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浏览/检索结果: 共49条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择题名升序题名降序提交时间升序提交时间降序作者升序作者降序发表日期升序发表日期降序 A perspective on effect by Ag addition to corrosion evolution of Pb-free Sn solder 期刊论文  OAI收割 MATERIALS LETTERS, 2021, 卷号: 297, 页码: 4 作者:  Qiao, Chuang;  Sun, Xu;  Wang, Youzhi;  Hao, Long;  An, Xizhong   |  收藏  |  浏览/下载：63/0  |  提交时间：2021/10/15 Lead-free solder  Thin films  Oxidation  Corrosion  X-ray photoelectron spectroscopy (XPS)   Improving tensile strength of SnAgCu/Cu solder joint through multi-elements alloying 期刊论文  OAI收割 MATERIALS TODAY COMMUNICATIONS, 2021, 卷号: 29 作者:  Zhu, Tangkui;  Zhang, Qingke;  Bai, Hailong;  Zhao, Lingyan;  Yan, Jikang   |  收藏  |  浏览/下载：22/0  |  提交时间：2021/12/01 LEAD-FREE SOLDER  NI  BEHAVIOR  CU  SB  AG  MICROSTRUCTURE  (CU  BI  CO   Synthesis of Sn nanowire by template electrodeposition and its conversion into Sn nanosolder 期刊论文  OAI收割 MATERIALS CHARACTERIZATION, 2020, 卷号: 163, 页码: 9 作者:  Meng, Zhi-Chao;  Gao, Li-Yin;  Liu, Zhi-Quan   |  收藏  |  浏览/下载：19/0  |  提交时间：2021/02/02 Sn nanowire  Template electrodeposition  Microstructural characterization  Liquid bath melting  Lead-free solder  Melting point   Synthesis of Sn nanowire by template electrodeposition and its conversion into Sn nanosolder 期刊论文  OAI收割 MATERIALS CHARACTERIZATION, 2020, 卷号: 163, 页码: 9 作者:  Meng, Zhi-Chao;  Gao, Li-Yin;  Liu, Zhi-Quan   |  收藏  |  浏览/下载：15/0  |  提交时间：2021/02/02 Sn nanowire  Template electrodeposition  Microstructural characterization  Liquid bath melting  Lead-free solder  Melting point   Reliability issues of lead-free solder joints in electronic devices 期刊论文  OAI收割 SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 876-901 作者:  Jiang, Nan;  Zhang, Liang;  Liu, Zhi-Quan;  Sun, Lei;  Long, Wei-Min   |  收藏  |  浏览/下载：60/0  |  提交时间：2021/02/02 Lead-free solder  reliability  IMC  crack  failure   Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints 期刊论文  OAI收割 MICROELECTRONICS RELIABILITY, 2017, 卷号: 73, 页码: 69-75 Wang, Mingna; Wang, Jianqiu; Ke, Wei 收藏  |  浏览/下载：53/0  |  提交时间：2017/08/17 Lead-free solder joint  Corrosion  Microstructure  Solidification cracks   Annealing effect on residual stress of Sn-3.0Ag-0.5Cu solder measured by nanoindentation and constitutive experiments 期刊论文  OAI收割 MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2017, 卷号: 696, 页码: 90-95 作者:  Long X;  Wang SB;  Feng YH(冯义辉);  Yao Y;  Keer LM 收藏  |  浏览/下载：24/0  |  提交时间：2017/10/27 Lead-free Solder  Annealing  Residual Stress  Nanoindentation  Constitutive Behaviour   Cooling and Annealing Effect on Indentation Response of Lead-Free Solder 期刊论文  OAI收割 INTERNATIONAL JOURNAL OF APPLIED MECHANICS, 2017, 卷号: 9, 期号: 4, 页码: 10.1142/S1758825117500570 作者:  Long X;  Feng YH(冯义辉);  Yao Y;  Long, X (reprint author), Northwestern Polytech Univ, Sch Mech Civil Engn & Architecture, Xian 710072, Peoples R China. 收藏  |  浏览/下载：18/0  |  提交时间：2017/10/27 Lead-free Solder  Cooling Condition  Annealing  Mechanical Property  Residual Stress   Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder 期刊论文  OAI收割 MATERIALS, 2017, 卷号: 10, 期号: 5, 页码: - Yang, Fan; Zhang, Liang; Liu, Zhi-quan; Zhong, Su Juan; Ma, Jia; Bao, Li 收藏  |  浏览/下载：35/0  |  提交时间：2017/08/17 Sn-58Bi solder  lead-free solder  microstructure   Growth behavior of intermetallic compounds at Sn-Ag/Cu joint interfaces revealed by 3D imaging 期刊论文  OAI收割 JOURNAL OF ALLOYS AND COMPOUNDS, 2015, 卷号: 646, 页码: 405-411 Zhang, Q. K.; Long, W. M.; Zhang, Z. F. 收藏  |  浏览/下载：26/0  |  提交时间：2016/04/21 Lead-free solder  Intermetallic compounds  3D imaging  Thermal aging  Grain boundary