机构

• 金属研究所 [11]
• 过程工程研究所 [1]

采集方式

• OAI收割 [12]

内容类型

• 期刊论文 [12]

发表日期

• 2015 [1]
• 2014 [1]
• 2011 [1]
• 2010 [3]
• 2009 [1]
• 2008 [2]
• 更多

学科主题

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浏览/检索结果: 共12条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序作者升序作者降序 Heterogeneous nanocomposites composed of silver sulfide and hollow structured Pd nanoparticles with enhanced catalytic activity toward formic acid oxidation 期刊论文  OAI收割 Electrochimica Acta, 2015, 期号: 0, 页码: 461-467 作者:  Chen, D.;  Cui, P. L.;  Liu, H.;  Yang, J. 收藏  |  浏览/下载：48/0  |  提交时间：2015/04/01 Silver sulfide  Hollow palladium nanoparticle  Nanocomposites  Galvanic  replacement reaction  Formic acid oxidation  Electronic coupling effect  OXYGEN REDUCTION  FUEL-CELLS  ELECTROCHEMICAL OXIDATION  SINGLE-CRYSTAL  NOBLE-METALS  AG ALLOYS  ELECTROOXIDATION  NANOCRYSTALS  PALLADIUM  NANOSPHERES   Ag/CdS heterostructural composites: Fabrication, characterizations and photocatalysis 期刊论文  OAI收割 Applied Surface Science, 2014, 卷号: 313, 页码: 558-562 Y. Liu; M. Chi; H. L. Dong; H. S. Jia; B. S. Xu; Z. X. Zhang 收藏  |  浏览/下载：33/0  |  提交时间：2015/01/14 CdS  Ag/CdS  Methylene blue  Photocatalytic efficiency  single-crystal cds  cadmium-sulfide  nanotube arrays  shell thickness  quantum dots  nanoparticles  nanostructures  nanocrystals  reduction  nanowires   Theoretical studies on the SH parameters and local distortion structure of KCl:Ag(2+) crystal 期刊论文  OAI收割 Physica B-Condensed Matter, 2011, 卷号: 406, 期号: 1, 页码: 56-58 W. L. Li; X. M. Li; W. L. Feng; W. J. Yang; C. Y. Tao 收藏  |  浏览/下载：27/0  |  提交时间：2012/04/13 Crystal- and ligand-field theory  Spin-Hamiltonian (SH) parameters  Distortion structure  Ag(2+)  KCl  spin-hamiltonian parameters  atomic screening constants  single-crystals  paramagnetic-resonance  epr parameters  scf functions  ions  spectra  field  temperature   Crack propagation of single crystal beta-Sn during in situ TEM straining 期刊论文  OAI收割 Journal of Electron Microscopy, 2010, 卷号: 59, 页码: S61-S66 P. J. Shang; Z. Q. Liu; D. X. Li; J. K. Shang 收藏  |  浏览/下载：20/0  |  提交时间：2012/04/13 in situ TEM  straining  single crystal Sn  slip system  self-diffusion  crack propagation  free solder alloys  lead-free solders  thermal fatigue  behavior  creep  tin  pb  joints  ag  deformation   Dislocation arrangements in cyclically deformed Au single crystal 期刊论文  OAI收割 Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2010, 卷号: 527, 期号: 23, 页码: 6244-6247 P. Li; S. X. Li; Z. G. Wang; Z. F. Zhang 收藏  |  浏览/下载：18/0  |  提交时间：2012/04/13 Au single crystal  Cyclic deformation  Persistent slip bands  Dislocation arrangements  deformation-behavior  strain localization  fatigue  copper  slip  orientation  ag   Effect of orientation on cyclic stress-strain curves and dislocation patterns of Ag and Cu single crystals 期刊论文  OAI收割 Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2010, 卷号: 527, 期号: 9, 页码: 2305-2312 P. Li; Z. F. Zhang; S. X. Li; Z. G. Wang 收藏  |  浏览/下载：23/0  |  提交时间：2012/04/13 Ag single crystal  Cu single crystal  Orientation  Cyclic deformation  Persistent slip bands (PSBs)  Dislocation patterns  electron channeling contrast  double slip orientation  deformation-behavior  stereographic triangle  fatigued copper  bands  side  localization  arrangements  bicrystal   Solid-state and liquid-state interfacial reactions between Sn-based solders and single crystal Ag substrate 期刊论文  OAI收割 Journal of Alloys and Compounds, 2009, 卷号: 469, 期号: 1-2, 页码: 207-214 H. F. Zou; Z. F. Zhang 收藏  |  浏览/下载：17/0  |  提交时间：2012/04/13 Ag single crystal substrate  Lead-free solder  Intermetallic compounds  (IMCs)  Growth kinetics  Local cracks  lead-free solders  electroless ni(p) metallization  intermetallic  compound  cu-sn  joints  ni  bi  nanoindentation  microstructure  wt.percent   Growth kinetics of intermetallic compounds and tensile properties of Sn-Ag-Cu/Ag single crystal joint 期刊论文  OAI收割 Journal of Alloys and Compounds, 2008, 卷号: 461, 期号: 1-2, 页码: 410-417 H. F. Zou; Q. S. Zhu; Z. F. Zhang 收藏  |  浏览/下载：27/0  |  提交时间：2012/04/13 Ag single crystal substrate  Sn-3.8Ag-0.7Cu solder  intermetallic  compounds (IMCs)  growth kinetics  tensile strength  fracture  lead-free solder  interfacial reaction  cu-substrate  microstructure  metallization  sn-3.5ag  bump  ni  strength  pb   Morphologies, orientation relationships and evolution of Cu6Sn5 grains formed between molten Sn and Cu single crystals 期刊论文  OAI收割 Acta Materialia, 2008, 卷号: 56, 期号: 11, 页码: 2649-2662 H. F. Zou; H. J. Yang; Z. F. Zhang 收藏  |  浏览/下载：20/0  |  提交时间：2012/04/13 Cu single crystal  orientation  intermetallic compounds (IMCs)  coarsening mechanism  growth kinetics  lead-free solders  interfacial reactions  eutectic snpb  joints  microstructure  sn-3.5ag  sn-0.7cu  copper   Fatigue damage mechanisms of copper single crystal/Sn-Ag-Cu interfaces 10.1016/j.msea.2006.07. 期刊论文  OAI收割 MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2006, 卷号: 435, 页码: 588-594 作者:  Zhu, Q. S.;  Zhang, Z. F.;  Shang, J. K.;  Wang, Z. G.   |  收藏  |  浏览/下载：19/0  |  提交时间：2021/02/02 Sn-Ag-Cu solder  copper single crystal  intermetallic compounds (IMCs)  interface  cyclic deformation  persistent slip bands (PSBs)  fatigue cracking