中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
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浏览/检索结果: 共8条,第1-8条 帮助

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Restoring After Central Nervous System Injuries: Neural Mechanisms and Translational Applications of Motor Recovery 期刊论文  OAI收割
NEUROSCIENCE BULLETIN, 2022, 页码: 19
作者:  
Gao, Zhengrun;  Pang, Zhen;  Chen, Yiming;  Lei, Gaowei;  Zhu, Shuai
  |  收藏  |  浏览/下载:42/0  |  提交时间:2022/12/27
Coupled thermal-hydrodynamic-mechanical-chemical numerical simulation for gas production from hydrate-bearing sediments based on hybrid finite volume and finite element method 期刊论文  OAI收割
COMPUTERS AND GEOTECHNICS, 2022, 卷号: 145, 期号: -, 页码: -
作者:  
Wan, Yizhao;  Wu, Nengyou;  Chen, Qiang;  Li, Wentao;  Hu, Gaowei
  |  收藏  |  浏览/下载:14/0  |  提交时间:2023/08/02
Numerical simulation on gas production from inclined layered methane hydrate reservoirs in the Nankai Trough: A case study 期刊论文  OAI收割
ENERGY REPORTS, 2021, 卷号: 7, 页码: 8608-8623
作者:  
Mao, Peixiao;  Sun, Jiaxin
  |  收藏  |  浏览/下载:55/0  |  提交时间:2022/09/20
A Conditioned Place Preference Protocol for Measuring Incubation of Craving in Rats 期刊论文  OAI收割
JOVE-JOURNAL OF VISUALIZED EXPERIMENTS, 2018
作者:  
 Gaowei Chen;   Kuikui Zhou;   Yingjie Zhu;  Yongmei Sun
  |  收藏  |  浏览/下载:549/0  |  提交时间:2019/01/31
The burying and grazing effects of plateau pika on alpine grassland are small: a pilot study in a semiarid basin on the Qinghai-Tibet Plateau 期刊论文  iSwitch采集
BIOGEOSCIENCES, 2016, 卷号: 13, 期号: 22, 页码: 6273-6284
作者:  
Yi, Shuhua;  Chen, Jianjun;  Qin, Yu;  Xu, Gaowei
收藏  |  浏览/下载:19/0  |  提交时间:2019/10/09
Development of deep reactive ion etching and Cu electroplating of tapered via for 3D integration 期刊论文  OAI收割
ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging.ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging, 2011, 期号: 0, 页码: 65-67
Chen, Xiao; Tang, Jiajie; Xu, Gaowei; Luo, L
收藏  |  浏览/下载:16/0  |  提交时间:2012/08/23
Development of deep reactive ion etching and Cu electroplating of tapered via for 3D integration 期刊论文  OAI收割
ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging.ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging, 2011, 页码: 65-67
Chen, Xiao; Tang, Jiajie; Xu, Gaowei; Luo, Le
收藏  |  浏览/下载:22/0  |  提交时间:2012/08/23
Wafer-level chip-to-wafer (C2W) integration of high-sensitivity MEMS and ICs 期刊论文  OAI收割
ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging.ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging, 2011, 页码: 125-129
Xu, Gaowei; Yan, Peili; Chen, Xiao; Ning, Wenguo; Luo,L; Jiao,JW
收藏  |  浏览/下载:58/0  |  提交时间:2012/08/23