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Interface Contact Thermal Resistance of Die Attach in High-Power Laser Diode Packages
期刊论文
OAI收割
ELECTRONICS, 2024, 卷号: 13, 期号: 1
作者:
Deng, Liting
;
Li, Te
;
Wang, Zhenfu
;
Zhang, Pu
;
Wu, Shunhua
  |  
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2024/02/23
die attach
interface contact thermal resistance
thermal management
transient thermal analysis
structure function
high-power laser diode
Investigations on the Thermal Conductivity of Micro-Scale Cu-Sn Intermetallic Compounds Using Femtosecond Laser Time-Domain Thermoreflectance System
期刊论文
OAI收割
ACTA METALLURGICA SINICA, 2022, 卷号: 58, 期号: 12, 页码: 1645-1654
作者:
Zhou Lijun
;
Wei Song
;
Guo Jingdong
;
Sun Fangyuan
;
Wang Xinwei
  |  
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2023/05/09
femtosecond laser
time-domain thermoreflectance
intermetallic compounds
thermal conductivity
Improving thermal conductivity of polyvinylidene fluoride/low-melting-point alloy with segregated structure induced by incorporation of silver interface layer
期刊论文
OAI收割
JOURNAL OF POLYMER RESEARCH, 2022, 卷号: 29
作者:
Zhang, Ping
;
Zhang, Xian
;
Ding, Xin
;
Wang, Yanyan
;
Xiao, Chao
  |  
收藏
  |  
浏览/下载:29/0
  |  
提交时间:2022/12/23
Segregated structure
Intermetallic compound
Thermal conductivity
Sliver interface layer
Study on the Influence of Defects on Fracture Mechanical Behavior of Cu/SAC305/Cu Solder Joint
期刊论文
OAI收割
MATERIALS, 2022, 卷号: 15, 期号: 14, 页码: 20
作者:
Zhang, Sinan
;
Wang, Zhen
;
Wang, Jie
;
Duan, Guihua
;
Li, Haixia
  |  
收藏
  |  
浏览/下载:15/0
  |  
提交时间:2023/02/24
Cu/SAC305/Cu solder joints
in situ tensile test
fracture analysis
X-ray mu-CT
FE simulation
DFANet: Dense Feature Augmentation Network for Printed Circuit Board Segmentation
会议论文
OAI收割
Haikou, China, 2022-08
作者:
Jie, Qin
;
Jiayu, Zou
;
Donghui, Li
;
Xingang, Wang
  |  
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2023/04/26
Study on the Influence of Defects on Fracture Mechanical Behavior of Cu/SAC305/Cu Solder Joint
期刊论文
OAI收割
MATERIALS, 2022, 卷号: 15, 期号: 14, 页码: 20
作者:
  |  
收藏
  |  
浏览/下载:25/0
  |  
提交时间:2022/08/22
Cu/SAC305/Cu solder joints
in situ tensile test
fracture analysis
X-ray mu-CT
FE simulation
Fusion Bonding Possibility for Incompatible Polymers by the Novel Ultrasonic Welding Technology: Effect of Interfacial Compatibilization
期刊论文
OAI收割
ACS OMEGA, 2022, 卷号: 7, 期号: 17, 页码: 14797-14806
作者:
Fu, Xie
;
Wu, Xueli
;
Huang, Guigang
;
Li, Wenquan
;
Kang, Shuai
  |  
收藏
  |  
浏览/下载:34/0
  |  
提交时间:2022/08/22
Temperature Gradient Induced Orientation Change of Bi Grains in Sn-Bi57-Ag0.7 Solder Joint
期刊论文
OAI收割
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2022, 页码: 11
作者:
Chen, Yinbo
;
Gao, Zhaoqing
;
Liu, Zhi-Quan
  |  
收藏
  |  
浏览/下载:24/0
  |  
提交时间:2022/07/01
Sn-Bi-Ag solder
Grain orientation
Temperature gradient
Aging
Ag3Sn
Microstructural evolution and failure analysis of Sn-Bi57-Ag0.7 solder joints during thermal cycling
期刊论文
OAI收割
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 11
作者:
Chen, Yinbo
;
Wang, Changchang
;
Gao, Yue
;
Gao, Zhaoqing
;
Liu, Zhi-Quan
  |  
收藏
  |  
浏览/下载:28/0
  |  
提交时间:2022/01/27
BV-Net: Bin-based Vector-predicted Network for tubular solder joint detection
期刊论文
OAI收割
MEASUREMENT, 2021, 卷号: 183, 页码: 8
作者:
Zhou, Chenlin
;
Shen, Xiaofei
;
Wang, Peng
;
Wei, Wei
;
Sun, Jia
  |  
收藏
  |  
浏览/下载:43/0
  |  
提交时间:2021/11/04
Object detection
Defect detection
Quality inspection
Tubular solder joint detection
Deep learning