中国科学院机构知识库网格系统: 检索

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	Precise Cr-marker investigation on the reactive interface in the eutectic SnIn solder joint 期刊论文 OAI收割 Materials Letters, 2014, 卷号: 121, 页码: 185-187 F. F. Tian; P. J. Shang; Z. Q. Liu 收藏 \| 浏览/下载：20/0 \| 提交时间：2014/07/03 Interfaces Intermetallic alloys and compounds Diffusion Kirkendall void SnIn solder cu substrate growth-kinetics snagcu solder diffusion compound identification ni
	CVD nanocrystalline diamond coatings on Ti alloy: A synchrotron-assisted interfacial investigation 期刊论文 OAI收割 Materials Chemistry and Physics, 2012, 卷号: 134, 期号: 1, 页码: 145-152 Y. S. Li; C. Z. Zhang; H. T. Ma; L. Z. Yang; L. L. Zhang; Y. Tang; X. J. Li; L. L. He; R. Feng; Q. Yang; A. Hirose 收藏 \| 浏览/下载：15/0 \| 提交时间：2013/02/05 Diamond coating Ti alloy Chemical vapor deposition Interfaces vapor-deposited diamond titanium films ti-6al-4v adhesion interlayers growth substrate steel
	Effect of Zn addition on interfacial reactions between Sn-4Ag solder and Ag substrates 期刊论文 OAI收割 Journal of Electronic Materials, 2008, 卷号: 37, 期号: 8, 页码: 1119-1129 H. F. Zou; Z. F. Zhang 收藏 \| 浏览/下载：28/0 \| 提交时间：2012/04/13 Sn-Ag-Zn lead-free solder gravity interfaces intermetallic compounds lead-free solders cu substrate bump metallization tensile properties phase-equilibria eutectic alloy ni behavior bi microstructure
	355nm增透膜的设计、制备与性能期刊论文 OAI收割中国激光, 2008, 卷号: 35, 期号: 12, 页码: 2026, 2030 余华; 崔云; 申雁鸣; 齐红基; 易葵; 邵建达; 范正修收藏 \| 浏览/下载：1370/197 \| 提交时间：2009/09/22 薄膜增透膜热舟蒸发真空退火激光损伤阈值 355 nm lasers Damage morphologies Electric-field In vacuums Laser damage resistances Laser induce damage threshold Masking technologies Spectrum stabilities Substrate interfaces Surface conditions Thermal boat evaporation Vacuum annealing
	First-principles study of metal/nitride polar interfaces: Ti/TiN 期刊论文 OAI收割 Surface and Interface Analysis, 2003, 卷号: 35, 期号: 10, 页码: 835-841 L. M. Liu; S. Q. Wang; H. Q. Ye 收藏 \| 浏览/下载：39/0 \| 提交时间：2012/04/14 first principles metal/ceramic interface adhesion carbides nitrides metal-ceramic interfaces mechanical-properties first-principles adhesion pressure tin substrate surfaces mmc
	First-principles study of the polar TiC/Ti interface 期刊论文 OAI收割 Journal of Materials Science & Technology, 2003, 卷号: 19, 期号: 6, 页码: 540-544 L. M. Liu; S. Q. Wang; H. Q. Ye 收藏 \| 浏览/下载：37/0 \| 提交时间：2012/04/14 first-principles metal/ceramic interface adhesion carbides generalized gradient approximation metal-ceramic interfaces first-principles adhesion pressure mechanism substrate titanium energy mmc
	In0.25Ga0.75As films growth on the thin GaAs/AlAs buffer layer on the GaAs(001) substrate 期刊论文 OAI收割 applied surface science, 2003, 卷号: 217, 期号: 1-4, 页码: 268-274 作者: Xu B 收藏 \| 浏览/下载：42/0 \| 提交时间：2010/08/12 strain dislocation interfaces molecular beam epitaxy semiconductor III-V materials CRITICAL THICKNESS COMPLIANT SUBSTRATE RELAXATION