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浏览/检索结果: 共45条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择提交时间升序提交时间降序发表日期升序发表日期降序题名升序题名降序作者升序作者降序 Effect of electric current on secondary phase dissolution and elements migration behavior of a Ni-based single crystal superalloy 期刊论文  OAI收割 JOURNAL OF IRON AND STEEL RESEARCH INTERNATIONAL, 2024, 页码: 11 作者:  Li, Ying-ju;  Zheng, Ce;  Feng, Xiao-hui;  Huang, Qiu-yan;  Luo, Tian-jiao   |  收藏  |   Effect of electric current on secondary phase dissolution and elements migration behavior of a Ni-based single crystal superalloy 期刊论文  OAI收割 JOURNAL OF IRON AND STEEL RESEARCH INTERNATIONAL, 2024, 页码: 11 作者:  Li, Ying-ju;  Zheng, Ce;  Feng, Xiao-hui;  Huang, Qiu-yan;  Luo, Tian-jiao   |  收藏  |   Effect of electric current on secondary phase dissolution and elements migration behavior of a Ni-based single crystal superalloy 期刊论文  OAI收割 JOURNAL OF IRON AND STEEL RESEARCH INTERNATIONAL, 2024, 页码: 11 作者:  Li, Ying-ju;  Zheng, Ce;  Feng, Xiao-hui;  Huang, Qiu-yan;  Luo, Tian-jiao   |  收藏  |   Magnetic photocatalytic nano-semiconductors prepared from carbon quantum dots compounded with copper ferrate and their application in dye wastewater treatment 期刊论文  OAI收割 JOURNAL OF ENVIRONMENTAL CHEMICAL ENGINEERING, 2024, 卷号: 12, 期号: 1, 页码: 9 作者:  Shi, Keren;  Qian, Guangyan;  Yi, Wende;  Tang, Wufei;  Liu, Fang   |  收藏  |   Interface engineering of solution-grown silver nanofiber networks designed as flexible transparent electrodes 期刊论文  OAI收割 Journal of Materials Chemistry C, 2019, 卷号: 7, 期号: 13, 页码: 3924-3933 作者:  P.Li;  X.Wang;  J.G.Ma;  T.F.Wang;  W.Zhang   |  收藏  |   Mechanism of improved electromigration reliability using Fe-Ni UBM in wafer level package 期刊论文  OAI收割 JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2018, 卷号: 34, 期号: 8, 页码: 1305-1314 作者:  Gao, LY;  Zhang, H;  Li, CF;  Guo, JD;  Liu, ZQ   |  收藏  |   Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current 期刊论文  OAI收割 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 6, 页码: 5025-5033 作者:  Zhu, QS;  Gao, F;  Ma, HC;  Liu, ZQ;  Guo, JD   |  收藏  |   Electromigration anisotropy introduced by tin orientation in solder joints 期刊论文  OAI收割 JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 卷号: 703, 页码: 264-271 Chen, Jian-Qiang; Liu, Kai-Lang; Guo, Jing-Dong; Ma, Hui-Cai; Wei, Song; Shang, Jian-Ku 收藏  |   Cu6Sn5 intermetallic compound anisotropy introduced by single crystal Sn under current stress 期刊论文  OAI收割 JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 卷号: 695, 页码: 3290-3298 Chen, Jian-Qiang; Guo, Jing-Dong; Ma, Hui-Cai; Wei, Song; Shang, Jian-Ku 收藏  |   Extreme anisotropy of electromigration: Nickel in single-crystal tin 期刊论文  OAI收割 JOURNAL OF ALLOYS AND COMPOUNDS, 2016, 卷号: 687, 页码: 999-1003 Wei, S; Ma, HC; Chen, JQ; Guo, JD 收藏  |