intermetallic compound anisotropy introduced by single crystal Sn under current stress
期刊论文
OAI收割
JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 卷号: 695, 页码: 3290-3298
Chen, Jian-Qiang
;
Guo, Jing-Dong
;
Ma, Hui-Cai
;
Wei, Song
;
Shang, Jian-Ku
收藏
  |  
浏览/下载:18/0
  |  
提交时间:2017/08/17
Cu6Sn5
Tin
Orientation
Solid state reaction
Electromigration
Molecular Dynamics Simulation of Tensile Deformation and Fracture of gamma-TiAl with and without Surface Defects
期刊论文
OAI收割
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2016, 卷号: 32, 期号: 10, 页码: 1033-1042
Wu, HN
;
Xu, DS
;
Wang, H
;
Yang, R
收藏
  |  
浏览/下载:24/0
  |  
提交时间:2016/12/28
Intermetallic compounds
Superdislocation
Fracture
Surface defects
Molecular dynamics
Effect of Cr content on the sorption performance of TiMn1.2-xCrxV0.25Fe0.05
期刊论文
OAI收割
ACTA METALLURGICA SINICA, 2004, 卷号: 40, 期号: 5, 页码: 527-530
Yu, XB
;
Chen, JZ
;
Wu, Z
;
Xia, BJ
收藏
  |  
浏览/下载:9/0
  |  
提交时间:2011/12/02
HYDROGEN STORAGE PROPERTIES
THERMODYNAMIC PROPERTIES
METAL-HYDRIDES
ALLOYS
SUBSTITUTION
Effect of Cr content on the sorption performance of TiMn1.2-xCrxV0.25Fe0.05
期刊论文
OAI收割
ACTA METALLURGICA SINICA, 2004, 卷号: 40, 期号: 5, 页码: 527-530
Yu, XB
;
Chen, JZ
;
Wu, Z
;
Xia, BJ
收藏
  |  
浏览/下载:12/0
  |  
提交时间:2011/12/17
HYDROGEN STORAGE PROPERTIES
THERMODYNAMIC PROPERTIES
METAL-HYDRIDES
ALLOYS
SUBSTITUTION