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	The effects of temperature and humidity on the growth of tin whisker and hillock from Sn5Nd alloy 期刊论文 OAI收割 Journal of Alloys and Compounds, 2013, 卷号: 550, 页码: 231-238 C. F. Li; Z. Q. Liu; J. K. Shang 收藏 \| 浏览/下载：21/0 \| 提交时间：2013/12/24 Tin whisker Hillock NdSn3 Oxidation Growth mechanism lead-free solder electron-microscopy nd addition sn-whiskers joints mechanisms
	Tin Whisker Growth on NdSn3 Powder 期刊论文 OAI收割 JOURNAL OF ELECTRONIC MATERIALS, 2011, 卷号: 40, 期号: 9, 页码: 1962-1966 作者: Shi, Hong-Chang; Xian, Ai-Ping \| 收藏 \| 浏览/下载：18/0 \| 提交时间：2021/02/02 Tin whiskers rare earth intermetallic compounds Sn NdSn3
	Tin Whisker Growth on NdSn(3) Powder 期刊论文 OAI收割 Journal of Electronic Materials, 2011, 卷号: 40, 期号: 9, 页码: 1962-1966 H. C. Shi; A. P. Xian 收藏 \| 浏览/下载：28/0 \| 提交时间：2012/04/13 Tin whiskers rare earth intermetallic compounds Sn NdSn(3) pb-free solders mechanism
	TEM observation of tin whisker 期刊论文 OAI收割 Science China-Technological Sciences, 2011, 卷号: 54, 期号: 6, 页码: 1546-1550 M. Liu; A. P. Xian 收藏 \| 浏览/下载：19/0 \| 提交时间：2012/04/13 tin whiskers transmission electron microscope electron-microscopy growth
	In situ investigation on the oxidation behavior of a RESn(3) film by transmission electron microscopy 期刊论文 OAI收割 Scripta Materialia, 2011, 卷号: 65, 期号: 12, 页码: 1049-1052 C. F. Li; Z. Q. Liu; P. J. Shang; J. K. Shang 收藏 \| 浏览/下载：16/0 \| 提交时间：2012/04/13 RESn(3) compounds Oxidation Thermodynamics Transmission electron microscopy (TEM) pb-free solders whisker growth tin whiskers surface joints alloys
	Spontaneous growth of whiskers on RE-bearing intermetallic compounds of Sn-RE, In-RE, and Pb-RE 期刊论文 OAI收割 Journal of Alloys and Compounds, 2009, 卷号: 486, 期号: 1-2, 页码: 590-596 M. Liu; A. P. Xian 收藏 \| 浏览/下载：21/0 \| 提交时间：2012/04/13 Sn In Pb Whiskers RE-intermetallic compounds tin whiskers films zinc