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	Integration of Oxide Semiconductor Thin Films with Relaxor-Based Ferroelectric Single Crystals with Large Reversible and Nonvolatile Modulation of Electronic Properties 期刊论文 OAI收割 ACS APPLIED MATERIALS & INTERFACES, 2018, 卷号: 10, 期号: 38, 页码: 32809, 32817 作者: Xu, Zhi-Xue; Yan, Jian-Min; Xu, Meng; Guo, Lei; Chen, Ting -Wei \| 收藏 \| 浏览/下载：63/0 \| 提交时间：2018/12/28 ferroelectric field effect device ferroelectric single crystal electronic properties tin dioxide thin film magnetoresistance
	Electromigration anisotropy introduced by tin orientation in solder joints 期刊论文 OAI收割 JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 卷号: 703, 页码: 264-271 Chen, Jian-Qiang; Liu, Kai-Lang; Guo, Jing-Dong; Ma, Hui-Cai; Wei, Song; Shang, Jian-Ku 收藏 \| 浏览/下载：40/0 \| 提交时间：2017/08/17 Electromigration Single crystal tin Cu6Sn5 Intermetallic compounds Orientation Diffusion
	Crack propagation of single crystal beta-Sn during in situ TEM straining 期刊论文 OAI收割 Journal of Electron Microscopy, 2010, 卷号: 59, 页码: S61-S66 P. J. Shang; Z. Q. Liu; D. X. Li; J. K. Shang 收藏 \| 浏览/下载：19/0 \| 提交时间：2012/04/13 in situ TEM straining single crystal Sn slip system self-diffusion crack propagation free solder alloys lead-free solders thermal fatigue behavior creep tin pb joints ag deformation
	A study on the orientation relationship between the scallop-type Cu(6)Sn(5) grains and (011) Cu substrate using electron backscattered diffraction 期刊论文 OAI收割 Journal of Applied Physics, 2009, 卷号: 106, 期号: 11 H. F. Zou; H. J. Yang; Z. F. Zhang 收藏 \| 浏览/下载：18/0 \| 提交时间：2012/04/13 ageing copper copper alloys electron backscattering electron diffraction texture tin alloys wetting lead-free solders interfacial reactions single-crystal molten sn growth joints