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• OAI收割 [18]

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• 期刊论文 [15]
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浏览/检索结果: 共18条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择题名升序题名降序提交时间升序提交时间降序作者升序作者降序发表日期升序发表日期降序 Characterization of Hydrolysis Lignin Bonding Properties During the Pelletization of Eucalyptus Sawdust 期刊论文  OAI收割 WASTE AND BIOMASS VALORIZATION, 2020, 卷号: 11, 期号: 3, 页码: 995-1003 作者:  Li, Weizhen;  Jiang, Yang;  Yin, Xiuli   |  收藏  |  浏览/下载：36/0  |  提交时间：2020/10/29 Eucalyptus sawdust pelletization  Hydrolysis lignin  Glass transition temperature  Bonding  Functional group   Anodic bondable Li-Na-Al-B-Si-O glass-ceramics for Si - ULTCC heterogeneous integration 期刊论文  OAI收割 JOURNAL OF THE EUROPEAN CERAMIC SOCIETY, 2019, 卷号: 39, 期号: 7, 页码: 2419 作者:  Chen, Guanyu;  Ma, Mingsheng;  Liu, Zhifu;  Wei, Anqing;  Zavabeti, Ali   |  收藏  |  浏览/下载：95/0  |  提交时间：2019/12/26 ULTCC  Glass-ceramic  Anodic bonding  Activation energy  MEMS  Pressure sensor   Joining of dense Si3N4 ceramics with tape cast Lu-Al-Si-O-N interlayer 期刊论文  OAI收割 CERAMICS INTERNATIONAL, 2018, 卷号: 44, 期号: 5, 页码: 4824, 4828 作者:  Liang, Hanqin;  Zuo, Kaihui;  Xia, Yongfeng;  Yao, Dongxu;  Yin, Jinwei   |  收藏  |  浏览/下载：25/0  |  提交时间：2018/12/28 Si3N4  Joining  Tape cast interlayer  Oxynitride glass  Bonding strength   Retarded local dynamics of single fluorescent probes in polymeric glass due to interaction strengthening 期刊论文  OAI收割 POLYMER, 2017, 卷号: 116, 页码: 452-457 作者:  Zhang, Hao;  Li, Desheng;  Wu, Kui;  Wang, Fuyi;  Yang, Jingfa   |  收藏  |  浏览/下载：30/0  |  提交时间：2018/01/24 Glass Transition  Dynamics  Single Molecule Fluorescence  Hydrogen Bonding   Preparation of solution-processable colorless polyamide-imides with extremely low thermal expansion coefficients through an in-situ silylation method for potential space optical applications 期刊论文  OAI收割 E-Polymers, 2016, 卷号: 16, 期号: 5, 页码: 395-402 作者:  Wang, Song;  Yang, Guangjie;  Wu, Shibin;  Ren, Ge;  Yang, Wei   |  收藏  |  浏览/下载：44/0  |  提交时间：2018/06/14 Amines  Fiber Optic Sensors  Film Preparation  Glass Bonding  Glass Transition  Hydrogen Bonds  Optical Systems  Polyamideimides  Polyimides  Synthesis (Chemical)  Tensile Strength  Thermal Expansion   Micro-electro-mechanical systems capacitive ultrasonic transducer with a higher electromechanical coupling coefficient 期刊论文  OAI收割 Micro & Nano Letters, 2015, 卷号: 10, 期号: 10, 页码: 4 作者:  Miao, J(苗静);  Shen, WJ(沈文江);  He, CD;  Xue, CY;  Xiong, JJ 收藏  |  浏览/下载：88/0  |  提交时间：2015/12/31 silicon  elemental semiconductors  silicon-on-insulator  wafer bonding  electromechanical effects  ultrasonic transducers  capacitive transducers  micromechanical devices  micromachining  vibrations  membranes  finite element analysis  reliability  capacitance  electromechanical coupling coefficient  capacitive micromachined ultrasonic transducer  impedance matching  propagation medium  microelectromechanical system capacitive ultrasonic transducer  silicon on insulator  wafer bonding  optimum geometric dimensions  membrane mechanical vibration  electrical characteristics  finite-element analysis  operation mode  device safety  device reliability  equivalent stress  operation-collapse voltage  bottom electrodes  glass substrate surface  parallel parasitic capacitance  Si  SiO2   Multi-layer laminated Pd-based metallic glass with enhanced plasticity 期刊论文  OAI收割 MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2013, 卷号: 587, 页码: 240 Ma, J; Chan, KC; Xia, L; Chen, SH; Wu, FF; Li, WH; Wang, WH 收藏  |  浏览/下载：75/0  |  提交时间：2014/01/16 Metallic glass  Thermoplastic bonding  Plasticity  Blocking effect  Structure relaxation   Experiments on the mechanical behavior of anodically bonded interlayer of Pyrex Glass/Al/Si 会议论文  OAI收割 Beijing, China, June 16, 2013 - June 21, 2013 作者:  Hu YQ;  Zhao YP(赵亚溥)   |  收藏  |  浏览/下载：19/0  |  提交时间：2018/11/08 Accelerometers  Aluminum  Glass  Nanostructures  Tensile strength  Anodic bonding  Bonding temperatures  Dendritic nanostructures  Intermediate layers  MEMS/NEMS  Micro accelerometers  Micro  scale structures  Quasi  static loading   Wafer-Level Vacuum Packaging for MEMS Resonators Using Glass Frit Bonding 期刊论文  OAI收割 JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2012, 卷号: 21, 期号: 6, 页码: 1484-1491 Wu, GQ; Xu, DH; Xiong, B; Wang, YC; Wang, YL; Ma, YL 收藏  |  浏览/下载：112/0  |  提交时间：2013/04/23 Bulk mode  glass frit bonding  microelectromechanical systems (MEMS)  redistribution  resonators  silicon bumps  vacuum package  wafer-level package   Development of wafer level glass frit bonding by using barrier trench technology and precision screen printing 期刊论文  OAI收割 MICROELECTRONIC ENGINEERING, 2012, 卷号: 100, 页码: 6-11 Chen, X; Yan, PL; Tang, JJ; Xu, GW; Luo, L 收藏  |  浏览/下载：26/0  |  提交时间：2013/04/23 MEMS  WLP  Glass frit bonding  Barrier trench technology (BTT)