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	Improving mechanical properties of dissimilar TA3/L907A steel clad plates with multiple interlayers via hot-compression bonding 期刊论文 OAI收割 JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, 2025, 卷号: 36, 页码: 111-122 作者: Xiao, He; Liu, Weifeng; Dai, Qianning; Ren, Shaofei; Xu, Bin \| 收藏 \| 浏览/下载：2/0 \| 提交时间：2025/04/27 Ti/steel bonding Interlayer Interfacial strength Intermetallic compounds (IMCs) Hot-compression bonding(HCB)
	Fracture mechanism and strength-influencing factors of Cu/Sn-4Ag solder joints aged for different times 期刊论文 OAI收割 Journal of Alloys and Compounds, 2009, 卷号: 485, 期号: 1-2, 页码: 853-861 Q. K. Zhang; Z. F. Zhang 收藏 \| 浏览/下载：47/0 \| 提交时间：2012/04/13 Sn-4Ag solder Interfacial IMCs Tensile properties Strain rate Fracture mechanism lead-free solders sn-ag shear-strength tensile properties intermetallic compound deformation-behavior strain-rate interfacial reaction cu substrate microstructure
	Growth kinetics of intermetallic compounds and tensile properties of Sn-Ag-Cu/Ag single crystal joint 期刊论文 OAI收割 Journal of Alloys and Compounds, 2008, 卷号: 461, 期号: 1-2, 页码: 410-417 H. F. Zou; Q. S. Zhu; Z. F. Zhang 收藏 \| 浏览/下载：45/0 \| 提交时间：2012/04/13 Ag single crystal substrate Sn-3.8Ag-0.7Cu solder intermetallic compounds (IMCs) growth kinetics tensile strength fracture lead-free solder interfacial reaction cu-substrate microstructure metallization sn-3.5ag bump ni strength pb
	Morphologies, orientation relationships and evolution of Cu6Sn5 grains formed between molten Sn and Cu single crystals 期刊论文 OAI收割 Acta Materialia, 2008, 卷号: 56, 期号: 11, 页码: 2649-2662 H. F. Zou; H. J. Yang; Z. F. Zhang 收藏 \| 浏览/下载：46/0 \| 提交时间：2012/04/13 Cu single crystal orientation intermetallic compounds (IMCs) coarsening mechanism growth kinetics lead-free solders interfacial reactions eutectic snpb joints microstructure sn-3.5ag sn-0.7cu copper