机构

• 半导体研究所 [2]
• 长春光学精密机械与物... [1]
• 上海微系统与信息技术... [1]

采集方式

• iSwitch采集 [2]
• OAI收割 [2]

内容类型

• 期刊论文 [3]
• 会议论文 [1]

发表日期

• 2012 [1]
• 2006 [1]
• 2005 [1]
• 2004 [1]

学科主题

• Engineerin... [1]

筛选

浏览/检索结果: 共4条，第1-4条 帮助 条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择题名升序题名降序提交时间升序提交时间降序作者升序作者降序发表日期升序发表日期降序 Uncooled Thermoelectric Infrared Sensor With Advanced Micromachining 期刊论文  OAI收割 IEEE SENSORS JOURNAL, 2012, 卷号: 12, 期号: 6, 页码: - Xu, DH; Xiong, B; Wu, GQ; Ma, YL; Wang, YL 收藏  |  浏览/下载：22/0  |  提交时间：2013/04/23 Advanced micromachining  microelectromechanical systems (MEMS)  thermoelectric  uncooled infrared sensor  wet silicon etching  XeF2 silicon etching   Novel folding 8x8 silicon-based optical matrix switch with tapered waveguides and self-aligned corner mirrors 期刊论文  iSwitch采集 Journal of lightwave technology, 2006, 卷号: 24, 期号: 12, 页码: 5008-5012 作者:  Li, Zhiyong;  Yu, Jinzhong;  Chen, Shaowu;  Liu, Jingwei 收藏  |  浏览/下载：25/0  |  提交时间：2019/05/12 Corner reflection mirror  Optical switch matrix  Silicon on insulator (soi)  Wet chemical etching   Integrated folding 4x4 optical matrix switch with total internal reflection mirrors on soi by anisotropic chemical etching 期刊论文  iSwitch采集 Ieee photonics technology letters, 2005, 卷号: 17, 期号: 6, 页码: 1187-1189 作者:  Liu, JW;  Yu, JZ;  Chen, SW;  Li, ZY 收藏  |  浏览/下载：26/0  |  提交时间：2019/05/12 Optical switch  Silicon-on-insulator (soi)  Total internal reflection (tir) mirror  Wet chemical etching   Study on optical parts of MOEMS optical switch with low insertion loss (EI CONFERENCE) 会议论文  OAI收割 MEMS/MOEMS Technologies and Applications II, November 10, 2004 - November 12, 2004, Beijing, China 作者:  Wang W.;  Wang L.;  Wang L.;  Wang L.;  Chen W. 收藏  |  浏览/下载：32/0  |  提交时间：2013/03/25 We study insertion losses of optical switch when the laser beam is propagating during the free space between two single mode fibers (SMFs) and the related assemblage challenges  Then a new packaging structure is developed for the hybrid-integration of free-space MOEMS (micro-opto-electro-mechanical systems) chip with a silicon micromachined submount to improve alignment accuracy. The submount is designed to accommodate various free-space MOEMS chips with minimal active optical alignment  thus reducing the packaging cost. The silicon submount has a central recess to place the MOEMS chip in  sixteen V-grooves for optical fibers  and micropits for micro ball lenses  all bulk micromachined at the same time by a single anisotropic wet etching step. A corner compensation technique is employed to prevent erosion of the convex corners  where different geometries meet. Through this assembling method  the fiber  micro ball lens can be aligned preciously thus reduced lateral and angular misalignment between them. Then total insertion losses can be decreased.