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• 金属研究所 [25]
• 宁波材料技术与工程研... [1]
• 上海微系统与信息技术... [1]
• 合肥物质科学研究院 [1]
• 上海硅酸盐研究所 [1]

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• OAI收割 [29]

内容类型

• 期刊论文 [29]

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• 2024 [1]
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• Materials ... [3]
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浏览/检索结果: 共29条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择题名升序题名降序提交时间升序提交时间降序作者升序作者降序发表日期升序发表日期降序 Study of faceted Al2Cu intermetallic compounds growth during solidification under strong static magnetic field via X-ray computed tomography 期刊论文  OAI收割 JOURNAL OF ALLOYS AND COMPOUNDS, 2024, 卷号: 1006 作者:  Lin, Wenhao;  Feng, Meilong;  Qin, Zhonghan;  Li, Hao;  Liu, Chunmei   |  收藏  |  浏览/下载：10/0  |  提交时间：2024/11/20 Strong static magnetic field  Intermetallic compound  Crystal growth and coarsening  X-ray computed tomography   Insight into the effect of reorganized chemical short-range orders at Ga-based alloys/Cu interfaces on the nucleation and growth of CuGa2 crystals 期刊论文  OAI收割 MATERIALS LETTERS, 2022, 卷号: 307, 页码: 4 作者:  Gao, Zhaoqing;  Chen, Yinbo;  Wang, Chen;  Yao, Kai;  Chai, Zhenbang   |  收藏  |  浏览/下载：105/0  |  提交时间：2021/12/09 Crystal growth  Electronic materials  Intermetallic alloys and compounds  Ga-based alloys  Chemical short-range order   Inter-diffusion Based Analytical Model for Growth Kinetics of IMC Layers at Roll Bonded Cu/Al Interface During Annealing Process 期刊论文  OAI收割 METALS AND MATERIALS INTERNATIONAL, 2020, 卷号: 26, 期号: 3, 页码: 333-345 作者:  Hua, Fu-an;  Song, Hong-wu;  Sun, Tao;  Li, Jian-ping   |  收藏  |  浏览/下载：21/0  |  提交时间：2021/02/02 Bimetal  Cold roll bonding  Intermetallic compound  Growth kinetics  Inter-diffusion   Transient Soldering Reaction Mechanisms of SnCu Solder on CuNi Nano Conducting Layer and Fracture Behavior of the Joint Interfaces 期刊论文  OAI收割 JOURNAL OF ELECTRONIC MATERIALS, 2020, 卷号: 49, 期号: 5, 页码: 3383-3390 作者:  Zhang, Qingke;  Hu, Fangqin;  Song, Zhenlun   |  收藏  |  浏览/下载：60/0  |  提交时间：2020/12/16 LEAD-FREE SOLDERS  INTERMETALLIC COMPOUNDS  LIQUID SN  KINETICS  GROWTH  CU6SN5  METALLIZATION   The interfacial reaction between In-48Sn solder and polycrystalline Cu substrate during solid state aging 期刊论文  OAI收割 JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 740, 页码: 500-509 作者:     |  收藏  |  浏览/下载：24/0  |  提交时间：2018/06/05 Heterogeneous Binary-systems  Chemical-compound Layers  2 Elementary Substances  Eutectic Snin Solder  Intermetallic Compounds  Phase Identification  Reaction-diffusion  Growth-kinetics  Joint  Transformations   The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage 期刊论文  OAI收割 JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 739, 页码: 632-642 作者:  Gao, LY;  Li, CF;  Wan, P;  Zhang, H;  Liu, ZQ   |  收藏  |  浏览/下载：40/0  |  提交时间：2018/06/05 Lead-free Solders  Interfacial Reactions  Sn-ag  Intermetallic Compounds  Rich Solders  Joints  Growth  Reliability  Substrate  Strength   Hierarchical micro/nanoscale NdFe11Co oxide and alloy materials synthesized by polyol mediated methods with heat treatment 期刊论文  OAI收割 MATERIALS LETTERS, 2018, 卷号: 212, 页码: 202, 206 作者:  Nguyen Viet Long;  Yang, Yong;  Cao Minh Thi;  Le Hong Phuc;  Vu Phi Tuyen   |  收藏  |  浏览/下载：50/0  |  提交时间：2018/12/28 Crystal growth  Intermetallic alloys and compounds  NdFe11Co  Nd-Fe-B  Sm-Fe-B  Polyol mediated methods   Effect of doping Al on the liquid oxidation of Sn-Bi-Zn solder 期刊论文  OAI收割 Journal of Materials Science-Materials in Electronics, 2014, 卷号: 25, 期号: 5, 页码: 2297-2304 X. J. Wang; Q. S. Zhu; B. Liu; N. Liu; F. J. Wang 收藏  |  浏览/下载：29/0  |  提交时间：2014/07/03 lead-free solder  intermetallic compound growth  corrosion behavior  mechanical-properties  cu substrate  alloy  microstructure  reduction  aluminum  vacuum   Precise Cr-marker investigation on the reactive interface in the eutectic SnIn solder joint 期刊论文  OAI收割 Materials Letters, 2014, 卷号: 121, 页码: 185-187 F. F. Tian; P. J. Shang; Z. Q. Liu 收藏  |  浏览/下载：19/0  |  提交时间：2014/07/03 Interfaces  Intermetallic alloys and compounds  Diffusion  Kirkendall  void  SnIn solder  cu substrate  growth-kinetics  snagcu solder  diffusion  compound  identification  ni   Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder Joints 期刊论文  OAI收割 Journal of Materials Science & Technology, 2014, 卷号: 30, 期号: 9, 页码: 928-933 H. Zhang; Q. S. Zhu; Z. Q. Liu; L. Zhang; H. Y. Guo; C. M. Lai 收藏  |  浏览/下载：34/0  |  提交时间：2015/01/14 Fe-Ni alloy  Under bump metallization (UBM)  Intermetallic compound  (IMC)  Reliability  High temperature storage  Temperature cycling  lead-free solders  intermetallic compounds  growth-kinetics  cu  metallization  ag  strength  ball  ubm