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Chinese Academy of Sciences Institutional Repositories Grid
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  • 金属研究所 [23]
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  • 2019 [23]
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Reliability issues of lead-free solder joints in electronic devices 期刊论文  OAI收割
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 876-901
作者:  Jiang, Nan;  Zhang, Liang;  Liu, Zhi-Quan;  Sun, Lei;  Long, Wei-Min
  |  收藏  |  浏览/下载：47/0  |  提交时间：2021/02/02
Structure and properties of Sn-Cu lead-free solders in electronics packaging 期刊论文  OAI收割
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 421-444
作者:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-Quan;  Xiong, Ming-Yue;  Sun, Lei
  |  收藏  |  浏览/下载：103/0  |  提交时间：2021/02/02
Oriented outperforms disorder: Thickness-independent mass transport for lithium-sulfur batteries 期刊论文  OAI收割
CARBON, 2019, 卷号: 154, 页码: 90-97
作者:  Fan, Xia-Lu;  Ping, Lin-Quan;  Qi, Fu-Lai;  Ghazi, Zahid Ali;  Tang, Xiao-Nan
  |  收藏  |  浏览/下载：10/0  |  提交时间：2021/02/02
Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method 期刊论文  OAI收割
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2019, 卷号: 32, 期号: 11, 页码: 1407-1414
作者:  Jiang, Lin;  Zhang, Liang;  Liu, Zhi-Quan
  |  收藏  |  浏览/下载：12/0  |  提交时间：2021/02/02
Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method 期刊论文  OAI收割
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2019, 卷号: 32, 期号: 11, 页码: 1407-1414
作者:  Jiang, Lin;  Zhang, Liang;  Liu, Zhi-Quan
  |  收藏  |  浏览/下载：5/0  |  提交时间：2021/02/02
Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder 期刊论文  OAI收割
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 19, 页码: 17583-17590
作者:  Jiang, Nan;  Zhang, Liang;  Liu, Zhi-quan;  Sun, Lei;  Xiong, Ming-yue
  |  收藏  |  浏览/下载：1/0  |  提交时间：2021/02/02
Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles 期刊论文  OAI收割
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 16, 页码: 15054-15063
作者:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-quan;  Xiong, Ming-yue;  Sun, Lei
  |  收藏  |  浏览/下载：2/0  |  提交时间：2021/02/02
Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles 期刊论文  OAI收割
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 16, 页码: 15054-15063
作者:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-quan;  Xiong, Ming-yue;  Sun, Lei
  |  收藏  |  浏览/下载：4/0  |  提交时间：2021/02/02
Effects of Pd addition on the interfacial reactions between Cu and Al during ultrasonic welding 期刊论文  OAI收割
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 14, 页码: 12840-12850
作者:  Du, Yahong;  Wen, Ming;  Ji, Hongjun;  Li, Mingyu;  Liu, Zhi-Quan
  |  收藏  |  浏览/下载：7/0  |  提交时间：2021/02/02
Effects of Pd addition on the interfacial reactions between Cu and Al during ultrasonic welding 期刊论文  OAI收割
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 14, 页码: 12840-12850
作者:  Du, Yahong;  Wen, Ming;  Ji, Hongjun;  Li, Mingyu;  Liu, Zhi-Quan
  |  收藏  |  浏览/下载：9/0  |  提交时间：2021/02/02