机构

• 深圳先进技术研究院 [11]

采集方式

• OAI收割 [11]

内容类型

• 会议论文 [11]

发表日期

• 2016 [6]
• 2015 [2]
• 2013 [2]
• 2012 [1]

学科主题

筛选

浏览/检索结果: 共11条，第1-10条 帮助 限定条件 内容类型：会议论文     条数/页： 5101520253035404550556065707580859095100 排序方式： 请选择提交时间升序提交时间降序题名升序题名降序作者升序作者降序发表日期升序发表日期降序 NOVEL PERIODIC MESOPOROUS ORGANOSILICA THIN FILM WITH LOW DIELECTRIC CONSTANT AND HIGH MECHANICAL PROPERTY 会议论文  OAI收割 China Semiconductor Technology International Conference 2016, CSTIC 2016, Shanghai, China 作者:  Jiawei Zhang;  Guoping Zhang;  Rong Sun;  S. W. Ricky Lee;  C. P. Wong 收藏  |  浏览/下载：15/0  |  提交时间：2017/01/15 A Self-Healing Electronic Sensor Based On Infrared Laser 会议论文  OAI收割 The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China 作者:  Shuwen Wu;  Guoping Zhang;  Rong Sun;  C. P. Wong 收藏  |  浏览/下载：16/0  |  提交时间：2017/01/15 Three-Dimensional Graphene foam for Highly Sensitive Pressure Sensors 会议论文  OAI收割 China Semiconductor Technology International Conference 2016, CSTIC 2016, Shanghai, China 作者:  Jinhui Li;  Guoping Zhang;  Rong Sun;  C. P. Wong 收藏  |  浏览/下载：13/0  |  提交时间：2017/01/15 Novel low-κ ADH-based periodic mesoporous organosilica thin film for interlayer dielectric 会议论文  OAI收割 The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China 作者:  Jiawei Zhang;  Guoping Zhang;  Rong Sun;  S. W. Ricky Lee;  C. P. Wong 收藏  |  浏览/下载：13/0  |  提交时间：2017/01/15 Fabricating Photosensitive Polymer Insulation Layer by Spin-coating for Through Silicon Vias 会议论文  OAI收割 The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China 作者:  Qiang Liu;  Guoping Zhang;  Rong Sun;  S. W. Ricky Lee;  C. P. Wong 收藏  |  浏览/下载：21/0  |  提交时间：2017/01/15 Stretchable Conductors Based on In-Situ Polymerizde Poly(3,4-Ethylenedioxythiophene) and Three Dimensional Structure Design 会议论文  OAI收割 China Semiconductor Technology International Conference 2016, CSTIC 2016, Shanghai, China 作者:  Wangping Huang;  Songfang Zhao;  Guoping Zhang;  Rong Sun;  C. P. Wong 收藏  |  浏览/下载：10/0  |  提交时间：2017/01/15 Electroless plating alloy thin-film embedded resistor materials 会议论文  OAI收割 The 16th International Conference on electronic packing Technology (ICEPT 2015), Changsha,China 作者:  Xingsong Su;  Lifei Lai;  Chang Li;  Wenjun Liu;  Xian-Zhu Fu 收藏  |  浏览/下载：11/0  |  提交时间：2016/01/27 Preparation of Reversible Thermosets and Their Application in Temporary Adhesive for Thin Wafer Handling 会议论文  OAI收割 Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th, San Diego, California, USA 作者:  Libo. Deng;  Haoming. Fang;  Xingtian. Shuai;  Guoping. Zhang;  C. P. Wong and Rong 收藏  |  浏览/下载：18/0  |  提交时间：2016/01/27 Effect of wetting agent on the properties of thermal grease with Al based fillers 会议论文  OAI收割 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, Dalian, China 作者:  Zhang Ling;  Zhang Zhi;  Zhu Pengli;  Zhang Kai;  Fu Xianzhu 收藏  |  浏览/下载：4/0  |  提交时间：2015/08/27 Ag modified carbon nanotubes as filler for thermal interface materials 会议论文  OAI收割 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, Dalian, China 作者:  Zhang Zhi;  Zeng Xiaoliang;  Zhang Ling;  Zhu Pengli;  Zhang Kai 收藏  |  浏览/下载：8/0  |  提交时间：2015/08/27