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	Reliable WBG Devices Packaging by Forming Nano-Gradient Structures on Silver-Plated Substrates 期刊论文 OAI收割 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2024, 卷号: 14, 期号: 7, 页码: 1156-1163 作者: Zhang, Bowen; Zhao, Zhiyuan; Liu, Yi; Ma, Haoxiang; Shi, Chao \| 收藏 \| 浏览/下载：15/0 \| 提交时间：2024/10/21 Substrates Annealing Silver Nanoscale devices Sputtering Nanostructures Bonding Nano-gradient structure power electronic packaging reliability silver paste strength-ductility dilemma
	Development of Silver Paste With High Sintering Driving Force for Reliable Packaging of Power Electronics 期刊论文 OAI收割 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2024, 卷号: 14, 期号: 1, 页码: 10-17 作者: Zhang, Bowen; Lu, Xinyan; Ma, Haoxiang; Wang, Di; Mei, Yun-Hui \| 收藏 \| 浏览/下载：14/0 \| 提交时间：2024/05/07 Silver Sintering Force Substrates Copper Bonding Thermal stability Reliability packaging silver paste sintering driving force
	Improved Reliability of Planar Power Interconnect With Ceramic-Based Structure 期刊论文 OAI收割 IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, 2018, 卷号: 6, 期号: 1, 页码: 175, 187 作者: Zhang, Hui; Li, Jianfeng; Dai, Jingru; Corfield, Martin; Liu, Xuejian \| 收藏 \| 浏览/下载：42/0 \| 提交时间：2018/12/28 Electronic packaging finite-element (FE) method material reliability planar power module power cycling X-ray computation tomography
	Thermally accelerated ageing test of 808nm high power diode laser arrays in CW mode 会议论文 OAI收割 17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16 作者: Nie, Zhiqiang; Wu, Di; Lu, Yao; Wu, Dhai; Wang, Shuna 收藏 \| 浏览/下载：94/0 \| 提交时间：2016/11/22 Chip scale packages Defects Degradation Electronics packaging High power lasers Laser beam welding Power semiconductor diodes Reliability Reliability analysis Semiconductor diodes
	Thermal behavior of microchannel cooled high power diode laser arrays 会议论文 OAI收割 17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16 作者: Wu, Dihai; Zhang, Pu; Nie, Zhiqiang; Xiong, Lingling; Song, Yunfei 收藏 \| 浏览/下载：42/0 \| 提交时间：2016/11/22 Computational fluid dynamics Copper Crosstalk Diodes Electronics packaging Finite element method Flow of water Heat resistance Heat sinks Hydraulics Laser beam welding Microchannels Numerical methods Optical properties Power semiconductor diodes Reliability Thermodynamic properties
	Fe-Ni新型UBM材料的电镀工艺开发及CSP封装可靠性研究学位论文 OAI收割硕士, 北京: 中国科学院金属研究所, 2012 张昊收藏 \| 浏览/下载：143/0 \| 提交时间：2013/04/12 Fe-Ni合金 UBM 电镀 CSP封装可靠性 Fe-Ni alloy Electroplating UBM CSP packaging Reliability
	LED optical engine based on rectangular CPC for micro-projection display (EI CONFERENCE) 会议论文 OAI收割 4th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies, November 19, 2008 - November 21, 2008, Chengdu, China 作者: Meng Z.; Meng Z. 收藏 \| 浏览/下载：19/0 \| 提交时间：2013/03/25 With applications in digital display consumer electronics medicine automotive lighting traffic signals and general illumination the light-emitting diode (LED) is the world's most efficient light source being mass produced today[1]. However high cost is the main factor restricting widespread application of LED lighting and the packaging is the most expensive aspect of LED products. Light emitting diodes (LED) are regarded as the most important light sources in solid-state lighting for their advantages in energy efficiency long life vivid colors high reliability environmental protection safety and multiple applications. However application of LEDs in projection display exist many questions such as low illuminance uniformity and low energy efficiency by reason of luminescence distribution and constructure specificity for LED the study on application of LED in the micro-projection display and projection display is reported[2-8]. Considering the question mensioned above the rectangular CPC(Compound Parabolic Concentrator) system with three-color LED is applied in the projection display. 2009 SPIE.
	Advances in high power semiconductor diode lasers - art. no. 682402 会议论文 OAI收割 conference on semiconductor lasers and applications iii, beijing, peoples r china, nov 12-13, 2007 Ma, XY; Zhong, L 收藏 \| 浏览/下载：44/0 \| 提交时间：2010/03/09 laser diodes laser bar stacks high power power conversion efficiency reliability packaging