机构

• 金属研究所 [14]
• 上海应用物理研究所 [2]
• 宁波材料技术与工程研... [1]

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• OAI收割 [17]

内容类型

• 期刊论文 [17]

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• 2022 [1]
• 2020 [3]
• 2014 [2]
• 2013 [1]
• 2011 [1]
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• Engineerin... [1]
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• Physics [1]

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浏览/检索结果: 共17条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序作者升序作者降序 Electrodeposited Ni-W coatings as the effective reaction barrier at Ga-21.5In-10Sn/Cu interfaces 期刊论文  OAI收割 SURFACES AND INTERFACES, 2022, 卷号: 30, 页码: 12 作者:  Gao, Zhaoqing;  Wang, Chen;  Gao, Nan;  Guo, Shihao;  Chen, Yinbo   |  收藏  |  浏览/下载：174/0  |  提交时间：2022/07/01 Ni-W-graphene coatings  Interfacial reaction barrier  CuGa 2 layer  Ga-21  5In-10Sn liquid alloys  Ni -W solid solution   Synthesis of Sn nanowire by template electrodeposition and its conversion into Sn nanosolder 期刊论文  OAI收割 MATERIALS CHARACTERIZATION, 2020, 卷号: 163, 页码: 9 作者:  Meng, Zhi-Chao;  Gao, Li-Yin;  Liu, Zhi-Quan   |  收藏  |  浏览/下载：21/0  |  提交时间：2021/02/02 Sn nanowire  Template electrodeposition  Microstructural characterization  Liquid bath melting  Lead-free solder  Melting point   Synthesis of Sn nanowire by template electrodeposition and its conversion into Sn nanosolder 期刊论文  OAI收割 MATERIALS CHARACTERIZATION, 2020, 卷号: 163, 页码: 9 作者:  Meng, Zhi-Chao;  Gao, Li-Yin;  Liu, Zhi-Quan   |  收藏  |  浏览/下载：17/0  |  提交时间：2021/02/02 Sn nanowire  Template electrodeposition  Microstructural characterization  Liquid bath melting  Lead-free solder  Melting point   Transient Soldering Reaction Mechanisms of SnCu Solder on CuNi Nano Conducting Layer and Fracture Behavior of the Joint Interfaces 期刊论文  OAI收割 JOURNAL OF ELECTRONIC MATERIALS, 2020, 卷号: 49, 期号: 5, 页码: 3383-3390 作者:  Zhang, Qingke;  Hu, Fangqin;  Song, Zhenlun   |  收藏  |  浏览/下载：64/0  |  提交时间：2020/12/16 LEAD-FREE SOLDERS  INTERMETALLIC COMPOUNDS  LIQUID SN  KINETICS  GROWTH  CU6SN5  METALLIZATION   Local atomic structure inheritance in Ag50Sn50 melt 期刊论文  OAI收割 JOURNAL OF APPLIED PHYSICS, 2014, 卷号: 115, 期号: 4 Bai, YW; Bian, XF; Qin, JY; Hu, LN; Yang, JF; Zhang, K; Zhao, XL; Zhang, S; Huang, YY; Yang, CC 收藏  |  浏览/下载：46/0  |  提交时间：2015/03/13 ABSORPTION FINE-STRUCTURE  LIQUID  ALLOYS  HEREDITY  EXAFS  OXIDATION  GLASSES  XANES  FE  SN   In situ study on growth behavior of Cu6Sn5 during solidification with an applied DC in RE-doped Sn-Cu solder alloys 期刊论文  OAI收割 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2014, 卷号: 25, 期号: 10, 页码: 4538—4546 Zhou, P; Kang, HJ; Cao, F; Fu, YA; Xiao, TQ; Wang, TM 收藏  |  浏览/下载：35/0  |  提交时间：2015/03/13 LEAD-FREE SOLDER  RARE-EARTH-ELEMENTS  SOLID-LIQUID INTERFACE  DIRECTIONAL SOLIDIFICATION  ELECTRIC-CURRENT  MOLTEN SN  MICROSTRUCTURE  JOINTS  EVOLUTION  SNAGCU   Theoretical calculation of the mixing enthalpies of 21 IIIB-IVB, IIIB-VB and IVB-VB binary alloy systems 期刊论文  OAI收割 Physics of Metals and Metallography, 2013, 卷号: 114, 期号: 6, 页码: 457-468 B. W. Zhang; S. Z. Liao; X. L. Shu; H. W. Xie; X. J. Yuan 收藏  |  浏览/下载：41/0  |  提交时间：2013/12/24 B binary metal alloys  formation/mixing enthalpies  systematic  theoretical calculations  subregular model  thermodynamic properties  laves phases  rare-earth  intermetallic  compounds  solid-electrolyte  metal-alloys  liquid pb  model  sn  bismuth   Effect of Alloy Insert on Channel Segregation During Solidification of Sn-10 wt pct Bi Alloy 期刊论文  OAI收割 Metallurgical and Materials Transactions B-Process Metallurgy and Materials Processing Science, 2011, 卷号: 42, 期号: 1, 页码: 210-223 D. R. Liu; B. G. Sang; X. H. Kang; D. Z. Li 收藏  |  浏览/下载：39/0  |  提交时间：2012/04/13 nickel-base superalloy  pb-sn alloys  directional solidification  melting behavior  macrosegregation  ingots  convection  scheme  models  liquid   High-pressure powder x-ray diffraction experiments and ab initio calculation of Ti(3)AlC(2) 期刊论文  OAI收割 Journal of Applied Physics, 2009, 卷号: 106, 期号: 1 H. B. Zhang; X. Wu; K. G. Nickel; J. X. Chen; V. Presser 收藏  |  浏览/下载：54/0  |  提交时间：2012/04/13 ab initio calculations  elastic moduli  electronic structure  equations  of state  high-pressure effects  lattice constants  space groups  titanium compounds  X-ray diffraction  liquid reaction synthesis  electronic-structure  gpa  compression  ti3sic2  behavior  crystal  ti3gec2  sn   Comparison of bulk metallic glass formation between Cu-Hf binary and Cu-Hf-Al ternary alloys 期刊论文  OAI收割 Journal of Materials Research, 2009, 卷号: 24, 期号: 1, 页码: 96-106 P. Jia; J. Xu 收藏  |  浏览/下载：20/0  |  提交时间：2012/04/13 supercooled liquid region  mold casting method  ni-nb-sn  forming  ability  zr-ti  mechanical-properties  amorphous-alloys  thermal-stability  eutectic reaction  critical size