中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
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CAS IR Grid
机构
金属研究所 [3]
上海微系统与信息技术... [1]
采集方式
OAI收割 [4]
内容类型
期刊论文 [4]
发表日期
2014 [1]
2013 [1]
2010 [1]
2008 [1]
学科主题
Chemistry,... [1]
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Phase identification on the intermetallic compound formed between eutectic SnIn solder and single crystalline Cu substrate
期刊论文
OAI收割
Journal of Alloys and Compounds, 2014, 卷号: 591, 页码: 351-355
F. F. Tian
;
Z. Q. Liu
;
P. J. Shang
;
J. D. Guo
收藏
  |  
浏览/下载:29/0
  |  
提交时间:2014/04/18
Phase identification
Interface
IMC
Eutectic SnIn solder
Single
crystalline Cu
gamma-angular correlations
lead-free solders
joint reliability
growth-kinetics
system
equilibria
mechanisms
interfaces
diffusion
layer
Microstructural Study on Kirkendall Void Formation in Sn-Containing/Cu Solder Joints During Solid-State Aging
期刊论文
OAI收割
Microscopy and Microanalysis, 2013, 卷号: 19, 页码: 105-108
Z. Q. Liu
;
P. J. Shang
;
F. F. Tan
;
D. X. Li
收藏
  |  
浏览/下载:22/0
  |  
提交时间:2014/04/18
lead-free solder
Kirkendall void
intermetallic compound (IMC)
diffusion
interface
transmission electron microscopy (TEM)
cu
A Compact Disk-Like Centrifugal Microfluidic System for High-Throughput Nanoliter-Scale Protein Crystallization Screening
期刊论文
OAI收割
ANALYTICAL CHEMISTRY, 2010, 卷号: 82, 期号: 11, 页码: 4362-4369
Li, G
;
Chen, Q
;
Li, JJ
;
Hu, XJ
;
Zhao, JL
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  |  
浏览/下载:74/0
  |  
提交时间:2011/12/17
FREE INTERFACE DIFFUSION
X-RAY-DIFFRACTION
STRUCTURAL GENOMICS
PLATFORM
MICROBATCH
MICROCHANNELS
DROPLETS
GROWTH
DEVICE
VALVES
Directional growth of Cu3Sn at the reactive interface between eutectic SnBi solder and (100) single crystal Cu
期刊论文
OAI收割
Scripta Materialia, 2008, 卷号: 59, 期号: 3, 页码: 317-320
P. J. Shang
;
Z. Q. Liu
;
D. X. Li
;
J. K. Shang
收藏
  |  
浏览/下载:18/0
  |  
提交时间:2012/04/13
Cu(3)Sn
growth
interface
soldering
transmission electron microscopy
(TEM)
lead-free solders
diffusion couples
snpb
bi
temperature
systems
joints
copper
phase