中国科学院机构知识库网格系统: 检索

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	Reliable WBG Devices Packaging by Forming Nano-Gradient Structures on Silver-Plated Substrates 期刊论文 OAI收割 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2024, 卷号: 14, 期号: 7, 页码: 1156-1163 作者: Zhang, Bowen; Zhao, Zhiyuan; Liu, Yi; Ma, Haoxiang; Shi, Chao \| 收藏 \|
	Development of Silver Paste With High Sintering Driving Force for Reliable Packaging of Power Electronics 期刊论文 OAI收割 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2024, 卷号: 14, 期号: 1, 页码: 10-17 作者: Zhang, Bowen; Lu, Xinyan; Ma, Haoxiang; Wang, Di; Mei, Yun-Hui \| 收藏 \|
	Improved Reliability of Planar Power Interconnect With Ceramic-Based Structure 期刊论文 OAI收割 IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, 2018, 卷号: 6, 期号: 1, 页码: 175, 187 作者: Zhang, Hui; Li, Jianfeng; Dai, Jingru; Corfield, Martin; Liu, Xuejian \| 收藏 \|
	Thermally accelerated ageing test of 808nm high power diode laser arrays in CW mode 会议论文 OAI收割 17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16 作者: Nie, Zhiqiang; Wu, Di; Lu, Yao; Wu, Dhai; Wang, Shuna 收藏 \|
	Thermal behavior of microchannel cooled high power diode laser arrays 会议论文 OAI收割 17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16 作者: Wu, Dihai; Zhang, Pu; Nie, Zhiqiang; Xiong, Lingling; Song, Yunfei 收藏 \|
	Fe-Ni新型UBM材料的电镀工艺开发及CSP封装可靠性研究学位论文 OAI收割硕士, 北京: 中国科学院金属研究所, 2012 张昊收藏 \|
	LED optical engine based on rectangular CPC for micro-projection display (EI CONFERENCE) 会议论文 OAI收割 4th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies, November 19, 2008 - November 21, 2008, Chengdu, China 作者: Meng Z.; Meng Z. 收藏 \|
	Advances in high power semiconductor diode lasers - art. no. 682402 会议论文 OAI收割 conference on semiconductor lasers and applications iii, beijing, peoples r china, nov 12-13, 2007 Ma, XY; Zhong, L 收藏 \|