机构

• 金属研究所 [13]
• 自动化研究所 [3]
• 上海微系统与信息技术... [1]

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• OAI收割 [17]

内容类型

• 期刊论文 [17]

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• 2021 [3]
• 2019 [2]
• 2018 [1]
• 2017 [1]
• 2016 [1]
• 2015 [1]
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• Chemistry,... [1]
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筛选

浏览/检索结果: 共17条，第1-10条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择题名升序题名降序提交时间升序提交时间降序作者升序作者降序发表日期升序发表日期降序 BV-Net: Bin-based Vector-predicted Network for tubular solder joint detection 期刊论文  OAI收割 MEASUREMENT, 2021, 卷号: 183, 页码: 8 作者:  Zhou, Chenlin;  Shen, Xiaofei;  Wang, Peng;  Wei, Wei;  Sun, Jia   |  收藏  |  浏览/下载：58/0  |  提交时间：2021/11/04 Object detection  Defect detection  Quality inspection  Tubular solder joint detection  Deep learning   Theoretical and experimental investigations on mechanical properties of (Fe,Ni)Sn2 intermetallic compounds formed in SnAgCu/Fe-Ni solder joints 期刊论文  OAI收割 MATERIALS CHARACTERIZATION, 2021, 卷号: 178, 页码: 8 作者:  Gao, Li-Yin;  Luo, Yi-Xiu;  Wan, Peng;  Liu, Zhi-Quan   |  收藏  |  浏览/下载：229/0  |  提交时间：2021/10/15 Solder joint  Intermetallic compound  Mechanical property  Nano-indentation  First principle calculation   ACR-Net: Attention Integrated and Cross-Spatial Feature Fused Rotation Network for Tubular Solder Joint Detection 期刊论文  OAI收割 IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, 2021, 卷号: 70, 页码: 12 作者:  Zhou, Chenlin;  Li, Daheng;  Wang, Peng;  Sun, Jia;  Huang, Yikun   |  收藏  |  浏览/下载：30/0  |  提交时间：2021/11/03 Deep learning  defect detection  object detection  tubular solder joint detection   Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文  OAI收割 MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18 作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua   |  收藏  |  浏览/下载：26/0  |  提交时间：2021/02/02 62Sn36Pb2Ag solder joint  Microstructural evolution  Failure analysis  Intermetallic compound (IMC)  Thermal cycling   Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文  OAI收割 MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18 作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua   |  收藏  |  浏览/下载：20/0  |  提交时间：2021/02/02 62Sn36Pb2Ag solder joint  Microstructural evolution  Failure analysis  Intermetallic compound (IMC)  Thermal cycling   The interfacial reaction between In-48Sn solder and polycrystalline Cu substrate during solid state aging 期刊论文  OAI收割 JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 740, 页码: 500-509 作者:  Tian, FF;  Li, CF;  Zhou, M;  Liu, ZQ;  Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.   |  收藏  |  浏览/下载：24/0  |  提交时间：2018/06/05 Heterogeneous Binary-systems  Chemical-compound Layers  2 Elementary Substances  Eutectic Snin Solder  Intermetallic Compounds  Phase Identification  Reaction-diffusion  Growth-kinetics  Joint  Transformations   Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints 期刊论文  OAI收割 MICROELECTRONICS RELIABILITY, 2017, 卷号: 73, 页码: 69-75 Wang, Mingna; Wang, Jianqiu; Ke, Wei 收藏  |  浏览/下载：54/0  |  提交时间：2017/08/17 Lead-free solder joint  Corrosion  Microstructure  Solidification cracks   Compressive sensing for noisy solder joint imagery based on convex optimization 期刊论文  OAI收割 SOLDERING & SURFACE MOUNT TECHNOLOGY, 2016, 卷号: 28, 期号: 2, 页码: 114-122 作者:  Zhao, Huihuang;  Chen, Jianzhen;  Xu, Shibiao;  Wang, Ying;  Qiao, Zhijun   |  收藏  |  浏览/下载：32/0  |  提交时间：2016/10/20 Noisy Solder Joint Imagery  Compressive Sensing (Cs)  Convex Optimization  Gradient-based Method  Orthogonal Matching Pursuit  Greedy Basis Pursuit  Subspace Pursuit And Compressive Sampling Matching Pursuit  Iterative Re-weighted Least Squares   Growth Behavior of Intermetallic Compounds in Cu/Sn3.0Ag0.5Cu Solder Joints with Different Rates of Cooling 期刊论文  OAI收割 Journal of Electronic Materials, 2015, 卷号: 44, 期号: 1, 页码: 590-596 L. M.; Zhang Yang, Z. F. 收藏  |  浏览/下载：27/0  |  提交时间：2015/05/08 Intermetallic compounds (IMC)  solder joint  cooling rate  solidification  adsorption  ag-cu solder  cu6sn5 grains  in-situ  sn  alloy  nanoparticles  ag3sn  microstructure  technology  particles   Phase identification on the intermetallic compound formed between eutectic SnIn solder and single crystalline Cu substrate 期刊论文  OAI收割 Journal of Alloys and Compounds, 2014, 卷号: 591, 页码: 351-355 F. F. Tian; Z. Q. Liu; P. J. Shang; J. D. Guo 收藏  |  浏览/下载：29/0  |  提交时间：2014/04/18 Phase identification  Interface  IMC  Eutectic SnIn solder  Single  crystalline Cu  gamma-angular correlations  lead-free solders  joint reliability  growth-kinetics  system  equilibria  mechanisms  interfaces  diffusion  layer