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	Evolution and Growth Mechanism of Cu-2(In,Sn) Formed Between In-48Sn Solder and Polycrystalline Cu During Long-Time Liquid-State Aging 期刊论文 OAI收割 JOURNAL OF ELECTRONIC MATERIALS, 2020, 卷号: 49, 期号: 4, 页码: 9 作者: Tian, Feifei; Pang, Xueyong; Xu, Bo; Liu, Zhi-Quan \| 收藏 \| 浏览/下载：35/0 \| 提交时间：2021/02/02 In-48Sn solder polycrystalline Cu Cu-2(In Sn) growth orientation
	Growth Behavior of Intermetallic Compounds in Cu/Sn3.0Ag0.5Cu Solder Joints with Different Rates of Cooling 期刊论文 OAI收割 Journal of Electronic Materials, 2015, 卷号: 44, 期号: 1, 页码: 590-596 L. M.; Zhang Yang, Z. F. 收藏 \| 浏览/下载：27/0 \| 提交时间：2015/05/08 Intermetallic compounds (IMC) solder joint cooling rate solidification adsorption ag-cu solder cu6sn5 grains in-situ sn alloy nanoparticles ag3sn microstructure technology particles
	In situ tensile creep behaviors of Sn-4Ag/Cu solder joints revealed by electron backscatter diffraction 期刊论文 OAI收割 Scripta Materialia, 2012, 卷号: 67, 期号: 3, 页码: 289-292 Q. K. Zhang; Z. F. Zhang 收藏 \| 浏览/下载：20/0 \| 提交时间：2013/02/05 Sn-4Ag solder In situ tensile creep Electron backscatter diffraction (EBSD) Polygonization Grains subdivision sn-ag stress-relaxation fracture-behavior thermal fatigue deformation grain recrystallization microstructure orientation evolution
	Preparation of Sn-Ag-In Solder Bumps by Electroplating of Sn-Ag and Indium in Sequence and the Effect of Indium Addition on Microstructure and Shear Strength 期刊论文 OAI收割 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2012, 卷号: 2, 期号: 8, 页码: 1275-1279 Wang, DL; Yuan, Y; Luo, L 收藏 \| 浏览/下载：22/0 \| 提交时间：2013/04/23 Indium additive influence microstructural change shear strength Sn-Ag-In solder bumps
	In situ observations on creep fatigue fracture behavior of Sn-4Ag/Cu solder joints 期刊论文 OAI收割 Acta Materialia, 2011, 卷号: 59, 期号: 15, 页码: 6017-6028 Q. K. Zhang; Z. F. Zhang 收藏 \| 浏览/下载：35/0 \| 提交时间：2012/04/13 SnAg/Cu solder joints Creep fatigue In situ observation Strain localization Grain subdivision lead-free solders pb-sn solder tensile properties shear-strength deformation-behavior sn-3.5ag solder strain-rate ag microstructure alloys
	In situ observations on shear and creep-fatigue fracture behaviors of SnBi/Cu solder joints 期刊论文 OAI收割 Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2011, 卷号: 528, 期号: 6, 页码: 2686-2693 Q. K. Zhang; Z. F. Zhang 收藏 \| 浏览/下载：12/0 \| 提交时间：2012/04/13 In situ observation Shear Creep-fatigue Fracture Sn-58Bi solder Grain-boundary sliding lead-free solders sn-bi microstructure evolution tensile properties alloys deformation technology metals ag
	Crack propagation of single crystal beta-Sn during in situ TEM straining 期刊论文 OAI收割 Journal of Electron Microscopy, 2010, 卷号: 59, 页码: S61-S66 P. J. Shang; Z. Q. Liu; D. X. Li; J. K. Shang 收藏 \| 浏览/下载：17/0 \| 提交时间：2012/04/13 in situ TEM straining single crystal Sn slip system self-diffusion crack propagation free solder alloys lead-free solders thermal fatigue behavior creep tin pb joints ag deformation
	Interfacial Reactions Between In-Sn Solder and Ni-Fe Platings 期刊论文 OAI收割 Journal of Electronic Materials, 2009, 卷号: 38, 期号: 12, 页码: 2506-2515 J. P. Daghfal; P. J. Shang; Z. Q. Liu; J. K. Shang 收藏 \| 浏览/下载：17/0 \| 提交时间：2012/04/13 In-Sn solder Ni-Fe metallization interface FeSn(2) Ni(3)Sn(4) faceting in-48sn solder in-49sn solder reflow process microstructure substrate packages kinetics alloy joint ag
	Current-induced phase partitioning in eutectic indium-tin pb-free solder interconnect 期刊论文 OAI收割 Journal of Electronic Materials, 2007, 卷号: 36, 期号: 10, 页码: 1372-1377 J. P. Daghfal; J. K. Shang 收藏 \| 浏览/下载：7/0 \| 提交时间：2012/04/13 in-Sn solder electromigration current stressing hillocks interface mechanical-properties microstructure joints electromigration creep bi