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Chinese Academy of Sciences Institutional Repositories Grid
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浏览/检索结果: 共5条，第1-5条 帮助

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Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging 期刊论文  OAI收割
journal of materials science-materials in electronics, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2014, 2014, 卷号: 25, 25, 期号: 11, 页码: 4954-4959, 4954-4959
作者:  Liu, Yang;  Meerwijk, Joost;  Luo, Liangliang;  Zhang, Honglin;  Sun, Fenglian
  |  收藏  |  浏览/下载：21/0  |  提交时间：2015/03/20
Chip-on-Flexible Packaging for High-Power Flip-Chip Light-Emitting Diode by AuSn and SAC Soldering 期刊论文  OAI收割
ieee transactions on components packaging and manufacturing technology, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2014, 2014, 卷号: 4, 4, 期号: 11, 页码: 1754-1759, 1754-1759
作者:  Liu, Yang;  Zhao, Jia;  Yuan, Cadmus Chang-Ann;  Zhang, Guoqi Q;  Sun, Fenglian
  |  收藏  |  浏览/下载：16/0  |  提交时间：2015/03/20
Design of vertical fin arrays with heat pipes used for high-power light-emitting diodes 期刊论文  OAI收割
microelectronics reliability, MICROELECTRONICS RELIABILITY, 2014, 2014, 卷号: 54, 54, 期号: 11, 页码: 2448-2455, 2448-2455
作者:  Ye, Huaiyu;  Li, Bo;  Tang, Hongyu;  Zhao, Jia;  Yuan, Cadmus
  |  收藏  |  浏览/下载：22/0  |  提交时间：2015/03/20
Product level accelerated lifetime test for indoor LED luminaires 期刊论文  OAI收割
2013 14th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems, eurosime 2013, 2013, 页码: 6529995
Koh, Sau; Yuan, Cadmus; Sun, Bo; Li, Bob; Fan, Xuejun; Zhang, G.Q.
收藏  |  浏览/下载：19/0  |  提交时间：2014/05/16
Thermal analysis of remote phosphor in LED modules 期刊论文  OAI收割
journal of semiconductors, Journal of Semiconductors, 2013, 2013, 卷号: 34, 34, 期号: 5, 页码: 053007, 053007
作者:  Dong, Mingzhi;  Wei, Jia;  Ye, Huaiyu;  Yuan, Cadmus;  Zhang, Kouchi
  |  收藏  |  浏览/下载：13/0  |  提交时间：2014/04/28